Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
Every industry has its own language, and printed electronics is no exception. When your supplier talks about “sintering” and you’re thinking “curing,” or when “functional ink” means something different to your design team than your materials vendor, miscommunication costs time and money. IPC-6903 solves this problem by establishing standardized terminology for the printed electronics industry.
After spending years translating between traditional PCB vocabulary and printed electronics terminology, I’ve learned to appreciate having a common reference point. This guide covers the essential terms defined in IPC-6903 and explains how this standard creates a shared language for everyone working in printed electronics.
What is IPC-6903?
IPC-6903, officially titled “Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry),” provides 62 standardized terms and definitions specific to printed electronics manufacturing. Published in October 2015 by the Printed Electronics Terms and Definitions Task Group (D-64a), IPC-6903 creates a common vocabulary for the worldwide printed electronics community.
Document Attribute
IPC-6903 Details
Full Title
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
Document Number
IPC-6903
Current Revision
IPC-6903A
Original Release
October 2015
Developed By
D-64a Printed Electronics Terms and Definitions Task Group
Number of Terms
62 terms and definitions
Primary Purpose
Common language for PE community
The standard specifically addresses terminology for additive circuitry—processes where conductive materials are deposited onto substrates rather than etched away from copper-clad laminates. This fundamental difference from traditional subtractive PCB manufacturing requires its own vocabulary.
IPC-6903 vs IPC-T-50: Understanding the Difference
Engineers familiar with traditional electronics manufacturing know IPC-T-50, the comprehensive terminology document covering interconnecting and packaging electronic circuits. Understanding how IPC-6903 relates to IPC-T-50 helps clarify when each standard applies.
Aspect
IPC-T-50
IPC-6903
Scope
General electronics industry
Printed electronics specific
Number of Terms
Thousands
62
Manufacturing Focus
Subtractive (etching) processes
Additive (printing) processes
Materials Covered
Traditional PCB materials
Functional inks, novel substrates
Process Coverage
Conventional PCB/assembly
Printing, sintering, R2R
Target Users
All electronics professionals
Printed electronics specialists
Why Printed Electronics Needs Separate Terminology
Traditional PCB terminology often doesn’t translate directly to printed electronics. Consider these examples:
“Conductor” in traditional PCB: Typically means etched copper trace with well-defined properties.
“Conductor” in printed electronics: Could be silver nanoparticle ink, carbon paste, copper nanowire film, or conductive polymer—each with vastly different properties and processing requirements.
IPC-6903 addresses this gap by defining terms that capture the unique characteristics of additive manufacturing processes and materials.
Key Term Categories in IPC-6903
IPC-6903 organizes printed electronics terminology into several functional categories that reflect the printed electronics value chain.
Manufacturing Process Terms
These terms describe how printed electronics are made, covering everything from initial printing through final processing.
Term
Definition Summary
Additive Circuitry
Circuits created by depositing material onto substrate
Front-End Assembly
Printing and deposition processes
Back-End Assembly
Component attachment and integration
Post-Processing
Treatment after printing (sintering, curing)
Roll-to-Roll (R2R)
Continuous processing using web-fed substrates
Materials and Components Terms
These terms define the materials used in printed electronics, from substrates to functional inks.
Term
Definition Summary
Functional Ink
Ink formulated for electrical/electronic function
Functional Material
Material providing specific electronic property
Conductive Ink
Ink providing electrical conductivity
Dielectric Ink
Ink providing electrical insulation
Substrate
Base material receiving printed deposits
Assembly and Product Terms
These terms describe integrated printed electronics assemblies and finished products.
Term
Definition Summary
Flexible Hybrid Electronics (FHE)
Combination of printed and conventional components
Printed Electronics Assembly
Assembled PE product with components
Stretchable Electronics
Circuits accommodating mechanical stretching
Wearable Electronics
Electronics designed for body-worn use
In-Mold Electronics (IME)
PE integrated into molded plastic parts
Essential Printed Electronics Terms Defined
The following terms represent the core vocabulary every printed electronics engineer should know. These definitions align with IPC-6903 while providing practical context for daily use.
Additive Circuitry
Circuitry created by depositing conductive and functional materials onto a substrate, as opposed to subtractive processes that remove material from metal-clad laminates. Additive circuitry encompasses screen printing, inkjet printing, aerosol jet, gravure, flexographic, and other deposition methods.
Practical significance: Understanding this fundamental distinction helps engineers recognize why printed electronics requires different design rules, materials specifications, and process controls than traditional PCB manufacturing.
Flexible Hybrid Electronics (FHE)
Electronic systems combining printed electronics elements with conventional electronic components on flexible substrates. FHE leverages the advantages of both technologies—the form factor and manufacturing benefits of printed electronics with the performance of conventional silicon-based components.
Practical significance: Most commercial printed electronics products are actually FHE, combining printed sensors, antennas, or interconnects with conventional ICs for signal processing.
