Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
IPC-4130: Complete Guide to Nonwoven E-Glass Mat for PCB Laminates
Most PCB engineers are familiar with woven fiberglass—the backbone of FR-4 and countless other laminates. But there’s another reinforcement material that doesn’t get nearly as much attention: nonwoven E-glass mat. If you’ve ever worked with CEM-3 boards or wondered what makes certain laminates easier to drill and punch, you’ve encountered materials that fall under IPC-4130.
This guide breaks down everything you need to know about IPC-4130, from what the standard covers to how nonwoven glass mat affects your PCB design and manufacturing decisions.
IPC-4130 is officially titled “Specification and Characterization Methods for Nonwoven ‘E’ Glass Mat.” Published by IPC (Association Connecting Electronics Industries), this standard determines the nomenclature, definitions, and physical requirements for mat made from nonwoven E-glass fibers.
The standard serves two primary purposes:
Establishing consistent terminology and quality requirements for nonwoven glass mat materials
Providing specification sheets for selecting and purchasing these materials
Released in September 1998, IPC-4130 is a 14-page document that’s equivalent to IEC Publicly Available Specification (PAS) 62212. While it’s not as widely discussed as IPC-4101 or IPC-4121, it’s essential for anyone working with composite laminate materials like CEM-3.
Why IPC-4130 Matters
Nonwoven E-glass mat is a critical reinforcement material in the PCB industry. Unlike woven glass cloth (which dominates FR-4 production), nonwoven mat offers specific advantages for certain applications:
Better machinability (easier drilling and punching)
Smoother surface finish
Lower cost in some cases
Different resin flow characteristics during lamination
Understanding IPC-4130 helps you specify the right reinforcement material when standard woven glass doesn’t fit your requirements.
Nonwoven vs. Woven E-Glass: Understanding the Difference
Before diving deeper into IPC-4130, let’s clarify the fundamental difference between nonwoven and woven glass reinforcements.
Woven E-Glass (Covered by IPC-4412)
Woven E-glass consists of continuous glass filaments interlaced in a regular pattern—typically plain weave. Think of it like fabric. The fibers run in specific directions (warp and weft), creating a structured grid.
Characteristics:
High mechanical strength
Excellent dimensional stability
Predictable electrical properties
Standard choice for FR-4 and multilayer PCBs
Nonwoven E-Glass Mat (Covered by IPC-4130)
Nonwoven E-glass mat consists of randomly oriented glass fibers bonded together without weaving. The fibers are typically held in place by a binder and compressed into a mat form.
IPC-4130 establishes specific requirements across several categories. Here’s what the standard covers:
Physical Requirements
The standard defines physical characteristics that nonwoven E-glass mat must meet for PCB applications. These include:
Weight per unit area: Specified in grams per square meter (g/m²)
Thickness: Nominal thickness and tolerances
Tensile strength: In both machine and cross-machine directions
Tear resistance: Ability to resist propagation of tears
Moisture content: Maximum allowable moisture levels
Binder content: Percentage of binding agent used
Visual Requirements
IPC-4130 also addresses visual quality aspects:
Surface uniformity
Foreign material contamination limits
Holes or voids
Edge quality
Dimensional Requirements
For roll materials, the standard specifies:
Roll width tolerances
Roll diameter specifications
Core requirements
IPC-4130 Specification Sheets
Like other IPC material standards, IPC-4130 uses specification sheets to categorize different grades of nonwoven E-glass mat. These sheets help procurement teams and engineers select the right material for specific applications.
What Specification Sheets Include
Each specification sheet in IPC-4130 defines:
Parameter
Description
Mat Type
Classification identifier
Weight
Nominal weight per unit area
Thickness
Nominal thickness range
Binder Type
Chemical composition of binder
Tensile Strength
Minimum values in MD and CD
Application Notes
Recommended uses
Selecting the Right Specification Sheet
When choosing a nonwoven E-glass mat specification, consider:
Laminate type: What final product are you making (CEM-3, specialty composite)?
Resin compatibility: Is the binder compatible with your resin system?
Thickness requirements: Does the mat thickness fit your stack-up needs?
Processing conditions: Will it perform under your lamination parameters?
Applications of Nonwoven E-Glass Mat in PCB Manufacturing
Nonwoven E-glass mat finds its primary application in Composite Epoxy Material (CEM) type laminates. Here’s where you’ll encounter it:
CEM-3 Laminates
CEM-3 is the most common application for IPC-4130 materials. CEM-3 uses nonwoven glass mat as its core, with woven glass cloth on the outer surfaces.
