IPC-2614 Guide: Complete PCB Fab Drawing Requirements

Every PCB designer has experienced it: you send your design to fabrication, and the questions start rolling in. “What’s the finished board thickness?” “Is this hole plated or non-plated?” “What IPC class?” “What surface finish?” The back-and-forth delays your project and introduces opportunities for error.

IPC-2614 eliminates this problem by establishing exactly what information must be included in PCB fabrication documentation. Officially titled “Sectional Requirements for Board Fabrication Documentation,” this 59-page standard defines the methodology for transferring design information to board fabricators—including physical characteristics, accept/reject criteria, and quality requirements for the delivered product.

What Is IPC-2614?

IPC-2614 is a sectional standard within the IPC-2610 documentation series that establishes requirements for PCB fabrication documentation. The standard applies to rigid boards, flexible circuits, rigid-flex, inorganic substrates, and any combination thereof. It covers single-sided, double-sided, multilayer, and HDI constructions, including boards with embedded components.

The purpose of IPC-2614 is creating consistent communication between design and manufacturing. Some documentation elements are mandatory to avoid ambiguity; others are recommended to establish consistent practices across the industry.

IPC-2614 Standard Overview

What IPC-2614 Covers

IPC-2614 Within the IPC-2610 Documentation Series

IPC-2614 is part of a comprehensive documentation framework that replaced the older IPC-D-325 standard. Understanding where IPC-2614 fits helps you use the complete documentation system effectively.

IPC-2610 Series Standards

IPC-D-325 to IPC-2614 Evolution

The IPC-2610 series split documentation requirements into logical sections, making it easier to find relevant requirements and update individual standards without revising the entire document set.

IPC-2614 Classification System

IPC-2614 uses a two-part classification system that defines both the format and completeness of your documentation package.

Documentation Grade Definitions

Completeness Mode Requirements

The classification is expressed as a letter-number combination. For example, “Grade B, Mode 2” indicates electronic data with standard completeness—the most common classification for modern PCB fabrication.

Selecting the Right Classification

Board Outline and Dimension Requirements per IPC-2614

The fabrication drawing must clearly define the physical boundaries and critical dimensions of the PCB.

Required Dimension Information

Dimension Best Practices per IPC-2614

The origin point deserves special attention. IPC-2614 requires that the origin on your fabrication drawing matches the origin in your NC drill data. Mismatched origins cause holes to be drilled in wrong locations—a costly mistake.

Layer Stackup Documentation per IPC-2614

For multilayer boards, the stackup documentation is often the most critical element of your fabrication package.

Required Stackup Information

Layer Naming Convention per IPC-2614

IPC-2614 requires that conductor layer identification start with the primary side as Layer 1, with subsequent layers numbered sequentially. This seems obvious, but inconsistent naming between the stackup drawing and Gerber files causes fabrication errors.

Stackup Drawing Elements

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Drill Table Requirements per IPC-2614

The drill table documents all holes in the PCB, providing critical information for fabrication planning and verification.

Required Drill Table Information

Additional Drill Table Information

Drill Table Best Practices

Fabrication Notes per IPC-2614

Fabrication notes communicate requirements that aren’t captured in the graphical elements of the drawing. IPC-2614 identifies both mandatory and recommended notes.

Mandatory Fabrication Note Topics

Common Fabrication Notes per IPC-2614

IPC Class Selection

The IPC class note is critical—it tells the fabricator which IPC-6012 (or IPC-6013 for flex) acceptance criteria apply. Without this note, the fabricator must guess or ask, delaying your project.

Special Construction Documentation

IPC-2614 addresses documentation requirements for advanced PCB constructions that need additional information beyond standard boards.

HDI Documentation Requirements

Controlled Impedance Documentation

Embedded Component Documentation

Electronic Data Requirements per IPC-2614

Modern fabrication relies heavily on electronic data. IPC-2614 addresses requirements for these formats alongside traditional drawings.

Accepted Electronic Formats

Electronic Data Best Practices

Tools and Resources for IPC-2614

Official IPC Documentation

Related Standards

EDA Tool Documentation Features

Frequently Asked Questions About IPC-2614

What is the difference between IPC-2614 and IPC-D-325?

IPC-2614 is part of the newer IPC-2610 documentation series that replaced IPC-D-325. While IPC-D-325 was a monolithic document covering all documentation requirements, IPC-2614 focuses specifically on board fabrication documentation. The IPC-2610 series split requirements into logical sections (schematics, fabrication, assembly, etc.) making it easier to find relevant requirements and update individual standards. IPC-2614 also adds coverage for HDI, embedded components, and gives equal weight to electronic data formats alongside traditional drawings.

Do I need a fabrication drawing if I’m using online PCB ordering?

Yes and no. Online PCB services capture most IPC-2614 requirements through their web forms—material, thickness, surface finish, copper weight, and so on. However, having a fabrication drawing creates a permanent record of your specifications and catches any discrepancies between what you ordered and what’s in your design files. For production boards or anything beyond simple prototypes, maintaining IPC-2614 compliant documentation is strongly recommended.

What IPC class should I specify on my fabrication drawing?

Most commercial and industrial electronics use Class 2, which provides good reliability without the cost premium of Class 3. Class 1 is appropriate for general consumer products where cost is the primary driver. Class 3 is required for high-reliability applications like medical devices, aerospace, and military systems. The class designation affects acceptance criteria throughout fabrication—plating thickness, annular ring requirements, surface defects, and more—so choose appropriately for your application’s reliability requirements.

How detailed should my stackup drawing be per IPC-2614?

Your stackup should include enough detail that the fabricator can build exactly what you designed without guessing. At minimum: layer count, layer sequence with names matching your Gerber files, copper weights, dielectric materials (or equivalent specifications), dielectric thicknesses with tolerances, and overall board thickness. For controlled impedance boards, add trace widths and target impedances. For HDI, include microvia specifications and build-up sequence. The fabricator should never need to ask “what did you intend here?”

Can I use IPC-2581 data instead of traditional fab drawings?

IPC-2581 is an intelligent data format that can contain all the information traditionally found in fabrication drawings plus the design data itself. IPC-2614 recognizes electronic data formats including IPC-2581 as valid documentation methods (Grade B). However, not all fabricators fully support IPC-2581 yet, so verify with your fabricator before relying solely on this format. Many designers use IPC-2581 alongside a traditional PDF fabrication drawing to ensure all fabricators can process their documentation.

Creating Complete Fab Documentation with IPC-2614

IPC-2614 transforms fabrication documentation from an afterthought into a systematic process. When your documentation package includes everything the standard requires—board dimensions with matched origins, complete stackup with layer names that match your data files, comprehensive drill tables, and fabrication notes that specify class, materials, and finishes—the questions stop and fabrication proceeds smoothly.

Start by selecting the appropriate classification for your project. Include all mandatory elements: board outline with origin, stackup with materials and thicknesses, drill table with plating status, and notes covering IPC class, material, and finish requirements. For complex boards, add the special construction documentation IPC-2614 requires for HDI, controlled impedance, or embedded components.

The combination of IPC-2614 compliant documentation and modern intelligent data formats like IPC-2581 ensures your fabricator receives exactly the information needed to build your board correctly the first time. That means faster turnaround, fewer engineering queries, and boards that match your design intent.