Inverter PCB Layout: EGS002 & Power Inverter Design Guide

After spending over a decade designing power electronics boards, I can tell you that inverter PCB layout is where most DIY projects succeed or fail. You can have the perfect schematic, top-quality components, and a solid understanding of power conversion theory—but get the layout wrong, and you’ll end up with blown MOSFETs, excessive noise, or an inverter that runs hot enough to cook breakfast.

This guide focuses specifically on designing PCB layouts for pure sine wave inverters using the popular EGS002 driver module. Whether you’re building a 300W backup system or scaling up to a 2kW solar inverter, the layout principles covered here will help you avoid the most common pitfalls and build something that actually works reliably.

What Makes Inverter PCB Layout Different from Other Designs

Inverter boards aren’t like your typical microcontroller project. You’re dealing with high currents, fast switching transients, and voltage levels that can seriously hurt you. The EGS002 module generates SPWM signals at frequencies high enough that even a few millimeters of trace becomes a meaningful inductor.

I’ve seen countless forum posts from builders whose inverters work fine on the bench with no load, then immediately shut down or blow components when they connect a 100W light bulb. Nine times out of ten, the problem traces back to layout issues rather than component selection.

The Core Challenge: Managing Parasitic Inductance

Every trace on your PCB acts as an inductor. When you switch several amps through a MOSFET in nanoseconds, that parasitic inductance creates voltage spikes according to V = L × (di/dt). This is the formula that kills MOSFETs and causes EMI nightmares.

The solution isn’t complicated in theory: minimize loop areas, keep high-current paths short, and separate noisy power switching from sensitive control signals. Executing this properly takes careful planning before you ever open your PCB design software.

Understanding the EGS002 Driver Module

Before diving into layout specifics, let’s understand what we’re working with. The EGS002 is a purpose-built driver board for single-phase sinusoidal inverters that has become extremely popular in DIY and commercial projects alike.

EGS002 Technical Specifications

EGS002 Pin Functions for PCB Layout

Understanding how each pin connects to your external circuit is essential for proper layout:

LED Warning Indicators on EGS002

The module includes built-in diagnostics that help troubleshoot issues:

EGS002 Inverter PCB Layout: Component Placement Strategy

Good layout starts with component placement. I spend more time on placement than on actual routing because getting this right makes everything else easier.

Power Stage Component Placement

Your H-bridge MOSFETs are the heart of the inverter power stage. Place them in a tight rectangular arrangement with minimal spacing between devices. The DC bus capacitors should be positioned as close as possible to the MOSFET drain connections.

For a typical EGS002 inverter PCB layout, follow this placement hierarchy:

First priority: Place the H-bridge MOSFETs. Position all four (or more for paralleled designs) in a symmetrical layout. If using TO-220 packages, orient them for efficient heatsink mounting. For SMD packages like D2PAK, allow adequate copper area for thermal dissipation.

Second priority: DC bus capacitors. These must connect directly between the high-side MOSFET drains and the power ground with the shortest possible path. Use a mix of bulk electrolytics for energy storage and ceramic capacitors for high-frequency decoupling.

Third priority: Output filter components. The LC filter inductor and capacitor connect to the bridge output. Position the inductor close to the switching nodes to minimize the noisy trace length.

Fourth priority: EGS002 module and control circuitry. Place the driver module away from the high-current switching area. A separation of 30-50mm is usually sufficient for low-frequency transformer designs.

Control Circuit Isolation

The EGS002 module contains sensitive analog circuitry for feedback processing. Keep these guidelines in mind:

Position voltage regulators (7805 for logic supply) between the power input and the EGS002, with their own decoupling capacitors. Route the feedback signals (VFB, IFB, TFB) using separate traces that don’t run parallel to power traces. If possible, use a ground plane under the control section that connects to the power ground at a single point.

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Trace Routing for Power Inverter PCB

This is where many EGS002 inverter projects fail. Even experienced PCB designers sometimes underestimate how much current flows in an inverter and how fast it switches.

Power Trace Sizing Guidelines

These figures assume adequate cooling. For inverter applications where traces run hot, increase width by 50% or use 2oz copper throughout the power section.

Critical Current Loops to Minimize

The most important loop in any inverter is the switching loop that starts at the DC bus capacitor, flows through the high-side MOSFET, through the low-side MOSFET, and returns to the capacitor. This loop should form the tightest possible rectangle on your PCB.

For a properly laid-out EGS002 inverter PCB layout, target these loop areas:

The DC bus switching loop should be under 200mm² for a 10A-rated inverter. Larger inverters need proportionally more attention to this loop. Consider using multiple smaller ceramic capacitors distributed around the MOSFETs rather than one large capacitor positioned away from them.

