IPC-2547 Guide: XML Event Messages for Electronics Inspection and Test Equipment

If you’ve ever tried connecting AOI, SPI, ICT, and X-ray equipment to your MES system, you know the frustration. Every vendor has their own data format, their own defect codes, and their own way of reporting test results. Getting unified quality data from a mixed-vendor inspection line often means writing custom parsers for each machine type.

IPC-2547 was designed to solve exactly this problem. As the test and inspection sectional standard within the CAMX framework, IPC-2547 defines standardized XML event messages for inspection equipment, electrical testers, and rework stations. When your equipment speaks IPC-2547, your quality data flows into one consistent format—regardless of whether it came from a Koh Young SPI, an Omron AOI, or a Keysight ICT system.

This guide covers everything quality and test engineers need to know about IPC-2547: what it covers, how it fits within CAMX, the specific event types for each equipment category, and how it compares to the newer IPC-2591 CFX standard.

What is IPC-2547?

IPC-2547 is officially titled “Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework.” Released in January 2002, this standard defines XML-encoded event messages for quality verification equipment in electronics manufacturing.

The key thing to understand about IPC-2547 is its scope: it specifically covers equipment that verifies whether products were built correctly. This distinguishes it from IPC-2546, which covers assembly equipment that actually builds the product.

IPC-2547 Equipment Domain

IPC-2547 addresses three main categories of equipment:

The inclusion of rework equipment is unique to IPC-2547. This capability doesn’t exist in IPC-2546, making IPC-2547 essential for complete quality traceability.

How IPC-2547 Fits in the CAMX Framework

IPC-2547 doesn’t work in isolation. It’s part of the CAMX (Computer Aided Manufacturing using XML) framework developed by IPC in collaboration with the National Electronics Manufacturing Initiative (NEMI) Plug-and-Play Factory project.

CAMX Standards Architecture

Think of it this way: IPC-2541 provides the foundation (generic event structure, equipment states, common attributes), while IPC-2547 extends that foundation with specific events for inspection and test equipment. IPC-2501 handles the actual message transport between equipment and host systems.

Why This Layered Approach Matters

The CAMX framework’s layered architecture provides several practical benefits:

As noted in IEEE research on CAMX, “A key feature of the CAMX standards is that they are extensible, enabling the implementation of enhancements while maintaining backwards compatibility.”

IPC-2547 Event Structure and Cardinality

IPC-2547 follows the event structure defined in IPC-2541, but with specific cardinality rules for inspection and test messages.

Cardinality Indicators

Unlike IPC-2541 where all attributes are mandatory (1-1), IPC-2547 uses 0-1 to indicate optional fields. This flexibility accommodates different equipment capabilities—a basic AOI might not report confidence scores, while an advanced system might include AI-based detection probabilities.

Event Extensions

All IPC-2547 messages include an Extensions element, allowing vendors to add proprietary data without breaking standard compliance. This is one of CAMX’s major strengths: equipment manufacturers can include additional machine-specific information while maintaining interoperability.

Solder Paste Inspection (SPI) Events in IPC-2547

SPI systems inspect solder paste deposits immediately after screen printing. Since approximately 80% of PCB assembly defects originate from improper solder paste printing, SPI data is critical for process control.

SPI Event Types

SPI Measurement Attributes

SPI Defect Categories

SPI data becomes especially valuable when correlated with post-reflow AOI results—you can trace solder defects back to specific paste deposit issues.

Automated Optical Inspection (AOI) Events in IPC-2547

AOI systems perform visual inspection at multiple points in the SMT process: post-placement (pre-reflow) and post-reflow. IPC-2547 provides comprehensive event definitions for both scenarios.

AOI Event Categories

AOI Defect Types Supported

IPC-2547 supports the standard AOI defect classifications:

AOI Defect Event Attributes

Automated X-ray Inspection (AXI) Events in IPC-2547

X-ray inspection is essential for BGAs, QFNs, and other packages where solder joints are hidden from optical inspection. IPC-2547 includes specific events for X-ray-based quality verification.

AXI Event Types

AXI-Specific Attributes

For high-reliability applications (aerospace, medical, automotive), X-ray data provides the hidden joint verification that optical inspection cannot deliver.

In-Circuit Test (ICT) Events in IPC-2547

ICT systems verify component values and board connectivity by probing test points and measuring electrical characteristics. IPC-2547 defines events for both fixture-based ICT and flying probe testers.

ICT Event Types

ICT Result Attributes

Component Test Attributes

Read more IPC Standards:

IPC Standards Explained: A Comprehensive Guide to PCB & Electronics Assembly Standards

IPC 2615 Standard Explained: PCB Dimensioning & Tolerancing Requirements

MIL-STD-2000A: Military Soldering Standards for Electronic Assemblies

MIL-STD-1686: ESD Control Program Requirements for Military Electronics

IPC 1791 Standard: Everything You Need to Know About Trusted PCB Certification

MIL-STD-883: Complete Guide to Microelectronics Test Methods

J-STD-048 Explained: Complete Guide to Product Discontinuance Notifications

MIL-STD-750: Semiconductor Device Test Methods Explained

MIL-STD-454: General Requirements for Military Electronic Equipment

IPC 9194: Complete Guide to SPC for PCB Assembly Manufacturing

MIL-STD-202: Electronic Component Testing Methods & Procedures

IPC 4110: Complete Guide to Cellulose Paper Specs for Printed Circuit Boards

Boundary Scan Testing (JTAG) in PCB Design: A Complete DFT Guide

Axiomtek IPC-950 Review: Specs, Features & Performance [2026 Guide]

MIL-PRF-55681: Military Ceramic Chip Capacitor Specification Guide

Functional Test Events in IPC-2547

Functional testing verifies that the assembled board operates correctly as a complete system under powered conditions.

