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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU28DR-1FFVG1517I: Xilinx Zynq UltraScale+ RFSoC for Advanced RF Applications

Product Details

The XCZU28DR-1FFVG1517I is a high-performance RF System-on-Chip (RFSoC) from Xilinx’s Zynq UltraScale+ family. This advanced device integrates RF data converters, programmable logic, and a powerful processing system into a single chip. Engineers designing software-defined radios, 5G wireless infrastructure, and radar systems rely on this component for exceptional signal processing performance.


Key Features of the XCZU28DR-1FFVG1517I RFSoC

The XCZU28DR-1FFVG1517I combines multiple high-speed RF-ADCs and RF-DACs with a quad-core Arm Cortex-A53 processor. This integration eliminates the need for external data converter chips. As a result, designers can reduce board space, lower power consumption, and simplify system architecture.

This Xilinx FPGA device belongs to the Gen 1 RFSoC family. It supports direct RF sampling up to 4 GHz input frequency. The industrial temperature grade (-40°C to +100°C) makes it suitable for demanding environments.


XCZU28DR-1FFVG1517I Technical Specifications

RF Data Converter Specifications

Parameter Specification
RF-ADC Channels 8 channels
RF-ADC Resolution 12-bit
RF-ADC Sample Rate Up to 4.096 GSPS
RF-DAC Channels 8 channels
RF-DAC Resolution 14-bit
RF-DAC Sample Rate Up to 6.554 GSPS
Maximum RF Input Frequency 4 GHz
DDC per RF-ADC 1
Decimation/Interpolation 1x, 2x, 4x, 8x

Processing System Specifications

Component Details
Application Processing Unit (APU) Quad-core Arm Cortex-A53 @ 1.3 GHz
Real-Time Processing Unit (RPU) Dual-core Arm Cortex-R5F @ 600 MHz
L1 Cache (APU) 32KB instruction + 32KB data per core
L2 Cache (APU) 1 MB shared with ECC
On-Chip Memory 256 KB with ECC
Floating Point Support Single and double precision

Programmable Logic Resources

Resource Quantity
System Logic Cells 930,300
CLB Flip-Flops 850,560
CLB LUTs 425,280
Block RAM 38.0 Mb (1,080 blocks)
UltraRAM 22.5 Mb (80 blocks)
DSP Slices 4,272
Distributed RAM 13.0 Mb

High-Speed Connectivity

Interface Specification
GTY Transceivers 16 channels
GTY Data Rate Up to 28.21 Gb/s
PS-GTR Transceivers 4 channels
PCIe Support Gen3 x16 (2 blocks)
100G Ethernet 2 blocks with RS-FEC
150G Interlaken 1 block

Package and Environmental Specifications

Parameter Value
Package Type FFVG1517 (Flip-chip BGA)
Package Dimensions 40 mm × 40 mm
Ball Pitch 1.0 mm
Total Pins 1517
High-Performance I/O (HP) 299
High-Density I/O (HD) 48
Speed Grade -1 (Standard)
Temperature Grade Industrial (-40°C to +100°C)
VCCINT Operating Voltage 0.85V

Soft Decision Forward Error Correction (SD-FEC)

The XCZU28DR-1FFVG1517I includes 8 SD-FEC blocks for advanced error correction. These blocks support both LDPC and Turbo decoding modes.

SD-FEC Capabilities

Feature Specification
SD-FEC Blocks 8
LDPC Decode/Encode Yes
Turbo Decode Yes
Supported Standards 5G NR, LTE, DOCSIS 3.1
Maximum Iterations 1-63 (configurable per codeword)
Code Configuration Up to 128 codes

The LDPC encoder and decoder enable high-throughput error correction for 5G wireless and backhaul applications. Meanwhile, Turbo decoding supports legacy LTE systems. This flexibility allows a single platform to address multiple wireless standards.


Applications for XCZU28DR-1FFVG1517I

The XCZU28DR-1FFVG1517I excels in applications requiring direct RF sampling and high-performance signal processing.

