Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
IPC-WP/TR-584 Explained: Complete Guide to Halogen-Free PCB Materials and Flame Retardants
Few topics in PCB materials generate more confusion than “halogen-free.” Ask ten engineers what halogen-free means, and you’ll get ten different answers. Some think it means zero halogens. Others confuse it with RoHS compliance. Many don’t realize that the common FR-4 laminate sitting in their stockroom contains brominated flame retardants that, while perfectly legal, may not meet their customer’s environmental requirements.
IPC-WP/TR-584 exists to cut through this confusion. This white paper represents IPC’s official position on halogen-free materials for the electronics industry, developed over six years by a team spanning the entire electronics supply chain. It defines what “halogen-free” actually means, explains why the thresholds were set where they are, and addresses the common misconceptions that lead to specification errors and supply chain problems.
If you’re specifying PCB materials, qualifying suppliers, or trying to understand why your customer suddenly requires halogen-free boards, this document is essential reading.
IPC-WP/TR-584, officially titled “IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on ‘Halogen-Free’),” establishes IPC’s position on halogen content in electronics materials. The document was first released in 2003, with Revision A published in September 2007.
Document Information
Details
Full Title
IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies
Subtitle
Correcting the Misunderstandings on “Halogen-Free”
Document Number
IPC-WP/TR-584A
Current Revision
Revision A
Release Date
September 2007
Original Release
2003
Development Time
6 years total (3 years each version)
Pages
~33
The document applies to materials for interconnecting electronics including copper-clad laminates, prepregs, resin-coated copper foils (RCC), flexible materials, and solder masks. It reflects the state of information and technology as of May 2007, though the fundamental definitions and thresholds remain the industry reference today.
Why Halogen-Free Matters
Halogens—specifically bromine and chlorine—have been used as flame retardants in PCB laminates for decades. They’re effective, economical, and well-understood. So why the push to eliminate them?
Environmental and Health Concerns
The problem isn’t halogens themselves, but what happens when halogenated materials burn or are improperly disposed of:
Concern
Issue
Dioxin Formation
Low-temperature combustion of brominated flame retardants can produce dioxins and furans
Toxic Fumes
Burning releases hydrogen bromide (HBr) and other toxic gases
Bioaccumulation
Some brominated compounds persist in the environment and accumulate in living organisms
The EU’s RoHS Directive banned two specific brominated flame retardants—polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE)—in 2006. However, RoHS does not ban all brominated flame retardants. Tetrabromobisphenol A (TBBPA), the most common flame retardant in FR-4 laminates, remains legal under RoHS.
This distinction is crucial: RoHS compliance does not equal halogen-free.
Major electronics brands require halogen-free materials for environmental marketing
Green Certifications
EPEAT, TCO, and other eco-labels may require or reward halogen-free materials
Regional Preferences
Japanese and European markets show stronger halogen-free preferences
Future-Proofing
Anticipating stricter regulations on remaining halogenated compounds
The “9-9-15” Rule: IPC-WP/TR-584 Halogen Thresholds
IPC-WP/TR-584 defines “halogen-free” using specific concentration limits, commonly called the “9-9-15” rule:
Element
Maximum Allowed
Measurement
Bromine (Br)
≤900 ppm
0.09% by weight
Chlorine (Cl)
≤900 ppm
0.09% by weight
Total (Br + Cl)
≤1500 ppm
0.15% by weight
These thresholds didn’t appear arbitrarily. They emerged from negotiations between Japanese industry (represented by JPCA) and U.S./European stakeholders during the development of IEC 61249-2-21. The compromise balanced detection capabilities, manufacturing tolerances, and practical achievability.
Why Not Zero?
“Halogen-free” doesn’t mean zero halogens for several practical reasons:
Reason
Explanation
Detection Limits
Analytical methods have practical detection limits around 50 ppm
Trace Contamination
Incidental halogen traces exist in many raw materials
Achieving absolute zero would be prohibitively expensive without additional environmental benefit
The 900 ppm threshold represents a practical limit that ensures intentional halogenated flame retardants are absent while allowing for incidental trace content.
Which Halogens Are Covered?
While halogens include fluorine, chlorine, bromine, iodine, and astatine, IPC-WP/TR-584 focuses on bromine and chlorine because:
Halogen
Status in Electronics
Bromine (Br)
Primary flame retardant, regulated by 9-9-15
Chlorine (Cl)
Used in PVC and some flame retardants, regulated by 9-9-15
Fluorine (F)
Used in PTFE laminates, NOT currently restricted
Iodine (I)
Rarely used in electronics, not restricted
Astatine (At)
Radioactive, not used in electronics
Fluorine’s exclusion is notable. PTFE-based high-frequency laminates contain fluorine as an intrinsic part of the resin system, not as a flame retardant. At the time IPC-WP/TR-584 was written, fluorine in PTFE was not considered an environmental or health concern, though this may change with evolving PFAS regulations.
