Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
Metal Core PCB (MCPCB) Manufacturing Process: Step-by-Step Guide
If you have ever specified a metal core PCB and watched the quote come back 30–40% higher than an equivalent FR-4 board, you have probably wondered exactly what is happening inside the factory to justify that difference. The answer is that the metal core PCB manufacturing process is genuinely more demanding — not just in materials, but in tooling, process controls, and quality checkpoints at nearly every stage of fabrication.
This guide walks through each step of the MCPCB manufacturing process in the order a board actually moves through a production floor. Understanding what happens at each stage helps engineers write better specifications, catch DFM issues before they become field failures, and ask the right questions when qualifying a new fabricator. The process applies to aluminum-core PCBs, copper-core boards, and the Bergquist Thermal Clad class of insulated metal substrate materials discussed in our Bergquist PCB reference guide — with notes on where those boards require special handling.
What Makes the Metal Core PCB Manufacturing Process Different from FR-4?
Before walking through the steps, it is worth being clear about what actually separates MCPCB fabrication from standard FR-4 fabrication. The photolithography, etching chemistry, and solder mask processes are largely the same. The meaningful differences cluster around four areas.
First, the base material itself is incompatible with standard FR-4 drilling and routing tooling. Aluminum alloy at 1.0–3.2 mm thickness blunts carbide drill bits rapidly and creates burrs that contaminate hole walls; copper-core boards are even more demanding. Diamond-coated or specialized carbide tooling is required, and feed rates must be tuned for the specific alloy and thickness combination.
Second, via isolation is a process that simply does not exist in FR-4 fabrication. Every via or mounting hole that penetrates the metal substrate must be electrically isolated from the base metal before copper plating. Skip this step and every via becomes a direct short circuit to the baseplate.
Third, lamination of the thermally conductive dielectric layer is a precision step with no analogue in standard PCB production. Voids, bubbles, or inconsistent bond pressure in the dielectric layer create localized thermal resistance — hot spots that the designer never accounted for in their thermal simulation.
Fourth, solder mask application over thick copper traces is a known manufacturing difficulty. When copper traces are 2 oz or 3 oz thick after etching, the height difference between the copper surface and the surrounding dielectric creates a topographical challenge for LPI solder mask — getting complete, void-free coverage requires additional process steps.
Table 1: Metal Core PCB Manufacturing Process vs FR-4 — Key Differences
Process Step
FR-4 PCB
Metal Core PCB
Why Different
Base material prep
Chemical clean only
Clean + oxide removal from metal surface
Aluminum oxidises rapidly; oxide layer degrades dielectric bond
Dielectric lamination
Standard prepreg press
Precision press with thermal dielectric film
Thermal dielectric requires tighter pressure/temp control
HASL thermal shock risks delamination on thin dielectrics
Step 1: Design Review and DFM Check
The metal core PCB manufacturing process starts before any material is cut. Once Gerber files, drill files, and fabrication notes are received, the manufacturer’s CAM engineering team runs a design for manufacturability review specifically against MCPCB constraints.
The critical checks at this stage include confirming that no via is designed to penetrate the metal substrate without isolation clearance, verifying that trace-to-metal clearance meets the dielectric breakdown requirements for the operating voltage, and validating that board outline features — slots, cutouts, internal corners — are achievable with the tooling available for that substrate material and thickness.
For boards using premium dielectric materials like Bergquist HPL or HT grades, the CAM team also confirms that the dielectric thermal conductivity specification is met by the laminate on order, and that the copper weight on the circuit layer is within the etch compensation range for the trace widths specified. When copper foil is 3 oz or thicker, trace width compensation must be designed into the etch artwork; otherwise trace widths will be out of tolerance after etching.
Any DFM findings come back to the designer for resolution before material is cut. This review is not optional in a properly run MCPCB facility — skipping it is the single most common reason for scrapped panels at later stages.
Step 2: Base Metal Preparation
Once the design is released to production, fabrication begins with the metal substrate. A raw aluminum sheet — most commonly aluminum alloy 5052, 6061, or 1100 series, depending on the design spec — is cut to panel size on a shear or CNC punch press. Copper-core panels are handled similarly but require additional care given copper’s higher density and tendency to work-harden.
