Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

MIL-PRF-55110: Understanding Rigid Military PCB Specifications

As a PCB engineer who has worked with defense contractors for over a decade, I can tell you that navigating military specifications isn’t for the faint of heart. Among the alphabet soup of MIL-specs, MIL-PRF-55110 stands out as the foundational standard for rigid printed wiring boards in defense applications. Whether you’re a design engineer trying to understand qualification requirements or a procurement officer sourcing compliant boards, this guide breaks down everything you need to know about this critical specification.

What is MIL-PRF-55110?

MIL-PRF-55110 is a U.S. Department of Defense (DoD) performance specification that establishes qualification and performance requirements for rigid single-sided, double-sided, and multilayer printed wiring boards (PWBs) with or without plated-through holes. Administered by the Defense Logistics Agency (DLA) Land and Maritime division, this specification ensures that PCBs used in military equipment meet stringent reliability standards.

The specification’s full title is “Printed Wiring Board, Rigid, General Specification For,” and it applies to boards intended for ground support, airborne, and shipboard electronic equipment. The goal? Eliminate high-density hand wiring while enabling compact electronic packaging for mission-critical systems.

Current Status of MIL-PRF-55110

Here’s something that catches many engineers off guard: MIL-PRF-55110 has been marked “Inactive for New Design” since December 31, 1997. For new designs, the DoD directs manufacturers to use MIL-PRF-31032 instead. However—and this is important—the specification remains very much alive for legacy programs.

The current revision is MIL-PRF-55110J with Amendment 1, dated September 25, 2023. The DLA continues to maintain the Qualified Products List (QPL-55110) for manufacturers who support legacy military systems that still reference this specification.

MIL-PRF-55110 Board Types and Classifications

The specification categorizes rigid PCBs into three primary types based on their construction:

TypeDescriptionTypical Applications
Type 1Single-sided printed wiring boardSimple circuits, power distribution
Type 2Double-sided printed wiring boardModerate complexity, through-hole components
Type 3Multilayer printed wiring boardHigh-density designs, complex signal routing

Type 3 qualification extends to cover Type 1 and Type 2 boards automatically. Similarly, Type 2 qualification extends to cover Type 1. This hierarchical structure simplifies the qualification process for manufacturers building diverse product lines.

Base Material Designators

MIL-PRF-55110 references specific base material types identified by designator codes. Understanding these codes is essential when reviewing QPL listings or master drawings:

DesignatorDescription
AFAramid Fabric, Woven, Majority Polyfunctional Epoxy Resin
GHGlass Base, Woven, Majority Polyfunctional Epoxy Resin, Hot Strength Retention, Flame Resistant
GIGlass Base, Woven, Polyimide Resin, Heat Resistant
GMGlass Base, Woven, Triazine and/or Bismaleimide Modified Epoxy Resin, Flame Resistant

Material selection drives thermal performance, dielectric properties, and overall reliability in demanding environments. Your master drawing should specify the appropriate designator based on the application’s environmental requirements.

Understanding the QPL and QML Programs

One of the most confusing aspects of MIL-PRF-55110 involves its dual product assurance pathways. Let me clarify the difference.

Qualified Products List (QPL) Program

The traditional QPL program, detailed in Appendix A of the specification, requires manufacturers to:

  1. Submit qualification test specimens to a government-acceptable laboratory
  2. Undergo verification inspection of production processes
  3. Maintain qualification through periodic requalification (every two years)
  4. Appear on QPL-55110 to supply compliant products

The qualifying activity responsible for QPL-55110 is the Defense Supply Center Columbus (DSCC-VQE). Manufacturers receive a Qualification Reference Number (QRN) with an embedded expiration date in the format “mmddyy.”

Qualified Manufacturers List (QML) Program

Appendix B offers an alternative path through the QML program of MIL-PRF-31032. Here’s where things get interesting for modern manufacturers: if you’re certified to MIL-PRF-31032, you can use your QML-certified Technical Review Board (TRB) approved processes to meet MIL-PRF-55110 requirements.

This “twist” means one certification effectively covers three specifications—MIL-PRF-31032, MIL-PRF-55110 (rigid), and MIL-PRF-50884 (flexible). For the certificate of conformance, you simply state: “Product was manufactured to meet MIL-PRF-55110J Amendment 1, Appendix B, acceptable requirements.”