Comparing Halogen-Free Standards
IPC-WP/TR-584 isn’t the only standard addressing halogen content. Understanding how it relates to other specifications prevents confusion:
Standard
Organization
Br Limit
Cl Limit
Total Limit
Scope
IPC-WP/TR-584
IPC
900 ppm
900 ppm
1500 ppm
PCB materials position paper
IEC 61249-2-21
IEC
900 ppm
900 ppm
1500 ppm
Non-halogenated base materials
JPCA-ES-01-2003
JPCA (Japan)
900 ppm
900 ppm
1500 ppm
Halogen-free copper-clad laminates
JEDEC JS709
JEDEC/ECA
1000 ppm
1000 ppm
N/A
Low-halogen electronic products
IPC-4101
IPC
900 ppm
900 ppm
1500 ppm
Base materials specification
The slight difference in JEDEC JS709 (1000 ppm vs. 900 ppm) reflects ongoing industry debates about harmonization. When specifying materials, always confirm which standard your customer requires.
Brominated flame retardants work by releasing bromine radicals during combustion that interrupt the flame chemistry:
Compound
Abbreviation
Status
Tetrabromobisphenol A
TBBPA
Legal, commonly used in FR-4
Polybrominated biphenyls
PBB
Banned under RoHS
Polybrominated diphenyl ethers
PBDE
Banned under RoHS
Hexabromocyclododecane
HBCDD
Restricted under REACH
TBBPA remains the most common flame retardant in standard FR-4 laminates. It’s effective, well-characterized, and not currently banned. However, it doesn’t meet halogen-free requirements.
Halogen-Free Flame Retardant Alternatives
Halogen-free laminates typically use phosphorus-based, nitrogen-based, or combination flame retardant systems:
Type
Mechanism
Characteristics
Phosphorus-Based
Forms protective char layer, releases flame-inhibiting radicals
Most common HF alternative, good performance
Nitrogen-Based
Releases inert gases that dilute oxygen
Often combined with phosphorus
Metal Hydroxides
Releases water vapor, absorbs heat
Aluminum hydroxide, magnesium hydroxide
Phosphorus-Nitrogen
Combined mechanisms
Enhanced performance, higher cost
When phosphorus-containing resin burns, it decomposes into polyphosphoric acid that dehydrates the polymer surface, forming a protective carbonized char layer. This physically separates the fuel from oxygen and heat.
Halogen-Free PCB Material Properties
Halogen-free materials aren’t just “FR-4 without bromine.” The different flame retardant chemistry affects multiple material properties:
Property
Halogen-Free
Standard FR-4
Impact
Glass Transition (Tg)
Generally higher
Lower
Better high-temp performance
Decomposition Temp (Td)
Higher
Lower
More reflow cycles possible
CTE (Z-axis)
Lower
Higher
Better PTH reliability
Moisture Absorption
Lower
Higher
Better humidity resistance
Dielectric Constant
Similar
Similar
Minimal impact
Drill Life
Reduced 20-25%
Baseline
Higher PCB fab cost
Material Cost
10-30% higher
Baseline
Supply chain impact
The reduced drill life is significant for PCB fabricators. Halogen-free laminates tend to be more rigid, accelerating drill wear. This cost gets passed through to the assembled board price.
Common Halogen-Free Laminate Materials
Major laminate suppliers offer halogen-free alternatives:
Supplier
Product Examples
Panasonic
R1566, R1566W, R1566WN, R1566S
Isola
DE156, GreenSpeed series
Shengyi
S1550G, S1165, S1165M, S6015
ITEQ
IT-170GRA1TC
Ventec
VT-447
Nan Ya
NPG-170HF
When selecting materials, verify that both the laminate AND the solder mask meet halogen-free requirements. A halogen-free laminate with standard solder mask doesn’t produce a halogen-free board.
Testing Methods for Halogen Content
IPC-WP/TR-584 references specific test methods for verifying halogen content:
Test Method
Standard
Application
Oxygen Bomb Combustion
EN 14582
Most accurate, preferred method
Ion Chromatography
Various
Analysis after combustion
Semi-Open Flask
Traditional
Less accurate, being phased out
XRF Screening
Various
Quick screening, not definitive
The oxygen bomb combustion method followed by ion chromatography provides the most accurate results. The older semi-open flask method has been shown to underreport halogen content in some cases.
For incoming inspection, XRF (X-ray fluorescence) provides rapid screening but cannot definitively distinguish between halogen sources. A positive XRF result requires follow-up with combustion testing.