Functional Test Event Types

Functional Test Attributes

Rework and Repair Events in IPC-2547

One of IPC-2547’s unique features is comprehensive coverage of rework and repair operations. This capability is critical for complete traceability and quality documentation.

Rework Event Types

Rework Event Attributes

Why Rework Tracking Matters

For high-reliability applications, rework documentation is often a contractual or regulatory requirement:

IPC-2547’s rework events provide the data structure needed to meet these requirements with automated documentation.

Quality Data Integration with IPC-2547

The real value of IPC-2547 emerges when inspection and test data flows into manufacturing execution systems (MES) and quality management systems (QMS).

Integration Applications

Defect Correlation Example

With standardized IPC-2547 data from SPI, AOI, and ICT:

IPC-2547 vs IPC-2591 CFX: Which Standard for Inspection Equipment?

The electronics industry is transitioning toward IPC-2591 Connected Factory Exchange (CFX), released in 2018 and now at version 2.0. Understanding the differences helps with technology decisions.

Technical Comparison

When to Use Each Standard

As one industry expert noted, “CFX is an emerging standard, and while it receives a lot of press, there are still very few real-life manufacturing implementations. Widespread future adoption is still uncertain.”

Where to Get IPC-2547 and Related Standards

Official Standard Sources

Related Standards to Consider

Implementation Resources

Frequently Asked Questions

What equipment types does IPC-2547 cover?

IPC-2547 covers three main equipment categories: inspection equipment (SPI, AOI, AXI), test equipment (ICT, flying probe, functional test), and rework/repair stations. This scope focuses specifically on quality verification equipment, distinguishing it from IPC-2546 which covers assembly equipment like screen printers, pick-and-place machines, and reflow ovens. Together, IPC-2546 and IPC-2547 provide complete SMT line coverage within the CAMX framework.

Do I need IPC-2541 to use IPC-2547?

Yes, IPC-2541 is mandatory. IPC-2547 is a sectional standard that extends IPC-2541’s generic requirements. The base XML schema, equipment state model, common event types, and extension mechanisms are all defined in IPC-2541. Without IPC-2541, you won’t have the foundation that IPC-2547 builds upon. Most equipment vendors implement both standards together as part of their CAMX compliance.

How does IPC-2547 handle vendor-specific data?

IPC-2547 includes an Extensions element in every event, allowing vendors to add proprietary information without breaking standard compliance. This is a significant strength of the CAMX framework—equipment manufacturers can include additional machine-specific attributes, custom defect codes, or enhanced measurement data while maintaining interoperability with standard-compliant systems. The extensions don’t require committee approval (unlike CFX).

Should new installations use IPC-2547 or IPC-2591 CFX?

For new installations, IPC-2591 CFX is generally the better choice. CFX offers modern technology (JSON format, AMQP transport), bidirectional communication (commands and events), a standardized message broker, and active development with regular updates. However, IPC-2547 remains relevant for integrating with legacy equipment, connecting to existing CAMX infrastructure, or working with MES systems that don’t yet support CFX. Many manufacturers run both standards during transition periods.

Can IPC-2547 data support regulatory compliance requirements?

Yes, IPC-2547 provides the data structure needed for regulatory compliance in industries like aerospace (AS9100), medical devices (FDA 21 CFR Part 820), and automotive (IATF 16949). The standard’s rework events are particularly valuable for maintaining the complete modification history that regulators require. Each defect detection, repair action, operator identification, and verification result can be captured in standardized format, enabling automated compliance documentation.

Conclusion

IPC-2547 remains a foundational standard for connecting inspection and test equipment in electronics manufacturing. By defining standardized XML event messages for SPI, AOI, X-ray, ICT, functional test, and rework equipment, this standard enables unified quality data collection regardless of equipment vendor.

The standard’s unique coverage of rework and repair operations fills a gap that IPC-2546 doesn’t address, making IPC-2547 essential for complete quality traceability. For manufacturers in regulated industries, this rework documentation capability alone justifies implementation.

While IPC-2591 CFX represents the future of factory communication, IPC-2547 continues serving manufacturers with existing CAMX infrastructure, legacy equipment, or integration requirements that CFX doesn’t yet address. Understanding both standards—and when to use each—helps quality engineers make informed technology decisions.

For any manufacturer serious about quality data integration, defect correlation, and traceability, IPC-2547 provides the standardized foundation that transforms inspection equipment from isolated data silos into a unified quality intelligence system.