Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG474C Spartan-II FPGA: Complete Technical Guide

Product Details

The AMD XC2S200-6FGG474C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This 200,000 system gate device delivers exceptional programmable logic capabilities in a compact 474-pin Fine Pitch Ball Grid Array package, making it an ideal solution for telecommunications, industrial automation, and embedded system applications.

XC2S200-6FGG474C Key Features and Specifications

The XC2S200-6FGG474C combines advanced 0.18-micron semiconductor technology with Xilinx’s proven Virtex-based architecture. This Xilinx FPGA offers unlimited reprogrammability, allowing engineers to implement design upgrades without hardware replacement.

Core Architecture Specifications

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (14 blocks)
Core Voltage 2.5V
Speed Grade -6 (Higher Performance)
Package Type FGG474 (Fine Pitch BGA)
Temperature Range Commercial (0°C to +85°C)

XC2S200-6FGG474C Block RAM Configuration

The device features 14 dedicated block RAM modules, each providing 4,096 bits of fully synchronous dual-ported memory. Engineers can configure these blocks with flexible aspect ratios to match specific application requirements.

Configuration Memory Depth Address Bus Data Bus
Narrow Mode 4096 ADDR[11:0] DATA[0]
Standard Mode 512 ADDR[8:0] DATA[7:0]
Wide Mode 256 ADDR[7:0] DATA[15:0]

Advanced Clock Management Features

Delay-Locked Loop Technology

The XC2S200-6FGG474C incorporates four fully digital Delay-Locked Loops positioned at each corner of the die. These DLLs eliminate clock distribution delay and provide advanced clock domain control essential for high-speed digital designs.

DLL Capabilities

  • Zero propagation delay clock distribution
  • Four quadrature phase outputs (0°, 90°, 180°, 270°)
  • Clock doubling functionality
  • Clock division ratios: 1.5, 2, 2.5, 3, 4, 5, 8, and 16
  • Board-level clock deskewing through clock mirroring

Global Clock Network Architecture

Four dedicated global clock networks ensure minimal clock skew across the entire device. Each global clock net can drive all CLB, IOB, and block RAM clock pins simultaneously.

Versatile I/O Interface Standards

The XC2S200-6FGG474C supports 16 high-performance I/O interface standards, enabling seamless integration with various system components and memory interfaces.

Supported I/O Standards

Standard Reference Voltage (VREF) Output Voltage (VCCO) Termination (VTT)
LVTTL N/A 3.3V N/A
LVCMOS2 N/A 2.5V N/A
PCI (3.3V/5V) N/A 3.3V N/A
GTL 0.8V N/A 1.2V
GTL+ 1.0V N/A 1.5V
HSTL Class I 0.75V 1.5V 0.75V
HSTL Class III/IV 0.9V 1.5V 1.5V
SSTL3 Class I/II 1.5V 3.3V 1.5V
SSTL2 Class I/II 1.25V 2.5V 1.25V
AGP-2X 1.32V 3.3V N/A

I/O Banking Structure

Eight independent I/O banks allow mixing of compatible voltage standards within the same design. Each bank features multiple VCCO pins supporting flexible interface configurations.

XC2S200-6FGG474C Configuration Options

Multiple Configuration Modes

Mode Data Width CCLK Direction Serial DOUT
Master Serial 1-bit Output Yes
Slave Serial 1-bit Input Yes
Slave Parallel 8-bit Input No
Boundary Scan 1-bit N/A No

Configuration Memory Requirements

The XC2S200-6FGG474C requires 1,335,840 bits of configuration data. Compatible Xilinx Platform Flash PROMs provide reliable nonvolatile configuration storage.

Configurable Logic Block Architecture

Logic Cell Components

Each of the 5,292 logic cells contains a 4-input look-up table (LUT) functioning as a flexible function generator. Additional features include dedicated carry logic for high-speed arithmetic operations and storage elements configurable as D-type flip-flops or level-sensitive latches.

Distributed Memory Implementation

Look-up tables can operate as 16×1-bit synchronous RAM. Two LUTs within a slice combine to create 16×2-bit, 32×1-bit synchronous RAM, or 16×1-bit dual-port synchronous RAM configurations.

XC2S200-6FGG474C Application Areas

Industrial and Commercial Applications

  • Telecommunications infrastructure equipment
  • Wireless communication base stations
  • Industrial automation and motor control systems
  • Medical diagnostic and imaging equipment
  • Video processing and display controllers
  • Automotive infotainment systems
  • Security and surveillance systems
  • Test and measurement instrumentation

Development System Support

The XC2S200-6FGG474C receives full support from Xilinx development tools including Foundation ISE Series and Alliance Series software environments. The unified library contains over 400 primitives and macros for rapid design implementation.

Ordering Information and Part Numbering

Part Number Breakdown: XC2S200-6FGG474C

Code Description
XC2S200 Device type (200K system gates)
-6 Speed grade (higher performance)
FG Package type (Fine Pitch BGA)
G Pb-free packaging option
474 Pin count
C Commercial temperature range

IEEE 1149.1 Boundary Scan Compliance

The XC2S200-6FGG474C includes full IEEE 1149.1-compatible boundary scan logic supporting EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. The Test Access Port enables in-system programming and design verification through JTAG interface.

Design Resources and Documentation

Engineers designing with the XC2S200-6FGG474C can access comprehensive documentation including detailed datasheets, application notes, and reference designs. The Spartan-II FPGA Family Data Sheet (DS001) provides complete electrical specifications, timing parameters, and pinout information.

Why Choose the XC2S200-6FGG474C

The AMD XC2S200-6FGG474C Spartan-II FPGA offers an optimal balance of logic density, I/O flexibility, and cost-effectiveness. Its proven reliability, comprehensive tool support, and versatile configuration options make it suitable for both prototyping and high-volume production applications requiring programmable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.