DuPont PCB Materials: Complete Product Guide — Pyralux, Kapton, Riston & Interra

When most PCB engineers think of DuPont PCB materials, four product families come to mind immediately: Pyralux for flexible laminates, Kapton for polyimide film, Riston for dry film photoresist, and Interra for embedded capacitance. Together they cover an enormous range of board types — from basic double-sided rigid boards to advanced HDI substrates, high-frequency flex circuits, and multilayer rigid-flex constructions built for aerospace and defense applications.

DuPont has been supplying the electronics industry for over 45 years across these product lines, and the depth of each family reflects that history. But that same depth is what makes material selection confusing for engineers who aren’t working with DuPont materials daily. This guide maps out the full portfolio, explains where each product fits, and includes comparison tables, key specifications, and direct links to publicly available datasheets.

Why DuPont PCB Materials Dominate Demanding Applications

The unifying thread across all four product families is chemistry maturity. DuPont’s core competency in polyimide chemistry — the same chemistry behind Kapton film and the dielectric layers in Pyralux laminates — gives their materials a performance ceiling that commodity FR-4-based alternatives simply can’t match. When you’re building circuits that need to survive -269°C cryogenic environments, 400°C continuous service temperatures, or hundreds of thousands of bend cycles without cracking traces, polyimide-based DuPont PCB materials are where most engineers start.

The four families serve distinct roles in board construction. Understanding how they interconnect is more useful than studying them in isolation. Kapton film is the base dielectric — it shows up as the substrate in Pyralux laminates and in the dielectric layer of Interra embedded capacitance materials. Riston photoresist is the imaging material used to pattern the copper layers regardless of which laminate system is underneath. Interra is a specialized sub-category: a thin copper-clad laminate whose purpose is to function as a distributed capacitor within a multilayer stackup, not as a standard signal layer.

For engineers working with DuPont PCB materials across multiple projects, getting fluent in all four families is genuinely worth the investment.

DuPont Pyralux: The Core Flexible and Rigid-Flex Laminate Family

Pyralux is DuPont’s brand for flexible circuit laminates — copper-clad materials built on polyimide film substrates. The family has been in production for over 35 years and today covers a wide spectrum from cost-optimized consumer electronics laminates to the highest-performance all-polyimide systems used in military and aerospace applications.

Understanding the Pyralux Architecture

Every Pyralux product is built around one of two fundamental constructions: adhesive-based (a three-layer structure of copper foil, adhesive, and Kapton film) or adhesiveless all-polyimide (a two-layer structure of copper bonded directly to polyimide, without an intermediate adhesive layer). The adhesiveless construction is thermally superior but more expensive and more demanding to process.

Pyralux LF — The Industry-Standard Acrylic System

Pyralux LF is the workhorse of the consumer electronics industry. It’s been the standard in high-reliability consumer applications for over 35 years, and its track record of consistency makes it the default choice for high-volume flexible circuit production. LF uses a Kapton polyimide film base coated with a proprietary B-staged acrylic adhesive, and it’s available in four formats: single-sided copper-clad laminates, double-sided copper-clad laminates, coverlays (for encapsulating etched copper), and sheet adhesive (for bonding flex inner layers or attaching rigid stiffeners).

Pyralux LF sheet adhesive is widely used in rigid-flex construction to bond flexible inner layers to rigid cap layers during lamination. It’s also the go-to for bonding heat sinks and stiffeners to flexible circuits in assembly-level operations.

Pyralux FR — Flame Retardant Acrylic System

Pyralux FR uses the same acrylic adhesive architecture as LF but adds flame retardancy, achieving UL V-0 certification. This makes FR the choice for applications where IPC or UL flammability requirements mandate the higher rating. It’s available in the same format options as LF: copper-clad laminates, coverlays, bondplys, and sheet adhesives.