Gate Drive Trace Routing

The gate drive traces from the EGS002 to your external MOSFETs require special attention. Keep these traces short and direct, never running them parallel to power traces. Use 4.7Ω to 10Ω gate resistors placed directly at the MOSFET gates, not at the EGS002 outputs.

Match the trace lengths between high-side and low-side gates of the same half-bridge. A mismatch here causes one device to switch slightly before the other, creating shoot-through current during transitions.

Grounding Strategies for Inverter PCB Layout

Grounding problems cause more mysterious failures than any other layout issue. The challenge is that your inverter has circuits operating at vastly different voltage and current levels that all need to share a common reference.

Star Grounding Implementation

For inverter PCB layout, star grounding works best. Identify a single point where all ground connections meet—typically at the negative terminal of your main DC bus capacitor.

From this star point, run separate ground connections to:

The power ground handling MOSFET return current routes directly to the star point using thick traces or copper pours. The EGS002 module ground connects through a dedicated trace rather than sharing the power ground path. Feedback and sensing circuits get their own ground reference tied to the star point.

This prevents high-current ground spikes from affecting the sensitive control circuits. I’ve fixed countless “unstable output voltage” problems simply by implementing proper star grounding.

Ground Plane Considerations

Using a ground plane is common practice, but for inverter layouts, a solid unbroken plane isn’t always the best approach. The high switching currents create magnetic fields that can couple into other circuits through the plane.

Instead, consider a split ground plane approach where the power section and control section have separate planes connected only at the star point. This provides shielding benefits while preventing ground current from flowing through sensitive areas.

Thermal Management in Power Inverter PCB Design

MOSFETs in an inverter dissipate significant power, especially during switching transitions. Your PCB layout directly affects how well this heat gets managed.

Heatsink Integration

For through-hole packages like TO-220, design your layout with heatsink mounting in mind. Allow adequate clearance for thermal pads and mounting hardware. The drain tab of most power MOSFETs is connected to the drain pin, so ensure electrical isolation if multiple devices share a heatsink.

SMD power devices require thermal vias under the thermal pad. Use a grid of vias (typically 0.3mm diameter, 1mm pitch) connecting the top copper to an internal or bottom layer copper pour. Filled and plated vias offer 40% better thermal conductivity than hollow vias.

Copper Pour Sizing for Thermal Dissipation

EMI Reduction Techniques for EGS002 Inverter PCB Layout

Electromagnetic interference is the invisible enemy of power electronics. A poorly designed inverter will radiate noise that interferes with nearby electronics and may fail regulatory compliance testing.

Minimizing Radiating Loop Areas

The switching node between your high-side and low-side MOSFETs transitions between ground and bus voltage in nanoseconds. This node radiates EMI proportional to its area and the rate of voltage change.

Make this node a compact polygon connecting only the three essential points: high-side MOSFET source, low-side MOSFET drain, and the filter inductor. Avoid running this node to any other part of the board.

Snubber and Clamp Placement

RC snubbers or TVS clamps help reduce voltage spikes and high-frequency ringing. Position these components directly across the MOSFETs they protect, with trace lengths under 10mm. A snubber located 30mm away on long traces is essentially useless—it arrives too late to clamp the spike.

Input and Output Filtering

Add common-mode chokes at both the DC input and AC output if EMI is a concern. Position these at the board edges where cables connect. Differential mode filtering uses the main LC filter, but adding a small X-class capacitor (100nF to 470nF) across the output helps reduce high-frequency noise.

Common EGS002 Inverter PCB Layout Mistakes to Avoid

After reviewing hundreds of community projects, I’ve identified the mistakes that appear most frequently:

Mistake 1: Inadequate DC bus decoupling. Using only electrolytic capacitors without ceramic backup. The electrolytics can’t respond to high-frequency switching currents. Add 100nF to 1µF ceramics rated for your bus voltage directly across each half-bridge.

Mistake 2: Gate drive traces too long or running near power traces. This causes noise injection that triggers false turn-on or oscillation. Keep gate traces short, perpendicular to power traces where crossing is unavoidable.

Mistake 3: Single-point connection for VS pins. The VS1 and VS2 pins of the EGS002 must connect directly to their respective half-bridge midpoints. Routing these through long traces or shared connections causes bootstrap failure and shoots-through.

Mistake 4: Feedback path picking up switching noise. The VFB voltage feedback is especially susceptible. Use differential routing, add filtering capacitors, and keep the feedback traces away from the switching nodes.

