The XCZU21DR-2FFVD1156I is a high-performance System-on-Chip (SoC) FPGA from AMD Xilinx’s Zynq UltraScale+ RFSoC family. This advanced programmable device integrates a powerful processing system with UltraScale architecture programmable logic and direct RF-sampling data converters, making it ideal for software-defined radio (SDR), 5G wireless infrastructure, and cable infrastructure applications.
XCZU21DR-2FFVD1156I Key Features and Benefits
The XCZU21DR-2FFVD1156I delivers exceptional performance by combining a feature-rich 64-bit quad-core Arm Cortex-A53 application processing unit with a dual-core Arm Cortex-R5F real-time processing unit. This heterogeneous computing architecture enables designers to implement complete RF systems on a single chip, reducing board space and power consumption by up to 50-75% compared to multi-chip solutions.
This Xilinx FPGA device is manufactured using advanced 16nm FinFET technology, delivering the highest performance in the -2 speed grade while maintaining industrial temperature operation from -40°C to +100°C.
XCZU21DR-2FFVD1156I Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD Xilinx |
| Part Number |
XCZU21DR-2FFVD1156I |
| Family |
Zynq UltraScale+ RFSoC |
| System Logic Cells |
930,300 |
| Process Technology |
16nm FinFET |
| Speed Grade |
-2 (Highest Performance) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1156 Balls |
| Core Voltage (VCCINT) |
0.85V |
| Operating Frequency |
Up to 775 MHz |
| RoHS Status |
Compliant |
XCZU21DR-2FFVD1156I Programmable Logic Resources
| Resource |
Quantity |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| DSP Slices (27×18 Multipliers) |
3,168 |
| Block RAM (36Kb) |
684 Blocks |
| Total Block RAM |
24.0 Mb |
| UltraRAM (288Kb) |
80 Blocks |
| Total UltraRAM |
22.5 Mb |
| Distributed RAM |
6.6 Mb |
XCZU21DR-2FFVD1156I Processing System Specifications
Application Processing Unit (APU)
| Feature |
Details |
| Processor Cores |
Quad-core Arm Cortex-A53 MPCore |
| Architecture |
64-bit ARMv8 |
| Debug Support |
CoreSight |
| Extensions |
NEON SIMD, Single/Double Precision Floating Point |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB Shared |
Real-Time Processing Unit (RPU)
| Feature |
Details |
| Processor Cores |
Dual-core Arm Cortex-R5F |
| Architecture |
32-bit |
| Debug Support |
CoreSight |
| Extensions |
Single/Double Precision Floating Point |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| Memory |
Tightly Coupled Memory (TCM) |
XCZU21DR-2FFVD1156I RF Data Converter Subsystem
The XCZU21DR-2FFVD1156I features an integrated RF data converter subsystem optimized for RF-DAC applications. The device supports multiple channels of high-speed RF-DACs with Digital Up Converters (DUCs) including programmable interpolation, decimation, NCO, and complex mixer functionality.
| RF Converter Feature |
Specification |
| RF-DAC Channels |
Up to 16 Channels |
| RF-DAC Resolution |
14-bit |
| RF-DAC Max Sample Rate |
Up to 10 GSPS |
| Analog Bandwidth |
Up to 6 GHz |
| DUC Features |
Programmable Interpolation, Decimation, NCO, Complex Mixer |
| Multi-Band Support |
Yes (Dual-band operation) |
XCZU21DR-2FFVD1156I Connectivity and I/O
High-Speed Serial Connectivity
| Interface |
Specification |
| GTY Transceivers |
16 Channels |
| GTY Data Rate |
Up to 28.21 Gb/s |
| PCIe Support |
Gen3 x16 |
| 150G Interlaken |
Supported |
| 100G Ethernet with RS-FEC |
Supported |
General Purpose I/O
| I/O Type |
Count |
| PS MIO Pins |
214 |
| HD (High Density) I/O |
72 |
| HP (High Performance) I/O |
208 |
| PS-GTR Transceivers |
4 |
XCZU21DR-2FFVD1156I Memory Interface Support
The XCZU21DR-2FFVD1156I supports a comprehensive range of external memory interfaces for high-bandwidth data storage and processing:
| Memory Type |
Support |
| DDR4 |
Yes |
| DDR3/DDR3L |
Yes |
| LPDDR4 |
Yes |
| LPDDR3 |
Yes |
