The AMD XC2S200-6FGG486C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This powerful programmable logic device delivers exceptional digital signal processing capabilities with 200,000 system gates, making it an ideal solution for industrial automation, telecommunications, and embedded system applications.
Key Features of the XC2S200-6FGG486C FPGA
The XC2S200-6FGG486C combines advanced 0.18-micron CMOS technology with a streamlined Virtex-based architecture to deliver outstanding performance at a competitive price point. This Xilinx FPGA device offers unlimited reprogrammability, enabling design upgrades in the field without hardware replacement.
Core Specifications
| Parameter |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Package Type |
486-Ball Fine-Pitch BGA (FGG486) |
| Speed Grade |
-6 (Higher Performance) |
| Operating Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
Advanced Memory Architecture
The XC2S200-6FGG486C features a hierarchical SelectRAM+ memory system that provides flexible on-chip storage options for demanding applications.
Distributed RAM Capabilities
The device includes 75,264 bits of distributed RAM implemented through 16-bit Look-Up Tables (LUTs). Each LUT can function as a 16×1-bit synchronous RAM, with two LUTs combinable to create 16×2-bit, 32×1-bit synchronous RAM, or 16×1-bit dual-port configurations.
Block RAM Resources
With 14 dedicated block RAM modules totaling 56 Kbits, the XC2S200-6FGG486C provides substantial on-chip memory for data buffering, FIFO implementations, and high-speed data processing applications. Each block RAM cell offers fully synchronous dual-port 4,096-bit RAM with independent control signals.
High-Speed Clock Management
The XC2S200-6FGG486C incorporates four fully digital Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide zero propagation delay, minimal clock skew, and advanced clock domain control.
DLL Features Include
The clock management system supports clock frequencies up to 200 MHz with duty cycle correction. The DLL can provide multiple clock phases including 0°, 90°, 180°, and 270° outputs. Clock multiplication (2×) and division (up to 16×) capabilities enable flexible timing solutions for complex system designs.
Versatile I/O Interface Standards
The XC2S200-6FGG486C supports 16 high-performance I/O standards organized across eight independent I/O banks. This multi-standard capability ensures seamless integration with diverse system architectures.
Supported I/O Standards
The device provides native support for LVTTL (2-24mA drive strength), LVCMOS2 (2.5V), PCI (3V/5V, 33/66 MHz), GTL and GTL+, HSTL Class I/III/IV, SSTL2 and SSTL3 Class I/II, CTT, and AGP-2X interfaces. Each output buffer can source up to 24mA and sink up to 48mA with programmable slew rate control.
Configurable Logic Block Architecture
The CLB architecture provides the computational foundation for implementing complex digital designs efficiently.
Logic Cell Organization
Each CLB contains four Logic Cells organized in two identical slices. Every Logic Cell includes a 4-input function generator (LUT), dedicated carry logic, and a configurable storage element that can operate as an edge-triggered D-type flip-flop or level-sensitive latch.
Arithmetic Optimization
Dedicated carry logic enables high-speed arithmetic operations with efficient multiplier support. The cascade chain architecture facilitates wide-input function implementation while minimizing routing delays.
Package and Thermal Specifications
The FGG486 package provides a compact 486-ball Fine-Pitch Ball Grid Array configuration optimized for high-density PCB layouts.
Mechanical Characteristics
The lead-free (Pb-free) FGG486 package option ensures RoHS compliance for environmentally conscious designs. The commercial temperature grade (-6 speed) operates reliably from 0°C to +85°C junction temperature.
Configuration and Programming Options
The XC2S200-6FGG486C supports multiple configuration modes for flexible system integration.
Available Configuration Methods
Configuration can be performed via Master Serial mode using external PROM, Slave Serial mode for microprocessor-controlled loading, Slave Parallel mode for high-speed byte-wide programming (up to 66 MHz CCLK), and Boundary Scan (IEEE 1149.1 JTAG) for in-system programming and testing.
Configuration File Requirements
The device requires approximately 1,335,840 bits of configuration data, compatible with standard PROM devices or processor-based configuration schemes.
Application Areas
The XC2S200-6FGG486C FPGA excels in numerous demanding applications across multiple industries.
Industrial Applications
The device serves industrial automation controllers, motor drive systems, PLC implementations, and real-time control applications requiring deterministic timing and high I/O density.
Communications Infrastructure
Telecommunications equipment including routers, switches, base station controllers, and protocol converters benefit from the high-speed signal processing and flexible interface capabilities.
Embedded Computing Solutions
Data acquisition systems, medical instrumentation, video processing equipment, and automotive electronics leverage the programmable architecture for custom functionality requirements.
Development Tool Support
The XC2S200-6FGG486C is fully supported by comprehensive FPGA development software for efficient design implementation.
Software Compatibility
The device works with ISE Design Suite for complete synthesis, implementation, and verification workflows. Third-party synthesis tools from major EDA vendors provide alternative design entry options with EDIF netlist generation.
Why Choose the XC2S200-6FGG486C
The XC2S200-6FGG486C represents an excellent balance of performance, functionality, and cost-effectiveness for medium-complexity FPGA applications.
Key Advantages
The -6 speed grade delivers higher performance compared to standard -5 grade devices, enabling faster clock frequencies and reduced propagation delays. The unlimited reprogrammability eliminates NRE costs associated with ASIC development while enabling field upgrades and rapid prototyping cycles.
Design Flexibility
With 284 user I/O pins, 56 Kbits of block RAM, and 75,264 bits of distributed RAM, the device provides ample resources for implementing complex digital systems including multi-channel data processing, high-speed interfaces, and custom peripheral controllers.
Ordering Information
The XC2S200-6FGG486C follows AMD (formerly Xilinx) standard ordering nomenclature where XC2S200 indicates the Spartan-II 200K device, -6 specifies the higher performance speed grade, FGG486 denotes the 486-ball lead-free fine-pitch BGA package, and C indicates commercial temperature range operation.
Technical Documentation
Complete specifications including pinout tables, DC characteristics, switching parameters, and application notes are available in the official Spartan-II FPGA Family Data Sheet (DS001). Contact authorized AMD distributors for current pricing, availability, and volume discount programs.
