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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD C2S200-6FGG661C Spartan-II FPGA: Complete Technical Guide and Specifications

Product Details

The AMD C2S200-6FGG661C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional flexibility, robust processing capabilities, and cost-effective solutions for complex digital system designs. Engineers and developers worldwide rely on this FPGA for telecommunications, industrial automation, and embedded system applications.

Key Features of the AMD C2S200-6FGG661C FPGA

The C2S200-6FGG661C combines advanced semiconductor technology with a versatile architecture to meet demanding application requirements. This device offers superior performance characteristics that make it an ideal choice for high-volume production environments.

System Gate Capacity and Logic Resources

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284

The C2S200-6FGG661C provides 200,000 system gates and 5,292 logic cells, enabling implementation of complex integrated digital circuits on a single chip. The Configurable Logic Block (CLB) array is arranged in a 28 x 42 configuration, offering 1,176 total CLBs for flexible and scalable digital circuit design.

Memory Configuration and Block RAM

Memory Type Capacity
Distributed RAM Bits 75,264
Block RAM Bits 56K (57,344)
Block RAM Blocks 14

The device features 75,264 bits of distributed RAM and 56K bits of dedicated block RAM organized in 14 memory blocks. Each block RAM cell provides fully synchronous dual-ported 4096-bit RAM with independent control signals for each port, supporting configurable data widths for built-in flexibility.

Technical Specifications and Electrical Characteristics

Operating Parameters

Parameter Specification
Core Voltage (VCCINT) 2.5V
Supply Voltage Range 2.375V ~ 2.625V
Operating Temperature 0°C to +85°C (Commercial)
Speed Grade -6
Process Technology 0.18μm CMOS
Maximum Frequency 263 MHz

The C2S200-6FGG661C operates with a 2.5V core voltage and supports supply voltage ranges from 2.375V to 2.625V. The -6 speed grade designation indicates optimized performance for commercial temperature range applications, supporting system clock rates up to 263 MHz.

Package Information

Attribute Detail
Package Type FGG661 (Fine-Pitch Ball Grid Array)
Pin Count 661
Mounting Type Surface Mount
RoHS Status Compliant

The FGG661 package provides excellent signal integrity and thermal performance. The “G” designation in the part number indicates Pb-free (lead-free) packaging options, ensuring RoHS compliance for environmentally responsible manufacturing.

Architecture Overview of the Spartan-II FPGA Family

Configurable Logic Blocks (CLBs)

The C2S200-6FGG661C features a programmable and flexible architecture built around Configurable Logic Blocks. Each CLB contains four logic cells (LCs), with each logic cell consisting of a 4-input function generator (Look-Up Table), a storage element, and carry logic. The CLBs provide:

  • Four direct feedthrough paths per CLB
  • Function generators configurable as 4-input LUTs
  • Dual-port distributed RAM capability
  • 16-bit shift register mode for data capture applications

Input/Output Blocks (IOBs)

The IOB architecture supports multiple I/O signaling standards for seamless integration with various system components:

I/O Standard Description
LVTTL Low-Voltage TTL
LVCMOS Low-Voltage CMOS (2.5V, 3.3V)
GTL/GTL+ Gunning Transceiver Logic
PCI PCI Bus Compatible (3.3V)
SSTL Stub Series Terminated Logic

The device organizes I/O pins into eight banks, each with dedicated VCCO and VREF pins for supporting mixed-voltage interfaces. LVTTL, LVCMOS2, and PCI standards are 5V tolerant, providing robust input protection.

Delay-Locked Loop (DLL) Technology

The C2S200-6FGG661C incorporates four dedicated on-chip Delay-Locked Loops positioned at each corner of the die. These DLLs provide:

  • Zero propagation delay clock distribution
  • Low clock skew between output signals
  • Clock multiplication and division capabilities
  • Board-level clock deskewing between multiple devices
  • Phase shifting for advanced timing control

Each DLL can drive up to two global clock routing networks, minimizing clock skew due to loading differences across the device.

Application Areas for the C2S200-6FGG661C

Telecommunications and Networking

The C2S200-6FGG661C excels in telecommunications infrastructure applications including:

  • SONET network equipment
  • Switches and routers
  • HDLC protocol controllers
  • Frame relay systems
  • ISDN voice, video, and data transmission
  • High-bandwidth Internet edge routers

Industrial Automation and Control

This Xilinx FPGA delivers reliable performance for industrial applications:

  • Process control systems
  • Motor drive controllers
  • Factory automation equipment
  • Programmable logic controllers (PLCs)
  • Sensor interface and data acquisition

Embedded Systems Development

Engineers select the C2S200-6FGG661C for embedded applications requiring:

  • Digital signal processing (DSP)
  • Protocol bridging and conversion
  • Custom interface development
  • Real-time control logic
  • Data buffering and FIFO implementation

Advantages Over Traditional ASIC Solutions

The C2S200-6FGG661C provides compelling advantages compared to mask-programmed ASICs:

Benefit Description
Lower Initial Cost Eliminates expensive ASIC development and tooling costs
Faster Time-to-Market Reduces product development cycles significantly
Field Upgradability Enables design modifications without hardware replacement
Risk Reduction Avoids inherent risks of conventional ASIC development
Flexibility Supports rapid prototyping and design iterations

The programmability of the C2S200-6FGG661C permits design upgrades in deployed systems, an impossible feat with traditional ASICs.

Configuration and Programming Options

Configuration Modes

The device supports multiple configuration methods for flexible system integration:

Mode Description
Master Serial Internal oscillator generates configuration clock
Slave Serial External clock source drives configuration
Slave Parallel Parallel data loading for faster configuration
Boundary Scan JTAG-based configuration and testing

Configuration data is stored in internal static memory cells, enabling unlimited reprogramming cycles. The device supports configuration from serial PROMs, parallel flash, or processor-based loading.

Boundary Scan Support

Full IEEE 1149.1 JTAG boundary scan support provides:

  • In-system programming capability
  • Board-level interconnect testing
  • Internal signal observation
  • Configuration data readback

Design Tool Compatibility

The C2S200-6FGG661C is fully supported by industry-standard development tools:

  • Xilinx ISE Design Suite for synthesis and implementation
  • VHDL and Verilog HDL support
  • Schematic capture design entry
  • Comprehensive simulation and verification tools
  • ChipScope Pro for real-time debugging

Part Number Decoding

Understanding the C2S200-6FGG661C part number:

Segment Meaning
C2S200 Spartan-II device with 200K system gates
-6 Speed grade (commercial temperature)
FG Fine-pitch Ball Grid Array package
G Pb-free (lead-free) packaging
661 Pin count
C Commercial temperature range (0°C to +85°C)

Quality and Compliance Standards

The AMD C2S200-6FGG661C meets stringent quality and environmental standards:

  • RoHS (Restriction of Hazardous Substances) compliant
  • REACH regulation compliance
  • Standard export classification (ECCN EAR99)
  • ISO quality manufacturing processes

Conclusion

The AMD C2S200-6FGG661C Spartan-II FPGA delivers an exceptional combination of logic density, memory resources, and I/O flexibility for demanding digital design applications. With 200,000 system gates, 5,292 logic cells, and comprehensive on-chip features including DLLs and block RAM, this device provides cost-effective programmable logic solutions for telecommunications, industrial automation, and embedded system applications.

Whether developing new products or maintaining legacy systems, the C2S200-6FGG661C offers proven reliability, field upgradeability, and superior performance that engineers have trusted for mission-critical applications across diverse industries.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.