Primary Applications

  • 5G Wireless Infrastructure: Massive MIMO base stations and small cells
  • Software-Defined Radio (SDR): Multi-band, multi-mode radio platforms
  • Radar and Electronic Warfare: Phased array systems and signal intelligence
  • Test and Measurement: High-speed data acquisition systems
  • Cable Infrastructure: DOCSIS 3.1 remote PHY devices
  • Satellite Communications: Ground station equipment

Why Choose This RFSoC?

The integration of RF converters with programmable logic reduces the component count significantly. Traditional designs require separate ADC chips, DAC chips, and FPGA devices. This RFSoC combines all these functions on a single die. Therefore, engineers achieve lower latency, reduced power consumption, and smaller form factors.


Memory Interface Support

The XCZU28DR-1FFVG1517I provides comprehensive memory interface options for demanding applications.

Supported Memory Standards

Memory Type Maximum Data Rate
DDR4 2400 Mb/s
DDR3/DDR3L Supported
LPDDR4 32-bit bus width
LPDDR3 Supported
Maximum DRAM Capacity 32 GB

The dynamic memory controller supports 64-bit bus width with optional ECC protection. This ensures data integrity in mission-critical applications.


I/O Peripheral Integration

The processing system includes extensive peripheral connectivity options.

Available Peripherals

Peripheral Quantity/Details
Gigabit Ethernet MAC 4 (Triple-speed 10/100/1000 Mb/s)
USB 3.0 Controllers 2
USB 2.0 Controllers 2
SD/SDIO 3.0 Controllers 2
UART 2
SPI 2
I2C 2
CAN 2.0B 2
GPIO Up to 174 bits (78 MIO + 96 EMIO)

These peripherals enable system integration without additional interface chips. The MIO (Multiplexed I/O) pins provide flexible pin assignment for optimal board layout.


Security Features

The XCZU28DR-1FFVG1517I includes robust security capabilities for protecting intellectual property and ensuring secure boot.

Security Capabilities

Feature Description
AES-GCM Encryption 256-bit hardware accelerator
SHA-3/384 Secure hash algorithm support
RSA Authentication 4096-bit for secure boot
Secure Boot Hardware-enforced boot chain
eFUSE One-time programmable memory

The Configuration Security Unit (CSU) manages all cryptographic operations. It supports both secure and non-secure boot modes depending on system requirements.


Part Number Breakdown: XCZU28DR-1FFVG1517I

Understanding the part number helps specify the correct device for your application.

Code Meaning
XC Xilinx Commercial
ZU Zynq UltraScale+
28 Device density index
D Quad APU + Dual RPU
R RF Signal Engine
-1 Speed grade (standard)
FF Flip-chip package
V RoHS 6/6 compliant
G Package designator
1517 Pin count
I Industrial temperature grade

Development Tools and Support

Xilinx provides comprehensive development tools for the XCZU28DR-1FFVG1517I.

Available Tools

  • Vivado Design Suite: Hardware design and implementation
  • Vitis Software Platform: Embedded software development
  • PetaLinux Tools: Linux BSP generation
  • RFSoC Evaluation Kits: Hardware prototyping platforms

The tools include reference designs for common applications like digital radio and MIMO systems. These accelerate development time significantly.


Ordering Information Summary

Part Number Description
XCZU28DR-1FFVG1517I Industrial temp, -1 speed grade, FFVG1517 package
XCZU28DR-2FFVG1517I Industrial temp, -2 speed grade, FFVG1517 package
XCZU28DR-1FFVG1517E Extended temp, -1 speed grade, FFVG1517 package
XCZU28DR-2FFVG1517E Extended temp, -2 speed grade, FFVG1517 package

Conclusion

The XCZU28DR-1FFVG1517I delivers exceptional performance for RF signal processing applications. Its integrated RF-ADCs, RF-DACs, and programmable logic simplify system design. The quad-core Arm processor handles complex algorithms while the FPGA fabric provides hardware acceleration. This combination makes the XCZU28DR-1FFVG1517I an ideal choice for next-generation wireless infrastructure, defense systems, and advanced instrumentation.

For more information about this and other RFSoC devices, explore our complete selection of programmable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.