| Quad-SPI Flash |
Yes |
| NAND Flash |
Yes |
| eMMC |
Yes |
| On-Chip Memory with ECC |
256KB |
XCZU21DR-2FFVD1156I Security Features
| Security Feature |
Description |
| Secure Boot |
256-bit AES-GCM Encryption |
| Authentication |
SHA-384 |
| Configuration Security Unit (CSU) |
Hardware-based secure boot |
| Post-Boot Encryption |
User-accessible cryptographic engines |
| eFUSE |
One-time programmable secure storage |
| BBRAM |
Battery-backed key storage |
XCZU21DR-2FFVD1156I Soft-Decision Forward Error Correction (SD-FEC)
The device includes highly flexible soft-decision FEC blocks for advanced error correction in wireless and wired communications:
| SD-FEC Feature |
Support |
| LDPC Decode/Encode |
Yes |
| Turbo Decode |
Yes |
| 5G NR Support |
Yes |
| LTE Support |
Yes |
| DOCSIS Support |
Yes |
| Backhaul Applications |
Yes |
| Throughput |
>1 Gb/s |
XCZU21DR-2FFVD1156I Package Information
| Package Parameter |
Value |
| Package Code |
FFVD1156 |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Ball Count |
1156 |
| Package Dimensions |
35mm × 35mm |
| Ball Pitch |
1.0mm |
| Lead-Free |
Yes (RoHS Compliant) |
XCZU21DR-2FFVD1156I Part Number Decoder
Understanding the XCZU21DR-2FFVD1156I part number structure:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU21 |
Zynq UltraScale+ Device Size (21) |
| DR |
RFSoC with RF Data Converters |
| -2 |
Speed Grade (-2 = Highest Performance) |
| FF |
Flip-Chip Package |
| V |
Pb-free (Lead-Free/RoHS) |
| D |
Device Variant |
| 1156 |
Pin Count |
| I |
Industrial Temperature Range |
XCZU21DR-2FFVD1156I Target Applications
The XCZU21DR-2FFVD1156I is optimized for demanding applications requiring high-performance RF signal processing and heterogeneous computing:
- 5G Wireless Infrastructure – Massive MIMO base stations, small cells, and remote radio heads
- Software-Defined Radio (SDR) – Complete RF-to-baseband processing on a single chip
- Cable Infrastructure (DOCSIS) – Remote PHY nodes and distributed access architectures
- Phased Array Radar – Multi-function military and aerospace radar systems
- Test and Measurement – High-speed signal generators and spectrum analyzers
- Electronic Warfare – Wideband signal processing and threat detection
- Satellite Communications – Ground station transceivers and payload processing
XCZU21DR-2FFVD1156I Development Tools
| Tool |
Description |
| Vivado Design Suite |
Complete FPGA development environment |
| Vitis Unified Platform |
Embedded software and acceleration development |
| PetaLinux Tools |
Linux-based embedded development |
| System Generator for DSP |
MATLAB/Simulink integration |
| Model Composer |
AI/ML model deployment |
Why Choose XCZU21DR-2FFVD1156I for Your Design?
The XCZU21DR-2FFVD1156I represents the cutting edge of programmable SoC technology, offering several compelling advantages:
- Single-Chip RF Solution – Eliminates external data converters and reduces BOM cost
- 50-75% Power Reduction – Monolithic integration removes power-hungry JESD204 interfaces
- Industrial Temperature Rating – Reliable operation in harsh environments
- Highest Speed Grade – Maximum performance for demanding real-time applications
- Flexible Architecture – Adaptable platform for evolving standards and requirements
- Comprehensive Security – Hardware-based secure boot and encryption
- Extensive Ecosystem – Proven development tools, reference designs, and documentation
XCZU21DR-2FFVD1156I Ordering Information
| Parameter |
Value |
| Manufacturer Part Number |
XCZU21DR-2FFVD1156I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Status |
Active |
| Packaging |
Tray |
| Export Classification |
Check with supplier |
The XCZU21DR-2FFVD1156I is part of AMD Xilinx’s comprehensive Zynq UltraScale+ RFSoC portfolio, designed to accelerate time-to-market for next-generation wireless and wired communication systems.
