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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC1736EPDG8I Configuration PROM: Complete Technical Guide & Specifications

Product Details

Overview of XC1736EPDG8I FPGA Configuration Memory

The XC1736EPDG8I is a specialized configuration PROM (Programmable Read-Only Memory) manufactured by AMD Xilinx, designed specifically for storing configuration bitstreams for Xilinx FPGA devices. This one-time programmable memory solution provides a reliable and efficient method for configuring FPGA designs in embedded systems, industrial automation, and advanced digital electronics applications.

Key Features and Benefits

Primary Specifications

The XC1736EPDG8I configuration memory delivers robust performance characteristics that make it ideal for mission-critical FPGA applications:

  • Memory Capacity: 36 Kbit (35.44K-bit) storage for configuration data
  • Programming Type: One-Time Programmable (OTP) for permanent configuration storage
  • Operating Voltage: 4.5V to 5.5V supply voltage range
  • Temperature Range: Industrial-grade -40°C to +85°C operation
  • Package Type: 8-Pin PDIP (Plastic Dual In-Line Package)
  • Package Dimensions: 0.300″ (7.62mm) standard DIP width

Advanced Technical Features

This configuration PROM incorporates several sophisticated features that simplify FPGA system design:

  • Simple serial interface requiring only one user I/O pin on the target FPGA
  • Cascadable architecture for storing longer or multiple configuration bitstreams
  • Programmable reset polarity (active-high or active-low) for design flexibility
  • Automatic FPGA configuration sequence management
  • Low power consumption during operation and standby modes

Technical Specifications Table

Specification Value
Manufacturer AMD Xilinx (formerly Xilinx Inc.)
Part Number XC1736EPDG8I
Product Category Memory – Configuration PROMs for FPGAs
Memory Size 36 Kbit (4.5 KB)
Memory Type Serial Configuration PROM
Programming One-Time Programmable (OTP)
Supply Voltage 4.5V ~ 5.5V
Operating Temperature -40°C ~ +85°C (Industrial)
Package Type 8-PDIP (Plastic Dual In-Line)
Package Width 0.300″ (7.62mm)
Interface Type Serial
Number of Pins 8
Mounting Type Through-Hole
RoHS Compliant Yes

Pin Configuration and Interface

Pin Assignments

Pin Number Pin Name Function
1 CE Chip Enable (Active Low)
2 CLK Clock Input
3 DATA Serial Data Output
4 GND Ground Reference
5 RESET Reset Input (Programmable Polarity)
6 OE Output Enable (Active Low)
7-8 VCC Power Supply (+5V)

Application Information

Typical FPGA Configuration Applications

The XC1736EPDG8I configuration PROM is optimized for use with various Xilinx FPGA families including:

  • XC4000 Series FPGAs: Legacy configuration support for proven designs
  • Spartan FPGA Families: Cost-effective embedded system implementations
  • Industrial Control Systems: Reliable configuration storage for automation equipment
  • Communication Equipment: Network infrastructure and telecommunications hardware
  • Medical Devices: Configuration storage for FDA-regulated medical electronics
  • Aerospace Systems: Space-qualified variants available for critical applications

Configuration Process

The configuration sequence operates through a simple serial interface:

  1. FPGA asserts INIT signal upon power-up or reset
  2. Configuration PROM responds to clock pulses from FPGA
  3. Bitstream data transfers serially to FPGA CCLK pin
  4. FPGA completes configuration and enters user mode
  5. PROM enters low-power standby state

Design Considerations

System Integration Guidelines

When implementing the XC1736EPDG8I in your FPGA design, consider these important factors:

Power Supply Decoupling: Place 0.1µF ceramic capacitors close to VCC pins for noise suppression and stable operation.

PCB Layout: Minimize trace lengths between PROM and FPGA to reduce EMI susceptibility and improve signal integrity.

Pull-up Resistors: The DATA output is typically tri-state and may require a pull-up resistor (4.7kΩ to 10kΩ) depending on FPGA family requirements.

Reset Circuit: Implement proper power-on reset timing to ensure reliable configuration initiation.