The cut panel then goes through a cleaning and surface preparation sequence. Oxidation on the aluminum surface is chemically removed using a controlled acid etch or alkaline deox process. This step is critical: any residual oxide layer on the aluminum surface degrades the adhesion between the dielectric and the metal base, creating a weak bond that can delaminate under thermal cycling or mechanical stress in the field.
The cleaned panel surface is inspected for scratches, pits, or surface defects that would create bond voids under the dielectric. An aluminum base membrane — a protective film applied during panel cutting — remains in place through handling until immediately before dielectric lamination to prevent re-oxidation.
Table 2: Common Aluminum Alloys Used as MCPCB Base Material
Alloy
Thermal Conductivity (W/m·K)
Key Properties
Typical Application
1100 series
~222
Highest thermal, softest, easiest to machine
LED lighting, general IMS
5052
~138
Moderate thermal, good corrosion resistance
Automotive, outdoor LED
6061
~167
High strength, moderate thermal
Structural applications, industrial
6063
~201
Good thermal + extrusion formability
Heat sink integration designs
Copper
~385
Best thermal, heaviest, most expensive
High-power inverters, SiC modules
Step 3: Dielectric Lamination
Dielectric lamination is arguably the most technically demanding step in the metal core PCB manufacturing process, and the one where the thermal performance of the finished board is determined. The thermally conductive dielectric film — a ceramic-filled polymer — is bonded to the cleaned metal surface under precisely controlled temperature, pressure, and time.
The lamination press applies uniform pressure across the panel while ramping temperature according to a profile specified by the dielectric material supplier. The cure cycle fuses the dielectric film to the aluminum surface and simultaneously bonds the copper foil on the opposite face. Different dielectric grades have different cure requirements: high-performance materials like Bergquist HPL-03015 (4.1 W/m·K at 38 µm thickness) use thinner films that require tighter process windows than commodity materials.
Voids in the dielectric layer — caused by trapped moisture, surface contamination, inadequate pressure, or incorrect cure temperature — are the most critical defect type in MCPCB fabrication. A void as small as a few square millimetres under a high-power component pad creates a localized thermal resistance island that can cause component failure even when the rest of the board is performing to specification. Quality fabricators perform void inspection on the bonded dielectric using C-SAM (acoustic microscopy) or cross-sectional analysis of process coupons taken from each press cycle.
After lamination, the panel — now consisting of metal base, dielectric, and copper foil — is the raw MCPCB laminate ready for circuit patterning.
Step 4: Circuit Imaging
Circuit imaging transfers the copper trace pattern from the Gerber artwork onto the copper surface of the laminate. The process follows the same photolithographic sequence used in FR-4 PCB fabrication, with a few practical differences driven by the heavy copper weights common in MCPCB designs.
A liquid photoimageable (LPI) dry film photoresist is laminated onto the copper surface at controlled temperature and pressure — typically around 110 °C at 3–5 bar using a heated roller pair. The panel then passes through a UV exposure unit where the circuit artwork (a photomask or direct imaging system) exposes the photoresist to UV light. Exposed areas crosslink and harden; unexposed areas remain soluble.
The panel then moves to the developer, which removes the unexposed photoresist, leaving the circuit pattern protected by hardened photoresist while the areas to be etched are bare copper. At this point, the copper layer under the hardened resist represents the desired circuit traces, pads, and features.
For panels with 2 oz or 3 oz copper specification, the resist thickness must be matched to the copper weight. Insufficient resist thickness relative to copper thickness causes undercut during etching — traces end up narrower than designed, and fine-pitch features may not resolve correctly.
Step 5: Copper Etching
Etching removes the unwanted copper — everything not protected by the photoresist — leaving only the designed circuit pattern. Alkaline ammonium chloride or ferric chloride etchant is the most common chemistry for MCPCB copper etching.
The key challenge specific to MCPCB is the need to protect the exposed aluminum base layer edges and any exposed metal surface during the etch process. The etchant that removes copper will also attack bare aluminum, and any compromise of the aluminum surface during etching — particularly at board edge regions where the dielectric may not fully cover the substrate edge — can create cosmetic or structural defects. Careful masking of the panel edges is standard practice.