CEM-3 Structure:
Outer layers: Woven E-glass cloth + epoxy
Core: Nonwoven E-glass mat + epoxy
Result: Double-sided PCB capability with improved machinability
CEM-3 Advantages:
Similar electrical properties to FR-4
Better drilling characteristics (less bit wear)
Easier punching for high-volume production
Smoother surface finish
Lower cost in some markets
CEM-3 Applications:
Consumer electronics
Household appliances
Automotive electronics
Telecommunications equipment
Instrumentation
Specialty Composite Materials
Beyond CEM-3, nonwoven E-glass mat is used in various specialty applications:
Surfacing layers for improved finish
Resin-rich areas in complex laminates
Hybrid constructions combining woven and nonwoven reinforcements
How IPC-4130 Relates to Other IPC Standards
IPC-4130 doesn’t exist in isolation. It connects with several other IPC standards in the material specification ecosystem.
Related IPC Standards
Standard
Title
Relationship to IPC-4130
IPC-4101
Base Materials for Rigid and Multilayer Printed Boards
References IPC-4130 for nonwoven reinforcement specs
IPC-4110
Nonwoven Cellulose Based Paper for Printed Boards
Parallel standard for paper reinforcements
IPC-4412
Finished Fabric Woven from “E” Glass for Printed Boards
Covers woven glass (complementary to IPC-4130)
IPC-4121
Guidelines for Selecting Core Constructions
Uses both woven and nonwoven materials
The Material Hierarchy
When specifying a complete laminate system:
IPC-4101 defines the overall laminate requirements (slash sheets)
IPC-4130 or IPC-4412 specifies the reinforcement material
Resin system is defined within the IPC-4101 slash sheet
IPC-4121 helps select specific core constructions
Quality Assurance Requirements in IPC-4130
IPC-4130 establishes quality assurance protocols to ensure consistent material quality.
Inspection Procedures
The standard defines:
Responsibility for inspection: Who performs QC checks
Laminate manufacturers offering CEM-3 and related materials:
Shengyi Technology (China)
Kingboard Laminates (Asia)
ITEQ Corporation
Various regional suppliers
Related Standards to Review
Standard
Where to Find
IPC-4101
shop.ipc.org
IPC-4412
shop.ipc.org
IPC-4110
shop.ipc.org
IPC-4121
shop.ipc.org
Industry Trends Affecting Nonwoven Glass Materials
The PCB industry continues to evolve, and nonwoven E-glass mat applications are affected by several trends:
Regional Manufacturing Patterns
CEM-3 and nonwoven-based laminates have significant market share in Asia, particularly Japan and China. In fact, CEM-3 usage in Japan has grown to exceed FR-4 in certain application segments. As manufacturing continues to concentrate in these regions, understanding IPC-4130 materials becomes increasingly important for global design teams working with Asian fabricators.
Lead-Free Assembly Compatibility
Modern CEM-3 materials have been developed to withstand lead-free soldering temperatures. When specifying CEM-3, verify that the material meets your thermal requirements for assembly. Look for materials with:
Tg ≥ 130°C minimum
Td ≥ 300°C for lead-free compatibility
Adequate time-to-delamination at reflow temperatures
HDI and Miniaturization
As designs shrink, some applications that previously used CEM-3 are moving to FR-4 for better dimensional stability. However, for appropriate applications, the drilling advantages of nonwoven reinforcement remain relevant. The smoother surface finish of CEM-3 can also benefit fine-pitch component mounting.
Cost Pressures
In cost-sensitive consumer electronics, CEM-3 continues to offer value. The combination of lower material cost and reduced drill bit wear can provide meaningful savings at scale.
Manufacturing Considerations for IPC-4130 Materials
Understanding how nonwoven E-glass mat behaves during PCB manufacturing helps you make better material decisions.
Lamination Behavior
During the lamination process, nonwoven mat allows for more uniform resin flow compared to woven cloth. This can result in:
More consistent dielectric thickness
Fewer resin-starved areas
Better filling around features
However, the looser structure means slightly less dimensional control compared to woven reinforcement.