Ordering and Availability

Package Marking and Identification

The XC1736EPDG8I features clear top marking for easy identification:

  • Line 1: Xilinx logo and part number (XC1736E)
  • Line 2: Speed grade and package code (PD8I)
  • Line 3: Manufacturing date code and lot traceability

Storage and Handling

Proper storage and handling procedures extend component life and reliability:

  • Store in anti-static packaging at room temperature (15°C to 30°C)
  • Maintain relative humidity between 30% and 70%
  • Avoid direct sunlight and corrosive atmospheres
  • Use ESD-safe handling procedures during assembly
  • Shelf life: 12 months from manufacture date when properly stored

Programming Requirements

PROM Programming Equipment

The XC1736EPDG8I requires specialized programming equipment for bitstream loading:

  • Xilinx-compatible PROM programmers
  • Supported by legacy Xilinx ISE Design Suite
  • Third-party universal programmers with Xilinx PROM support
  • In-circuit programming capabilities available with appropriate hardware

Programming Verification

After programming, verify bitstream integrity through:

  • Blank check before programming
  • Device ID verification
  • Complete bitstream readback verification
  • Checksum validation against original design file

Comparison with Alternative Solutions

XC1736EPDG8I vs Modern Configuration Methods

Feature XC1736EPDG8I PROM SPI Flash Embedded Flash
Reprogrammability OTP (One-Time) Multiple cycles Multiple cycles
Volatility Non-volatile Non-volatile Non-volatile
Cost Low Medium Included in FPGA
Density 36 Kbit Up to Gbits Varies by device
Interface Serial (proprietary) SPI/Quad-SPI Internal
Security Physical OTP Software protect Hardware encryption
Legacy Support Excellent Good Device-specific

Quality and Reliability

Manufacturing Standards

AMD Xilinx manufactures the XC1736EPDG8I to rigorous quality standards:

  • ISO 9001 certified manufacturing facilities
  • JEDEC compliant packaging and testing
  • RoHS directive compliance for environmental responsibility
  • Automotive-grade variants available (contact manufacturer)
  • Extended temperature variants for harsh environments

Reliability Metrics

Proven reliability characteristics include:

  • MTBF (Mean Time Between Failures): >1,000,000 hours at 25°C
  • Data retention: >20 years at operating temperatures
  • ESD protection: HBM Class 1C (≥1000V)
  • Latch-up immunity: >100mA per JEDEC standard

Frequently Asked Questions

Can the XC1736EPDG8I be reprogrammed?

No, the XC1736EPDG8I is an OTP device, meaning it can only be programmed once. For applications requiring field updates, consider SPI Flash or Platform Flash alternatives.

What FPGA families are compatible with this configuration PROM?

The XC1736EPDG8I is primarily designed for legacy Xilinx FPGA families including XC4000, Spartan, and early Virtex devices. Newer FPGAs typically use SPI Flash configuration.

What is the programming time for the XC1736EPDG8I?

Programming time varies by programmer hardware but typically ranges from 30 seconds to 2 minutes for the complete 36 Kbit bitstream.

Can multiple PROMs be cascaded for larger designs?

Yes, the XC1736EPDG8I supports cascading through its serial interface, allowing multiple devices to store longer bitstreams or multiple FPGA configurations.

Environmental and Regulatory Compliance

The XC1736EPDG8I meets international environmental and safety standards:

  • RoHS Compliant: Restriction of Hazardous Substances directive compliance
  • REACH: Registration, Evaluation, Authorization of Chemicals compliance
  • Conflict Minerals: Sourced from conflict-free suppliers
  • WEEE: Waste Electrical and Electronic Equipment directive compliant

Conclusion

The XC1736EPDG8I configuration PROM from AMD Xilinx represents a proven, reliable solution for FPGA configuration storage in legacy systems and new designs requiring OTP security. With its industrial temperature range, simple serial interface, and robust reliability characteristics, this device continues to serve critical applications across aerospace, industrial, medical, and telecommunications markets. While newer FPGA families have transitioned to SPI Flash configuration methods, the XC1736EPDG8I remains an essential component for maintaining and upgrading existing FPGA-based systems.

For applications requiring permanent configuration storage, design security, or compatibility with legacy Xilinx FPGA platforms, the XC1736EPDG8I provides an economical and proven solution backed by decades of field deployment and AMD Xilinx’s industry-leading support network.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.