For heavy copper designs (2–3 oz), etch factor compensation applied during DFM becomes critical here. Etching is isotropic — it removes copper not just vertically but laterally from the trace sides. Without width compensation in the artwork, 3 oz copper traces end up measurably narrower than designed after etching, potentially creating impedance deviations and current-carrying capacity shortfalls.
After etching, the photoresist is stripped in a separate chemical bath, leaving bare copper traces and pads on the dielectric surface. The panel undergoes automated optical inspection (AOI) at this stage to compare the etched pattern against the original Gerber data, flagging opens, shorts, over-etched features, or trace width violations.
Step 6: Drilling and Via Hole Isolation
Drilling in metal core PCB manufacturing is where the process diverges most sharply from FR-4 fabrication in terms of tooling requirements and added process steps.
Mechanical Drilling
CNC drilling machines create component mounting holes, via holes, and mechanical holes as specified in the drill file. Because the metal substrate dulls standard carbide drill bits within a few hundred hits, MCPCB fabricators use diamond-coated or specialty carbide tooling with adjusted spindle speeds and feed rates for the specific alloy and thickness. Typical spindle speeds run at 50,000–100,000 RPM with feed rates tuned to avoid heat build-up that would fuse aluminum swarf to the hole wall. Panels are typically backed with a sacrificial entry sheet (aluminum) and exit material to control burr formation at hole entry and exit faces.
After drilling, holes are inspected for dimensional accuracy, hole wall roughness, and burr formation. The IPC-6012 standard for MCPCB specifies hole wall roughness requirements and minimum annular ring dimensions that differ from standard FR-4 tolerances.
Via Hole Isolation — The Process Unique to MCPCB
Before any copper can be plated into the drilled holes, the metal substrate layer inside each hole must be electrically isolated. Without isolation, the plated copper via would be electrically connected to the aluminum baseplate — creating a direct short circuit from circuit net to ground plane.
The isolation process fills each via hole with an electrically insulating resin or epoxy, which is then cured and back-drilled or planarized to leave a clean, insulated hole wall. The insulation sleeve effectively creates a non-conductive liner inside the hole in the metal section. The dielectric layer above the metal is then plated as normal.
This step is one of the reasons MCPCB fabrication costs more per hole than FR-4. It adds process time, consumes consumables, and requires inspection — but it is not optional.
Table 3: Drilling Parameters — MCPCB vs FR-4
Parameter
FR-4 (Standard)
Aluminum MCPCB
Copper MCPCB
Drill tooling
Standard carbide
Diamond-coated carbide
Diamond-coated carbide
Typical spindle speed
100–200 k RPM
50–100 k RPM
40–80 k RPM
Via isolation required
No
Yes (resin fill)
Yes (resin fill)
Minimum drill diameter
~0.2 mm
~0.3 mm (0.8 mm typical)
~0.4 mm
Post-drill inspection
AOI
AOI + dimensional check
AOI + dimensional check
Routing tooling
Standard carbide
Diamond-coated saw/router
Diamond saw preferred
Step 7: Copper Plating
After via isolation and hole wall preparation, the drilled holes receive a chemical copper seed layer (electroless copper, approximately 0.5–0.7 µm thick) deposited by chemical reduction. This seed layer provides the conductive base on which electrolytic copper plating can build up.
The panel then undergoes electrolytic copper plating to bring the via hole wall copper to the specified thickness. IPC-6012 Class 2 specification requires a minimum of 20 µm copper in the via barrel wall; Class 3 (automotive, medical) requires 25 µm minimum. The plating bath current density, agitation, and chemistry composition all affect the uniformity of copper deposition — consistent plating thickness across the hole barrel is critical for via reliability under thermal cycling.
For MCPCB designs specified with outer layer copper weights of 2 oz or 3 oz, an additional pattern plating step builds up the copper thickness on pads and traces to the final specified weight.
Step 8: Solder Mask Application
Solder mask application on metal core PCBs follows the same LPI (Liquid Photoimageable) process as FR-4, but requires additional process attention due to the thick copper trace topography common in MCPCB designs.
The process sequence is: surface clean → solder mask coat → pre-bake → UV exposure → develop → final cure. The solder mask is applied by screen printing, curtain coating, or electrostatic spray, with LPI preferred for fine resolution on dense designs.