Drilling Performance
One of the biggest practical advantages of IPC-4130 materials is drilling performance:
Metric
Woven Glass (FR-4)
Nonwoven Glass (CEM-3)
Drill Bit Life
Standard
20-30% longer
Hole Wall Quality
Good
Good
Burr Formation
Moderate
Reduced
Delamination Risk
Low
Low
For high-volume production where drill costs matter, this difference can be significant.
Punching and Shearing
Unlike FR-4, CEM-3 laminates can be effectively punched and sheared for board outline formation. This enables:
Lower tooling costs for simple shapes
Faster production for high-volume orders
Reduced mechanical stress on boards
This is why CEM-3 remains popular for consumer electronics where millions of identical boards are produced.
Common Mistakes to Avoid
Assuming CEM-3 equals FR-4: While similar in many properties, CEM-3 has different mechanical characteristics. Don’t substitute without verification.
Ignoring layer count limitations: CEM-3 is designed for double-sided boards. Don’t try to force multilayer designs with this material class.
Overlooking binder compatibility: The binder in nonwoven mat must be compatible with your resin system. Verify this with your laminate supplier.
Forgetting to specify the standard: When ordering nonwoven E-glass mat or CEM-3 laminates, reference IPC-4130 for clear communication with suppliers.
Neglecting regional availability: Material availability varies by region. Confirm your fabricator can source the specified material before committing to a design.
Frequently Asked Questions About IPC-4130
What is the difference between IPC-4130 and IPC-4412?
IPC-4130 covers nonwoven E-glass mat—randomly oriented fibers bonded together without weaving. IPC-4412 covers woven E-glass fabric—structured fiberglass cloth with interlaced fibers in specific patterns. Nonwoven mat (IPC-4130) offers better machinability and smoother surfaces, while woven fabric (IPC-4412) provides higher mechanical strength and dimensional stability. CEM-3 laminates use nonwoven mat in their core, while FR-4 uses woven fabric throughout.
What PCB materials use nonwoven E-glass mat per IPC-4130?
The primary application is CEM-3 (Composite Epoxy Material-3), which uses nonwoven E-glass mat as its core with woven glass cloth on the outer surfaces. CEM-3 is widely used in Asia for double-sided PCBs in consumer electronics, household appliances, and automotive applications. Other specialty composite materials may also incorporate nonwoven glass mat for specific properties like improved surface finish or enhanced resin flow.
Can CEM-3 replace FR-4 in my design?
CEM-3 can replace FR-4 for double-sided PCBs in many applications, but with limitations. CEM-3 matches FR-4 in properties like glass transition temperature, water absorption, peel strength, and electrical breakdown. However, CEM-3 has lower flexural strength and is not suitable for multilayer boards beyond 2 layers. Evaluate your specific mechanical, thermal, and layer count requirements before substituting.
How does IPC-4130 affect PCB drilling and machining?
Nonwoven E-glass mat per IPC-4130 significantly improves drilling characteristics compared to woven glass. The random fiber orientation causes less wear on drill bits, resulting in longer tool life and lower machining costs. CEM-3 laminates are also easier to punch than FR-4, making them attractive for high-volume production where mechanical forming is used. This is one of the key practical advantages of nonwoven-reinforced materials.
Where can I purchase the IPC-4130 standard?
IPC-4130 is available for purchase from the official IPC Store at shop.ipc.org. It’s a 14-page document released in September 1998. You can also find it through authorized distributors like TechStreet, ANSI Webstore, and SAI Global. For equivalent international requirements, refer to IEC PAS 62212.
Conclusion
IPC-4130 may not be the most discussed standard in PCB engineering circles, but it plays a crucial role in defining nonwoven E-glass mat materials that enable CEM-3 and other composite laminates. Understanding this standard helps you make informed decisions about when nonwoven reinforcement makes sense versus traditional woven glass.
The key takeaways:
IPC-4130 specifies nonwoven E-glass mat properties and quality requirements
Nonwoven mat offers better machinability but lower mechanical strength than woven glass
CEM-3 is the primary laminate using IPC-4130 materials
Use CEM-3 for cost-effective double-sided boards; stick with FR-4 for multilayer designs
Always verify material compatibility with your fabricator before finalizing specifications
For most designs, FR-4 remains the workhorse. But when drilling efficiency, surface smoothness, or cost optimization matters for your double-sided board, IPC-4130 materials deserve consideration.
This guide is intended for educational purposes. Always refer to the official IPC-4130 standard for authoritative requirements. Material properties and availability may vary by supplier and region.
Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.