ProgramApproachExpirationListed On
QPL (Appendix A)Traditional qualification testingYes (2 years)QPL-55110
QPL/QML (Appendix B)MIL-PRF-31032 TRB processesNoQML-31032

Key Technical Requirements in MIL-PRF-55110

Let me walk through the critical technical requirements that separate military-grade boards from commercial products.

Plated-Through Hole Requirements

For Type 2 and Type 3 boards, plated-through holes (PTH) must meet specific criteria:

Annular Ring: The minimum annular ring for functional internal lands on multilayer boards is specified in the master drawing. This is where military specs get significantly tighter than commercial standards—IPC Class 3 requires 0.002″ minimum, while MIL specs often demand larger margins.

Conductor Thickness: When a copper foil weight requirement is specified, MIL-PRF-55110 allows up to 10% reduction below the minimum allowable foil thickness to accommodate chemical or mechanical cleaning processes.

Dielectric Layer Thickness: The minimum separation between conductor layers must meet the master drawing specifications. This directly impacts voltage breakdown and reliability.

Electrical Test Requirements

Electrical testing under MIL-PRF-55110 follows stringent parameters:

ParameterRequirement
ContinuityLess than 10 Ω
IsolationGreater than 2 MΩ (up to 10 MΩ for stringent requirements)
Test VoltageMinimum 40 volts unless otherwise specified

These tests must be performed on every production lot, with additional monthly testing on thermally stressed cross-sections in both X and Y directions.

Inspection and Testing Groups

The specification organizes testing into distinct groups:

In-Process Inspection: Performed during manufacturing to catch defects early.

Group A Inspection: Applied to production boards using C=0 sampling plans, covering visual and dimensional requirements.

Qualification Testing: Performed at a government-acceptable laboratory on qualification test specimens (minimum of six specimens, serialized 1 through 6).

MIL-PRF-55110 vs. MIL-PRF-31032: Key Differences

Engineers often ask me when to use which specification. Here’s my practical guidance:

AspectMIL-PRF-55110MIL-PRF-31032
StatusLegacy (inactive for new design)Current specification
ScopeRigid PCBs onlyAll PCB types (rigid, flex, rigid-flex)
QualificationQPL-based or through 31032QML-based
New ProgramsNot applicableRequired for new designs
Legacy SupportStill maintainedFull support

If you’re starting a new design today, MIL-PRF-31032 is your specification. However, if you’re supporting an existing program with drawings that reference MIL-PRF-55110, you’ll need to maintain compliance with that specification—either through direct QPL certification or through the Appendix B QML pathway.

MIL-PRF-55110 vs. IPC Class 3: Understanding the Relationship

Commercial aerospace and high-reliability applications often reference IPC-6012 Class 3 instead of military specifications. Here’s how they compare:

RequirementMIL-PRF-55110IPC-6012 Class 3
Annular Ring (External)Larger minimum required0.002″ minimum
Copper Thickness After ProcessingNot defined post-processMinimum specified
Solder Coating ThicknessStricter requirementsStandard requirements
Defect Rejection (Measling, Crazing)Strict rejectionMay be accepted
Qualification ProcessDLA-administered QPL/QMLManufacturer-customer agreement
Ongoing AuditsRequired by DLAPer customer requirements

IPC-6013 Class III (C) is accepted by government agencies as a commercial off-the-shelf (COTS) equivalent of MIL-PRF-31032 for flexible boards. This recognition has helped streamline procurement for some programs.

Typical Military PCB Applications

Boards manufactured to MIL-PRF-55110 find their way into demanding applications including:

  • Command and Control Systems
  • Airborne Warning and Control Systems (AWACS)
  • Guidance and Targeting Systems
  • Electronic Warfare Equipment
  • Surveillance and Communication Devices
  • Military Navigation Equipment
  • Power Converters for Missile Systems
  • Radar Systems

These applications share common requirements: operation in extreme temperatures (from arctic to desert conditions), resistance to vibration and mechanical shock, and zero tolerance for field failures.

Environmental and Reliability Considerations

Military PCBs face environments that would destroy commercial boards in hours. MIL-PRF-55110 addresses this through:

Temperature Extremes: Materials must maintain properties from -65°C to +125°C or higher, depending on the specified grade.

Thermal Cycling: Boards undergo repeated thermal stress testing to verify plated-through hole integrity and laminate stability.

Vibration and Shock: Design guidelines recommend low aspect ratios (10:1 or lower), symmetric stackups, and uniform copper distribution to minimize the effects of mechanical stress.