When copper traces are 2 oz or heavier after etching, the step height between the copper trace surface and the bare dielectric surrounding it can exceed the solder mask film thickness. This creates a shadow effect at the trace edges during UV exposure — the solder mask at the base of the trace side wall receives less UV intensity than the flat areas, resulting in incomplete cure and potential solder mask lifting or peeling at trace edges during thermal cycling.
The standard manufacturing response for thick copper MCPCB designs is to apply two passes of solder mask: a first coat fills the topographic relief, is pre-cured, and then a second full coat is applied and fully exposed. Some fabricators use a resin-fill-first approach where the spaces between traces are filled with a planarizing resin before solder mask application. Both approaches add process steps and cost but are essential for solder mask adhesion reliability.
For LED PCBs, solder mask colour is most commonly white. White solder mask maximises optical reflectance of the LED board surface, which directly contributes to luminous efficacy of the fixture — a white board surface reflects light that would otherwise be absorbed by a standard green or black mask.
Step 9: Surface Finish
The surface finish is applied to all exposed copper pads — the areas where component soldering will occur — to prevent oxidation and ensure reliable solder wetting during assembly.
ENIG (Electroless Nickel Immersion Gold) is the strongly preferred surface finish for metal core PCBs, for reasons that go beyond cosmetics. ENIG deposits a 3–5 µm nickel layer over the copper pad, followed by a 0.05–0.10 µm gold flash. The result is a perfectly flat pad surface that is critical for large thermal pad areas under power packages and LED devices: any topographical variation on a large thermal pad creates standoff variation during reflow, producing partial solder contact and localized thermal resistance — exactly the failure mode the MCPCB was specified to prevent.
HASL (Hot Air Solder Levelling) applies solder by immersing the board in molten solder and levelling with air knives. The thermal shock of HASL processing creates significant risk for thin dielectric IMS boards — the rapid temperature differential between the metal base and the copper circuit layer can generate sufficient stress to partially delaminate thin premium dielectrics. Most MCPCB fabricators and designers specify ENIG for this reason, particularly for boards using sub-100 µm dielectric materials.
OSP (Organic Solderability Preservative) is a viable lower-cost option for less demanding applications, but its shelf life is limited and it does not tolerate multiple reflow cycles as well as ENIG.
Table 4: Surface Finish Options for Metal Core PCB
Surface Finish
Flatness
Thermal Shock Risk
Shelf Life
Cost
Best For MCPCB
ENIG
Excellent (flat)
None
12 months
Medium
LED, power pads, fine pitch
HASL (lead-free)
Poor (uneven)
High risk on thin dielectric
12 months
Low
Not recommended for IMS
OSP
Good
Low
3–6 months
Low
Simple single-reflow designs
Immersion Silver
Good
Low
6 months
Medium
Signal pads, mixed designs
Immersion Tin
Good
Low
6 months
Medium
Connector interfaces
Step 10: Legend / Silkscreen Printing
Legend ink — the component reference designators, polarity marks, and board identification text — is printed onto the solder mask surface using screen printing or inkjet systems. For MCPCB this step is identical to FR-4 processing, with the same minimum font size requirements (typically ≥0.8 mm character height, ≥0.15 mm stroke width after cure) and the same UV cure or thermal cure sequence.
The one practical note for LED boards: white solder mask and white legend ink combination provides very low contrast for silkscreen readability. Most LED MCPCB designs use black silkscreen on white solder mask for this reason. For industrial power boards using black or green solder mask, white legend provides adequate contrast.
Step 11: Board Profiling and Depanelisation
Cutting individual boards from the production panel is the step where MCPCB fabrication most visibly diverges from FR-4 in both tooling and process time.
Standard PCB fabricators use CNC routing with standard carbide end mills at 30,000–60,000 RPM to profile FR-4 boards. These same tools fail rapidly on aluminum — within a few panels — when run at standard FR-4 parameters. Metal core PCB profiling requires diamond-coated routing tools, reduced feed rates, and coolant or air blast to manage chip evacuation.
V-scoring is used for straight-line board separation where boards will be snapped apart later in assembly. V-scoring on aluminum MCPCB requires a scoring blade geometry different from FR-4 scoring; the depth and angle must be calibrated to leave enough metal for handling rigidity while scoring deeply enough to allow clean separation.
