Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

PCB Stack-up Builder - PCBsync

PCB Stack-up Builder

PCBsync Engineering Tools
Impedance Preview
Layer Stack
4
Copper Layers
1.57
Total (mm)
2
Signal Layers
2
Plane Layers
Cross-Section & Impedance
Trace Parameters for Impedance
Calculated Impedance
Stack-up Notes
Standard 4-layer stack-up with signal-ground-power-signal configuration. Suitable for mixed-signal designs up to 1 GHz. Core thickness: 1.2mm, prepreg thickness: 0.2mm (7628 style).

PCB Stack-up Design Guide

A well-designed PCB stack-up is crucial for signal integrity, EMI control, and manufacturability. The arrangement of signal and plane layers, along with dielectric materials, determines impedance, crosstalk, and power delivery performance. This tool helps visualize and calculate impedance for common configurations.

Microstrip: Z₀ ≈ (87 / √(εᵣ + 1.41)) × ln(5.98h / (0.8w + t))

Stripline: Z₀ ≈ (60 / √εᵣ) × ln(4h / (0.67π × (0.8w + t)))

Where εᵣ is dielectric constant, h is height to reference plane, w is trace width, and t is copper thickness. These approximations are accurate within 5% for typical PCB geometries.

Common Dielectric Materials
  • FR4 Standard — εᵣ = 4.2-4.5, low cost
  • High-Speed FR4 — εᵣ = 3.8-4.0, better Df
  • Rogers 4350B — εᵣ = 3.48, RF/microwave
  • Megtron 6 — εᵣ = 3.4, high-speed digital
Layer Pairing Rules
  • Signal layers should reference solid planes
  • Keep high-speed signals adjacent to GND
  • Avoid routing over plane splits
  • Balance copper symmetrically to prevent warpage
Impedance Targets
  • 50Ω — Single-ended (USB, SPI, general)
  • 90Ω — Differential (USB 2.0/3.0)
  • 100Ω — Differential (Ethernet, LVDS)
  • 85Ω — Differential (HDMI, DisplayPort)
Manufacturing Tolerances
  • Impedance: ±10% standard, ±5% tight
  • Dielectric thickness: ±10%
  • Trace width: ±0.5-1.0 mil
  • Registration: ±2-3 mils layer-to-layer

Design Tip: For controlled impedance, always consult your fabricator's capabilities and request their recommended stack-up. Actual impedance depends on their specific materials and processes. This calculator provides estimates for early design planning.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.