Humidity and Corrosion: Conformal coatings and appropriate surface finishes (ENIG, hard gold) protect against environmental degradation.

Read more about Mil Standards:

Certificate of Conformance Requirements

When delivering compliant boards, your certificate of conformance must include:

  1. Manufacturer’s name and address
  2. Customer’s name and address
  3. Specification reference (MIL-PRF-55110J Amendment 1, Appendix A or B)
  4. Board type and base material designator
  5. Lot identification and traceability information
  6. Statement of compliance

Deviations fall into two categories: additive (tighter requirements or additional tests) and negative (looser requirements or eliminated tests). Additive deviations don’t affect compliance certification; negative deviations do, and must be explicitly approved.

How to Find Qualified Suppliers

The DLA maintains the official QPL-55110 database, which you can access through their Qualified Products Database (QPD). When searching for suppliers, look for:

  • Current qualification status (check expiration dates in the QRN)
  • Material types covered by their qualification
  • Board types qualified (Type 1, 2, or 3)
  • Etchback capability (indicated by asterisk in QRN)
  • QML-31032 cross-qualification (indicated by exclamation mark)

Many qualified suppliers also hold AS9100 certification for aerospace quality management, which provides additional assurance for mission-critical applications.

Useful Resources and Download Links

For engineers and procurement professionals working with MIL-PRF-55110, here are the essential resources:

ResourceDescriptionLink
MIL-PRF-55110J SpecificationOfficial specification documentDLA MilSpec Portal
QPL-55110Qualified Products ListDLA QPD Search
MIL-PRF-31032Current replacement specificationDLA MilSpec Portal
ASSIST DatabaseFull military specification databaseASSIST QuickSearch
IPC-6012Commercial equivalent standardIPC Website

The official specification PDF is available for free download from the DLA portal. Commercial document services also offer copies, typically for a nominal fee.

Frequently Asked Questions About MIL-PRF-55110

Can I still get qualified to MIL-PRF-55110 directly?

No, you cannot obtain new direct QPL certification to MIL-PRF-55110. Since December 1997, new manufacturers must qualify through MIL-PRF-31032 and then use Appendix B of MIL-PRF-55110 to certify products for legacy programs. Existing QPL listings continue to be maintained for manufacturers who held qualification before that date.

My drawing references MIL-P-55110. Is that the same specification?

MIL-P-55110 was the earlier “slash sheet” version that preceded the performance-based MIL-PRF-55110. If your drawing references MIL-P-55110D or earlier, it may predate modern QPL requirements. Contact the design authority to determine if the drawing should be updated to reference the current specification.

What is the difference between QPL and QML certification?

QPL (Qualified Products List) is product-focused—specific products are tested and qualified. QML (Qualified Manufacturers List) is process-focused—a manufacturer’s entire quality management system and processes are qualified, allowing them to produce any product within their certified technology scope. QML offers more flexibility but requires maintaining a Technical Review Board (TRB) and ongoing DLA audits.

Does MIL-PRF-55110 apply to flexible or rigid-flex boards?

No. MIL-PRF-55110 covers rigid boards only. For flexible and rigid-flex printed wiring boards, reference MIL-PRF-50884. The umbrella specification MIL-PRF-31032 covers all board types (rigid, flex, and rigid-flex) and is preferred for new designs.

How often must manufacturers requalify under MIL-PRF-55110?

Under the traditional QPL program (Appendix A), qualifications are validated every two years. The expiration date is embedded in the Qualification Reference Number. Manufacturers using the QML pathway (Appendix B) through MIL-PRF-31032 do not have expiration dates on their 55110 qualification, but must maintain their QML status through ongoing TRB reviews and DLA audits.

Final Thoughts

Working with MIL-PRF-55110 requires understanding both the specification itself and its relationship to the broader military qualification ecosystem. While the specification is technically “inactive for new design,” it remains essential for the vast installed base of military equipment that will be maintained for decades to come.

For new programs, invest the time to get certified to MIL-PRF-31032—it provides coverage for rigid, flexible, and rigid-flex boards under one qualification umbrella. For legacy support, ensure your manufacturer holds current QPL-55110 status or maintains Appendix B compliance through their QML-31032 certification.

The military’s slow pace of change means MIL-PRF-55110 knowledge will remain valuable for years. Take the time to understand the specification thoroughly, and you’ll be prepared to navigate both legacy support and new program requirements with confidence.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.