Mistake 5: Undersized traces for battery connections. The DC input sees the full inverter current. Many designs have 12V input traces that are too narrow, causing voltage drop under load that triggers the EGS002’s undervoltage protection.

PCB Layer Stack Recommendations

Two-Layer Board Layout

For simpler EGS002 inverter designs under 500W, a two-layer board can work if you’re careful:

Use the top layer primarily for power routing with thick traces. The bottom layer handles control signals and provides ground fill. Connect the layers with multiple vias in power paths—at least 3-4 vias per amp of current capacity needed.

Four-Layer Board Layout

For reliable results on inverters above 500W, move to a four-layer stack:

This stack gives you proper shielding between power and control circuits while providing low-inductance power distribution.

Useful Resources for EGS002 Inverter PCB Layout

Datasheets and Documentation

Open Source PCB Projects

PCB Manufacturing Services

When ordering your inverter PCB, specify:

Request 2oz copper on power layers for better current handling. HASL or OSP surface finish works fine for through-hole designs. For SMD power devices, ENIG provides better soldering results. Minimum 1.6mm board thickness, preferably 2mm for large inverters.

Testing Your EGS002 Inverter PCB Layout

Before connecting high voltage, verify your layout works correctly at the module level:

Step 1: Power only the EGS002 module with +5V and +12V. Ground IFB, VS1, VS2, VFB, and TFB during this test. The LED should remain steadily lit indicating normal operation.

Step 2: Use an oscilloscope to verify SPWM waveforms on the gate drive outputs. You should see complementary square waves at the configured frequency (50 or 60Hz) with dead time between transitions.

Step 3: Connect the H-bridge MOSFETs with a low DC voltage (12-24V) and no load. Verify the bridge output shows the expected SPWM pattern.

Step 4: Add the output filter and adjust VFB to achieve target output voltage. Start with a light resistive load and gradually increase while monitoring for voltage stability.

Frequently Asked Questions

Why does my EGS002 inverter shut down when I connect a load?

The most common cause is inadequate input power capacity or excessive voltage drop in traces. When you connect a load, current draw increases dramatically, and if your traces are undersized, voltage at the EGS002 drops below its undervoltage threshold (indicated by 4 LED blinks). Check trace widths from battery to H-bridge and ensure your power source can supply the required current.

Can I use the EGS002 for high-voltage DC bus applications (360V+)?

This is problematic despite the IR2110 being rated for higher voltages. The EGS002 module layout isn’t optimized for high dV/dt at elevated voltages, and many users report destroyed modules when attempting this. For high-voltage DC bus applications, consider using discrete IR2110/IR2113 circuits with layout specifically designed for your voltage level.

What transformer turns ratio should I use with the EGS002?

For low-frequency transformer designs, calculate based on your input voltage RMS. With 12V battery input, your RMS is approximately 8.5V (12V × 0.707). For 220V output, you need roughly a 1:26 turns ratio. In practice, wind for slightly higher voltage and use VFB adjustment to dial in exact output.

How do I properly configure dead time for my MOSFETs?

Dead time prevents shoot-through by ensuring both MOSFETs in a half-bridge are off during transitions. Longer dead time is safer but reduces efficiency and increases output distortion. Start with 1.0µs (JP4 and JP7 shorted) for typical MOSFETs like IRF3205. Only reduce to 500ns or 300ns if using fast-switching devices and you’ve verified clean waveforms with an oscilloscope.

Why is my inverter output voltage unstable or oscillating?

Voltage instability typically indicates feedback loop problems. Check that your VFB connection is properly filtered and routed away from switching noise. Verify the feedback voltage at the VFB pin reads approximately 3V for 220V output. Ground bounce from poor layout can also cause this—implement proper star grounding if you haven’t already.

Final Thoughts on Inverter PCB Layout

Designing a reliable EGS002 inverter PCB layout comes down to respecting the physics of high-power switching. Every trace is an inductor, every loop is an antenna, and every watt of loss becomes heat you need to manage.

The EGS002 module handles the complex SPWM generation and protection logic, but it can’t compensate for poor external layout. Take your time with component placement, route power paths first, and always verify with actual testing before scaling up to full power.

Start with a conservative design for your first build—larger traces than calculated, more decoupling than seems necessary, and plenty of heatsink capacity. You can optimize once you have a working foundation. There’s nothing more frustrating than chasing layout problems on an aggressively optimized board that never worked in the first place.

If you’re new to power electronics, consider building one of the open-source designs first before creating your own layout. Understanding why those designs work will teach you more than any tutorial about how to create your own successful inverter PCB layout.