Laser depanelling is increasingly specified for precision MCPCB work, particularly for boards with complex outlines or tight dimensional tolerances. CO₂ or fibre laser systems ablate material cleanly without the mechanical forces of routing, eliminating burr formation and reducing edge stress on the dielectric layer at board edges. The trade-off is processing speed — laser profiling is slower than routing for simple rectangular outlines.
Step 12: Electrical Testing and Quality Inspection
Every metal core PCB panel undergoes electrical testing before shipping. The two primary test methods are flying probe and bed-of-nails fixture testing.
Electrical Testing
Flying probe testers use moving probe heads to contact each net at designated test points, verifying continuity (no opens) and isolation (no shorts). For MCPCB this includes verifying that the via isolation is complete — that no via net has electrical continuity to the metal substrate base layer. This test is more involved for MCPCB than FR-4 because the metal base is itself a conductive plane that would show as a short to any un-isolated via.
Hipot (high potential) testing applies a high voltage between the copper circuit layer and the metal base to verify dielectric integrity. The test voltage is typically set at 1,500–3,000 V DC for standard 12–48 V power designs, higher for EV and industrial applications operating at 400–800 V bus. Any dielectric weakness — a void, a thin spot, or contamination — manifests as leakage current or breakdown during hipot test.
Automated Optical Inspection
AOI systems scan the board surface at final inspection using calibrated camera systems comparing the actual board to the Gerber reference data. The final AOI catches pad-level defects: solder mask slivers over pads, legend ink on pads, surface contamination, and mechanical damage from profiling.
Table 5: MCPCB Quality Inspection Checkpoints
Inspection Stage
Method
What It Catches
Post-etch
AOI
Opens, shorts, trace width violations, over-etch
Post-drill
Dimensional check + visual
Hole size, burrs, via isolation completeness
Post-plating
Cross-section coupon
Via barrel plating thickness, bond quality
Post-solder mask
Visual + AOI
Mask coverage on trace edges, pad exposure
Post-surface finish
XRF measurement
ENIG nickel/gold thickness compliance
Final electrical test
Flying probe / hipot
Net continuity, dielectric integrity, via isolation
Metal core PCBs require more careful packaging than FR-4 boards due to the electrical risk of the exposed metal base. Individual boards are vacuum-packed in moisture barrier bags with desiccant for humidity-sensitive dielectric materials. Panels or individual boards are separated by foam or bubble wrap to prevent edge-to-edge contact that would scratch the solder mask or surface finish.
Packaging in moisture barrier bags is particularly important for boards that will be stored before assembly. Premium IMS dielectric materials can absorb ambient moisture if stored unwrapped, which creates a steam-driven delamination risk during the solder reflow profile — the same failure mode as popcorning in moisture-sensitive IC packages.
MCPCB Manufacturing Specifications Reference
When writing a fabrication specification or requesting a quote for metal core PCBs, the following parameters need to be explicitly called out. Leaving any of these to the fabricator’s default risks getting a board that meets standard PCB specs but not the thermal or electrical requirements of your design.
Table 6: Key MCPCB Manufacturing Specifications to Include in Your RFQ
Q1: How long does it take to manufacture a metal core PCB prototype compared to FR-4?
Standard MCPCB prototype lead times typically run 5–10 working days for single-layer aluminum boards and 7–14 days for double-layer or copper-base designs, compared to 3–5 days for equivalent FR-4 prototypes at most contract fabricators. The additional time reflects the via isolation process, specialised tooling setup, and the lower production volume of MCPCB lines relative to FR-4. Some fabricators offer 3–5 day expedite options for single-layer aluminum at a premium. If your design requires a premium dielectric grade like Bergquist HPL-03015 or HT-07006 that is not stocked by the fabricator, add lead time for material procurement — typically 1–2 weeks.
Q2: Can I use a standard FR-4 PCB assembly line to solder components onto MCPCB boards?