Sintering
The process of fusing printed conductive particles into a continuous conductive film through application of energy. IPC-6903 recognizes multiple sintering methods, each with different characteristics.
Sintering Type
Energy Source
Typical Applications
Thermal Sintering
Conventional heating
General purpose, batch
Photonic Sintering
Intense pulsed light
Heat-sensitive substrates
Laser Sintering
Focused laser beam
Selective area processing
Microwave Sintering
Microwave radiation
Volumetric heating
Chemical Sintering
Chemical reaction
Room temperature processing
Practical significance: Sintering method selection directly impacts substrate compatibility, processing speed, and final conductor properties.
Functional Ink
An ink formulated to provide a specific electrical, electronic, or other functional property when deposited and processed. Functional inks differ from conventional printing inks in that their purpose is electronic function rather than visual appearance.
Categories of functional inks:
Conductive inks (silver, copper, carbon)
Dielectric inks (insulating layers)
Semiconducting inks (active devices)
Resistive inks (printed resistors)
Sensing inks (chemical, biological detection)
Stretchable Electronics
Electronic circuits designed and manufactured to accommodate mechanical stretching while maintaining electrical functionality. Stretchable electronics enable applications where conventional rigid or even flexible circuits would fail, such as electronic skin and conformable sensors.
Key design approaches:
Serpentine conductor patterns
Stretchable substrate materials
Island-bridge architectures
Intrinsically stretchable materials
Wearable Electronics
Electronic devices designed for extended wear on the human body, typically incorporating flexible or stretchable substrates to conform to body contours and accommodate movement.
Practical significance: Wearable electronics impose unique requirements including skin compatibility, washability, comfort, and reliability under repeated deformation.
Front-End Assembly
The processes involved in creating the printed circuit pattern on the substrate, including printing, drying, and curing or sintering of deposited materials. Front-end assembly creates the functional circuitry before component attachment.
Back-End Assembly
The processes involved in attaching components to printed circuits and completing the electronic assembly. Back-end assembly for printed electronics may include conventional pick-and-place, conductive adhesive bonding, or other attachment methods compatible with printed substrates.
Post-Processing
Treatment applied to printed deposits after initial printing to achieve final material properties. Post-processing may include sintering, curing, annealing, or other treatments required to develop electrical functionality or mechanical properties.
Roll-to-Roll Processing
Continuous manufacturing process using flexible substrate supplied from a roll, processed through printing and other operations, and collected on another roll. Roll-to-roll processing enables high-volume, low-cost printed electronics manufacturing.
R2R Advantage
Description
Throughput
Continuous vs. batch processing
Cost
Lower per-unit manufacturing cost
Scalability
Easier transition to high volume
Integration
Multiple process steps in line
Process-Related Terminology
IPC-6903 defines numerous terms related to printed electronics manufacturing processes.
Printing Process Terms
Term
Description
Screen Printing
Stencil-based deposition through mesh screen
Inkjet Printing
Drop-on-demand digital deposition
Aerosol Jet
Focused aerosol stream deposition
Gravure Printing
Engraved cylinder-based deposition
Flexographic Printing
Relief plate-based rotary printing
Slot-Die Coating
Continuous coating from precision slot
Curing and Processing Terms
Term
Description
Thermal Curing
Heat-induced polymerization or sintering
UV Curing
Ultraviolet light-induced curing
IR Drying
Infrared-based solvent removal
Flash Sintering
Rapid photonic energy sintering
Plasma Treatment
Surface modification using plasma
Materials Terminology
IPC-6903 provides terminology for the diverse materials used in printed electronics.
Conductive Materials Terms
Term
Description
Nanoparticle Ink
Ink containing nanoscale conductive particles
Flake Ink
Ink containing microscale flake particles
Nanowire Ink
Ink containing one-dimensional nanostructures
Reactive Ink
Ink forming conductors through chemical reaction
Conductive Polymer
Organic polymer with electrical conductivity
Substrate Terms
Term
Description
Flexible Substrate
Substrate capable of bending without damage
Rigid Substrate
Non-flexible substrate material
Stretchable Substrate
Substrate accommodating elastic deformation
Coated Substrate
Substrate with surface treatment or coating
How IPC-6903 Supports Other Printed Electronics Standards
IPC-6903 serves as the terminology foundation for the entire printed electronics standards ecosystem. Understanding how terms defined in IPC-6903 appear throughout other standards helps engineers navigate the complete framework.
Terminology Usage Across PE Standards
Standard
How IPC-6903 Terms Apply
IPC-2291
Design guidelines use standardized terminology
IPC-2292
Flexible substrate design terms defined
IPC-4591
Conductive materials terminology aligned
IPC-4921
Substrate terminology consistent
IPC-6901
Application category terms defined
IPC-6902
Qualification terms standardized
When IPC-2292 references “front-end assembly” or IPC-4591 discusses “functional inks,” these terms carry the precise meanings established in IPC-6903. This consistency eliminates ambiguity across the standards ecosystem.
Using IPC-6903 Terminology in Practice
Standardized terminology provides practical benefits throughout the printed electronics product lifecycle.
