The AMD XC2S200-6FGG470C is a high-performance Field Programmable Gate Array (FPGA) from the proven Spartan-II family. This cost-effective Xilinx FPGA delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, medical devices, and embedded control systems.

Designed with 0.18µm six-layer metal CMOS technology, the XC2S200-6FGG470C offers engineers a superior alternative to mask-programmed ASICs. The device eliminates lengthy development cycles while providing in-field programmability for design upgrades without hardware replacement.

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XC2S200-6FGG470C Key Specifications

The Spartan-II XC2S200-6FGG470C integrates advanced features that enable complex digital implementations across diverse applications.

Logic Resources and System Gates

Memory Architecture

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XC2S200-6FGG470C Package and Electrical Characteristics

FGG470 Package Details

The FGG470 designation indicates a Fine Pitch Ball Grid Array (FBGA) package with 470 balls. This Pb-free (lead-free) package variant features the “G” suffix for RoHS compliance. The compact BGA form factor optimizes PCB space while ensuring reliable solder connections for high-volume manufacturing.

Speed Grade and Operating Conditions

The -6 speed grade represents the fastest performance tier in the Spartan-II family, exclusively available in the commercial temperature range. This ensures optimal performance for high-speed digital applications requiring maximum clock frequencies.

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Spartan-II FPGA Architecture Features

Configurable Logic Block (CLB) Structure

Each CLB in the XC2S200-6FGG470C contains four logic cells organized in two slices. The architecture delivers:

• Two 4-input Look-Up Tables (LUTs) per slice
• Dedicated carry logic for arithmetic operations
• Wide-function multiplexers for efficient logic implementation
• Dual flip-flops with independent control signals

Delay-Locked Loop (DLL) Clock Management

The XC2S200-6FGG470C integrates four Delay-Locked Loops positioned at each corner of the die. These DLLs provide:

• Clock deskewing for reduced clock-to-output delays
• Clock multiplication and division (up to 4× and down to 1.5×, 2×, 4×, 8×, or 16×)
• Phase shifting in 90° increments
• Board-level clock deskewing when used as clock mirror
• Frequency synthesis from 25 MHz to 320 MHz output range

Block RAM Architecture

Two columns of dedicated block RAM flank the CLB array. Each block RAM module provides 4,096 bits organized as 256×16, 512×8, 1024×4, 2048×2, or 4096×1 configurations. Key features include:

• Dual-port operation with independent read/write ports
• Synchronous operation at system clock speeds
• Cascadable for larger memory implementations
• Support for FIFO and ROM implementations

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I/O Standards and Interface Support

16 Selectable I/O Standards

The XC2S200-6FGG470C Input/Output Blocks (IOBs) support comprehensive interface flexibility:

I/O Bank Organization

The 284 user I/O pins are organized into eight I/O banks. Each bank supports:

• Independent VCCO voltage selection
• Multiple I/O standards per bank (same VCCO)
• Hot-swap compliance capability
• Programmable output drive strength
• Selectable slew rate control

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Configuration and Programming Options

Configuration Modes

Configuration Features

• Express mode for rapid reconfiguration
• Partial reconfiguration support
• Configuration readback capability
• JTAG IEEE 1149.1 boundary scan compliance
• Internal oscillator frequencies from 4 MHz to 60 MHz
• Configuration bitstream size: 1,335,840 bits

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XC2S200-6FGG470C Applications

Telecommunications and Networking

The XC2S200-6FGG470C excels in communication protocol implementation, enabling:

• Network routers and switches
• Protocol converters and bridges
• Data transmission equipment
• Wireless baseband processing
• SDH/SONET framing

Industrial Automation and Control

For factory automation environments, this FPGA supports:

• Motor control and servo drives
• Process control systems
• Programmable logic controller (PLC) implementations
• Machine vision preprocessing
• Real-time data acquisition

Medical and Scientific Equipment

Healthcare applications benefit from the device’s reliability:

• Medical imaging systems
• Patient monitoring devices
• Diagnostic equipment
• Laboratory instrumentation
• Ultrasound signal processing

Consumer Electronics and Security

The cost-effective architecture enables:

• Video processing systems
• Surveillance and security cameras
• Biometric identification systems
• Access control implementations
• Set-top box designs

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Design Resources and Development Tools

Xilinx ISE Design Suite

The XC2S200-6FGG470C is fully supported by the Xilinx ISE Design Suite, providing:

• Schematic and HDL-based design entry
• Synthesis and implementation tools
• Timing analysis and constraint management
• Simulation and verification capabilities
• Bitstream generation and programming

Configuration PROMs

Compatible configuration storage devices include:

• XC18V04: 4Mbit serial PROM
• XC18V02: 2Mbit serial PROM
• XC18V01: 1Mbit serial PROM

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Ordering Information Decoder

The part number XC2S200-6FGG470C decodes as follows:

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Why Choose the XC2S200-6FGG470C FPGA

The AMD XC2S200-6FGG470C delivers compelling advantages for digital design projects:

• Cost-Effective Performance: 200,000 system gates at competitive pricing
• Fastest Speed Grade: -6 designation ensures maximum clock frequencies up to 263 MHz
• Flexible I/O: 284 user pins supporting 16 industry-standard interfaces
• Abundant Memory: 131K total RAM bits for data buffering and processing
• RoHS Compliant: Lead-free packaging meets environmental regulations
• Proven Architecture: Spartan-II platform with mature, reliable silicon
• In-Field Updates: Reprogrammable logic enables design modifications without hardware changes

The Spartan-II XC2S200-6FGG470C represents a mature, well-documented FPGA solution ideal for volume production applications requiring proven reliability and comprehensive ecosystem support.