Yes, with profile adjustments. Standard SMD pick-and-place equipment handles MCPCB boards without modification — the component placement process is identical. The critical adjustment is the reflow solder profile. The metal base of an MCPCB absorbs significantly more thermal energy during reflow than an FR-4 board of the same area, requiring a slower ramp rate and extended soak zone in the profile to ensure all pads reach liquidus temperature without overheating smaller passive components. Wave soldering is generally not recommended for single-layer MCPCB because the exposed metal base requires masking, and the thermal shock of the solder wave creates delamination risk on thin dielectric boards. Selective soldering or hand soldering for through-hole components is the preferred approach where through-hole parts must be used on a hybrid IMS+FR-4 design.
Q3: Why does my MCPCB fabricator specify ENIG instead of HASL? Is ENIG really necessary?
For most MCPCB applications, ENIG is genuinely necessary rather than just preferred. The core reason is thermal shock risk. HASL processing immerses the board in molten solder at approximately 260 °C, then blasts it with air knives — a rapid thermal cycle that creates differential expansion stress between the aluminum substrate and the thin dielectric layer. For premium IMS materials with dielectric thicknesses of 38–100 µm, this thermal shock regularly causes micro-delamination at the dielectric-metal interface, creating latent thermal resistance issues that do not appear until the board is in service. Beyond the delamination risk, HASL leaves an uneven pad surface — the meniscus of solidified solder varies from pad to pad — which creates standoff variation under large thermal pads. Uneven standoff under a power device or LED package introduces variable solder joint thickness across the pad, creating localized thermal resistance exactly where the board was specified to eliminate it. ENIG costs approximately 15–25% more per panel than HASL but eliminates both failure modes.
Q4: What are the most common quality failures in metal core PCB manufacturing, and how do I guard against them?
The four most common MCPCB defects in order of field impact are: dielectric voids (causing hot spots under power components), incomplete via isolation (causing short circuit from circuit to baseplate), solder mask delamination at thick copper trace edges (causing corrosion and assembly rework), and hipot failure from thin or contaminated dielectric (causing in-circuit leakage). Guarding against all four comes down to fabricator qualification and specification clarity. For fabricator qualification, ask specifically about their void inspection process for the dielectric bond — C-SAM acoustic imaging is the gold standard but cross-section coupon analysis of each press batch is the minimum acceptable approach. For specification clarity, specify the dielectric brand and grade rather than just a thermal conductivity number, call out via isolation explicitly in your fabrication notes, and specify hipot test voltage and acceptance criteria. At incoming inspection, verify ENIG thickness by XRF and perform hipot on a sample of each delivery before committing boards to assembly.
Q5: Is there a minimum order quantity for metal core PCBs, and how does panel utilisation affect cost?
Prototype and small-batch orders are generally available with no minimum order quantity from most specialised MCPCB fabricators, though engineering setup fees of $30–80 are common for quantities below 10–20 pieces. Panel utilisation has a significant impact on unit cost at small quantities: because MCPCB panels are processed as a unit (a single press cycle, a single etch run, a single test pass), a design that occupies 40% of a standard panel costs nearly the same total to process as one that occupies 100% of the same panel. Designing your board to fit efficiently into the fabricator’s standard panel format — typically 250×350 mm or 480×600 mm — is the most cost-effective step an engineer can take at the design phase. For mass production above 500–1,000 pieces, panel utilisation efficiency, material yield, and tooling amortisation all drive unit cost down significantly; the unit price at 5,000 pieces is typically 40–60% of the prototype unit price for the same design.
Summary: Getting the Metal Core PCB Manufacturing Process Right
The metal core PCB manufacturing process is a sequence of precision steps where each stage builds on the quality of the one before. Base metal preparation determines dielectric bond integrity. Dielectric lamination controls the thermal resistance of the finished board. Via isolation determines whether the board has a short circuit or not. Copper etching with trace width compensation determines whether trace geometry meets design intent. Solder mask application over thick copper determines long-term corrosion protection. ENIG surface finish determines solder joint quality and thermal coupling to power device pads.
For engineers specifying MCPCB for the first time, the practical takeaway is straightforward: write a complete fabrication specification, qualify your fabricator on their dielectric bonding process specifically, and specify ENIG. These three actions cover the vast majority of the failure modes that cause MCPCB field returns.
For material selection guidance on Bergquist Thermal Clad IMS dielectric grades, visit our Bergquist PCB reference page.
Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