When writing specifications for halogen-free PCBs:
What to Include
Specification Element
Recommendation
Halogen Limits
Reference IPC-WP/TR-584 or IEC 61249-2-21 thresholds
Test Method
Specify EN 14582 oxygen bomb combustion
Scope
Include laminate, prepreg, AND solder mask
Certification
Require supplier certification per lot or material
Marking
Specify J-STD-609 marking requirements if needed
Common Specification Mistakes
Mistake
Problem
Solution
“Halogen-free” without definition
Ambiguous requirement
Reference specific standard
Specifying only laminate
Solder mask may contain halogens
Include all materials
Assuming RoHS = halogen-free
RoHS allows TBBPA
Specify halogen limits separately
Zero tolerance
Impossible to achieve
Use 9-9-15 thresholds
Manufacturing Considerations
Switching to halogen-free materials affects both PCB fabrication and assembly:
PCB Fabrication
Process
Impact
Drilling
20-25% reduced drill life, more frequent bit changes
Lamination
May require adjusted press cycles
Plating
Generally similar to standard materials
Routing
Increased tool wear
Assembly
Process
Impact
Reflow
Generally more robust due to higher Td
Wave Soldering
Similar to standard materials
Rework
May tolerate more thermal cycles
Flux Selection
Verify flux is also halogen-free if required
Note that halogen-free flux requirements are separate from laminate requirements. A board assembled with halogen-free laminate but standard flux may not meet overall halogen-free requirements depending on customer specifications.
No, and this is one of the most common misconceptions. RoHS restricts specific substances including two brominated flame retardants (PBB and PBDE), but it does not restrict all halogens. Tetrabromobisphenol A (TBBPA), the most widely used flame retardant in FR-4 laminates, is fully RoHS compliant but contains bromine at levels far exceeding halogen-free thresholds. A standard FR-4 board can be 100% RoHS compliant while containing 15-20% bromine by weight. Always specify halogen-free requirements separately from RoHS compliance.
Why does IPC-WP/TR-584 allow 900 ppm instead of requiring zero halogens?
The 900 ppm threshold reflects practical limitations in testing and manufacturing. Analytical test methods have detection limits around 50 ppm, with lab-to-lab variation that can exceed 100 ppm. Trace halogen contamination exists in many raw materials used in electronics manufacturing. Setting the limit at 900 ppm ensures that intentional halogenated flame retardants are absent while providing margin for incidental contamination and measurement uncertainty. Achieving absolute zero would require extraordinary measures with no additional environmental benefit.
Do I need halogen-free solder mask if my laminate is halogen-free?
Yes, if your requirement is for a halogen-free PCB assembly. Standard solder masks may contain halogenated compounds. Specifying only halogen-free laminate while using standard solder mask results in a board that doesn’t meet overall halogen-free requirements. Always specify that both laminate materials and solder mask must meet IPC-WP/TR-584 thresholds. Verify with your PCB supplier that they’re using qualified halogen-free solder mask, not just halogen-free laminate.
Does IPC-WP/TR-584 restrict fluorine in PTFE laminates?
No, the current version of IPC-WP/TR-584 focuses on bromine and chlorine only. Fluorine was excluded because, at the time the document was written, fluorine in PTFE laminates was not considered an environmental or health concern—the fluorine is intrinsic to the polymer structure, not added as a flame retardant. However, this may change. Evolving regulations around PFAS (per- and polyfluoroalkyl substances) could eventually affect PTFE materials. If your application specifically requires fluorine-free materials, you’ll need to specify this separately from IPC-WP/TR-584 compliance.
How do I verify that materials meet IPC-WP/TR-584 requirements?
Request test reports from your material suppliers showing halogen content tested per EN 14582 (oxygen bomb combustion) with analysis by ion chromatography. The report should show bromine ≤900 ppm, chlorine ≤900 ppm, and total Br+Cl ≤1500 ppm. For incoming inspection, XRF screening provides quick verification but positive results should be confirmed with combustion testing. Many laminate suppliers provide certificates of compliance that reference IPC-4101 slash sheets for halogen-free materials. Ensure your purchase orders specifically require halogen-free materials and request certification documentation.
Conclusion
IPC-WP/TR-584 provides the authoritative industry definition for halogen-free PCB materials. The “9-9-15” thresholds—900 ppm maximum bromine, 900 ppm maximum chlorine, 1500 ppm total—have become the global standard referenced by IEC, JPCA, and incorporated into IPC-4101 laminate specifications.
Understanding this document prevents the specification errors and supply chain confusion that arise from ambiguous halogen-free requirements. It clarifies why RoHS compliance doesn’t equal halogen-free, why zero halogen content isn’t required or practical, and why fluorine-containing PTFE materials are currently excluded from restrictions.
For engineers specifying materials, the key takeaways are straightforward: reference IPC-WP/TR-584 or IEC 61249-2-21 thresholds explicitly, include both laminate and solder mask in your requirements, specify the EN 14582 test method, and require supplier certification. Following these practices ensures your halogen-free specifications are clear, achievable, and verifiable.
The halogen-free transition continues to evolve with changing regulations and market expectations. While IPC-WP/TR-584 reflects 2007 technology, its fundamental definitions remain the industry baseline. As new concerns emerge around PFAS and other compounds, expect continued refinement of halogen-related requirements—making a solid understanding of the current framework even more valuable.
Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.