Procurement Documentation
Using IPC-6903 terms in procurement documents ensures suppliers understand exactly what you need.
Before standardization: “We need conductive ink that can be baked onto plastic film.”
With IPC-6903 terminology: “We require a silver nanoparticle conductive ink compatible with thermal sintering at temperatures below the glass transition of PEN substrate per IPC-4921.”
Supplier Communication
Common vocabulary reduces miscommunication between buyers and suppliers across different regions and technical backgrounds.
Communication Area
Benefit of Standardized Terms
Material specifications
Precise property requirements
Process requirements
Clear processing expectations
Quality criteria
Consistent acceptance standards
Technical discussions
Reduced translation errors
Design Specifications
Using standardized terminology in design documentation ensures manufacturing teams understand design intent and requirements.
Quality Documentation
IPC-6903 terminology enables clear, consistent quality documentation that supports audits, certifications, and continuous improvement programs.
IPC-6903 and Global Printed Electronics Development
As printed electronics manufacturing spans multiple continents and cultures, standardized terminology becomes increasingly critical. IPC-6903 provides the common language that enables global collaboration.
Benefits for International Teams
Challenge
How IPC-6903 Helps
Language barriers
English definitions provide reference
Technical translation
Standardized terms reduce errors
Supplier qualification
Common requirements language
Documentation consistency
Aligned vocabulary across regions
The standard’s development involved input from both IPC and JPCA (Japan Electronics Packaging and Circuits Association), ensuring terminology works across major electronics manufacturing regions.
What is the difference between IPC-6903 and IPC-T-50?
IPC-T-50 provides general terminology for the entire electronics industry, covering thousands of terms related to traditional PCB manufacturing and assembly. IPC-6903 specifically addresses the 62 additional terms needed for printed electronics that aren’t adequately covered by IPC-T-50. Think of IPC-6903 as a supplement to IPC-T-50 that fills the terminology gap created by additive manufacturing processes, functional inks, and flexible hybrid electronics. You need both standards for complete terminology coverage when working with printed electronics.
How often is IPC-6903 updated?
IPC-6903 follows IPC’s standard revision process, with updates driven by industry needs and technology evolution. The current revision is IPC-6903A, which added additional terms beyond the original 2015 release. As printed electronics technology continues developing rapidly, expect ongoing revisions to capture new terminology. IPC encourages industry participation in the revision process through the D-64a task group.
Is IPC-6903 required for printed electronics manufacturing?
IPC-6903 is a voluntary consensus standard, not a regulatory requirement. However, using standardized terminology provides significant practical benefits in supplier communication, documentation clarity, and quality management. Many organizations reference IPC-6903 in their quality systems and supplier requirements to ensure consistent terminology usage. While not legally required, adoption simplifies communication throughout the supply chain.
Does IPC-6903 define test methods or acceptance criteria?
No, IPC-6903 is strictly a terminology standard. It defines what terms mean but does not specify test methods, acceptance criteria, or performance requirements. For test methods, reference IPC-TM-650 and related test method documents. For performance requirements, reference IPC-6901 (application categories) and IPC-6902 (qualification specifications). IPC-6903 ensures everyone uses the same vocabulary when discussing these requirements.
How does IPC-6903 handle emerging technologies?
IPC-6903 includes provisions for terminology updates as new technologies emerge. The standard is maintained by an active task group that monitors industry developments and proposes new terms as needed. For technologies not yet covered, the standard provides a framework for consistent terminology that organizations can extend for internal use until official updates are published. Industry participants are encouraged to submit new terminology suggestions to IPC for consideration in future revisions.
Implementing IPC-6903 in Your Organization
Successful implementation of standardized terminology requires organizational commitment beyond simply purchasing the standard.
Implementation Steps
Step 1: Acquire the Standard Purchase IPC-6903A from IPC to ensure access to complete, current definitions.
Step 2: Train Key Personnel Ensure engineers, quality staff, and procurement teams understand key terminology.
Step 3: Update Documentation Revise specifications, procedures, and templates to use standardized terms.
Step 4: Communicate with Suppliers Inform suppliers of your terminology expectations and provide references.
IPC-6903 provides the essential vocabulary foundation for the printed electronics industry. By establishing standardized terminology for additive circuitry, flexible hybrid electronics, and related technologies, the standard enables clear communication between designers, manufacturers, suppliers, and customers worldwide.
For engineers working in printed electronics, familiarity with IPC-6903 terminology is fundamental to effective collaboration. Whether you’re specifying materials, documenting processes, or communicating with suppliers, using standardized vocabulary eliminates ambiguity and reduces errors.
Combined with other printed electronics standards like IPC-2291 for design, IPC-4591 for conductive materials, IPC-4921 for substrates, and IPC-6901 for application categories, IPC-6903 completes the framework needed for successful printed electronics development. Start speaking the same language as the rest of the industry by incorporating IPC-6903 terminology into your printed electronics work.
Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