Pyralux AP — The All-Polyimide Performance Benchmark

Pyralux AP is a double-sided, adhesiveless, all-polyimide copper-clad laminate that has set the performance benchmark for flex circuit materials since its introduction in 1996. By eliminating the acrylic adhesive layer between copper and dielectric, AP achieves substantially better thermal performance, chemical resistance, and dimensional stability than LF or FR.

Key electrical properties of Pyralux AP: Dk of approximately 3.4, Df of 0.002 — numbers that matter enormously for signal integrity in high-speed designs. The low dissipation factor is a direct result of the all-polyimide construction; acrylic adhesives push Df noticeably higher. Pyralux AP is the standard material specification for most military, aerospace, automotive, and high-reliability multilayer flex applications. It’s been qualified on NASA programs including Mars rover missions.

Pyralux HT — The Highest-Temperature Rating Available

Pyralux HT is the all-polyimide high-temperature system, carrying the highest service temperature rating of any flex circuit material available on the market — with demonstrated performance at continuous operating temperatures exceeding 225°C (437°F) and survivability past 250°C (482°F) in application testing.

The applications for HT are specific but demanding: aerospace fire control systems, oil and gas downhole drilling instruments (where temperatures inside the borehole can exceed 200°C continuously), automotive under-hood electronics, and medical autoclave-compatible devices. Standard acrylic-based laminates fail rapidly in these environments; Pyralux HT survives. It requires specialized lamination equipment capable of reaching and holding 600°F (316°C), which is why only a small number of fabricators worldwide are qualified to process it.

Pyralux AG — Bridging Prototype and High-Volume Production

Pyralux AG is a more recent addition to the lineup, designed to solve a specific operational problem: the material gap between prototype and mass production. Engineers typically prototype in small quantities at Western fabricators, then transfer to high-volume production in Asia — only to find the prototype material isn’t available from Asian suppliers. AG was engineered for global availability in both sheet form (for prototyping) and roll form (for high-volume manufacturing), eliminating the material changeover problem entirely.

AG is an all-polyimide laminate offering excellent dimensional stability, strong copper adhesion, and solid thermal/chemical resistance — positioned as a cost-optimized alternative to AP for applications that don’t require AP’s full performance tier but still need polyimide reliability.

Pyralux HP — Low-Loss Epoxy for Signal-Critical Designs

Pyralux HP uses an epoxy-based (rather than acrylic) adhesive system specifically formulated to minimize insertion loss in high-frequency signal paths. This makes HP the material of choice when signal integrity is the primary design driver — RF interconnects, high-speed differential pairs, backplane connections in telecom equipment. HP delivers best-in-class insertion loss performance while maintaining the reliability levels required for military, automotive, and medical applications.

Pyralux ML — The 2024 Thermal Management Addition

Introduced at IPC APEX Expo in April 2024, Pyralux ML is a double-sided metal-clad laminate that combines Kapton all-polyimide dielectric technology with copper-nickel (CuNi) alloy cladding rather than standard copper foil. The alloy provides tunable thermal resistance, thermal conductivity for heat transfer, controlled resistivity for higher heat output, and thermoelectric properties where needed. Target applications include EV power electronics, aerospace thermal management, AI networking hardware, flexible heating elements, and sensors in demanding environments. ML is supplied in sheet form.

Pyralux Product Family Comparison Table

Grade	Adhesive System	Construction	Max Operating Temp	Key Application	Signal Integrity
LF	Acrylic	3-layer	~150°C	Consumer electronics, high-volume flex	Moderate
FR	Acrylic (flame retardant)	3-layer	~150°C	UL V-0 applications	Moderate
AP	Adhesiveless	All-polyimide	~200°C continuous	Military, aerospace, high-reliability	High (Dk 3.4, Df 0.002)
HT	Adhesiveless	All-polyimide	>225°C	Downhole, under-hood, autoclave	High
AG	Adhesiveless	All-polyimide	~200°C	Global volume flex, prototype-to-production	High
HP	Epoxy	3-layer	~200°C	High-frequency, low-loss designs	Very High
ML	Metal alloy clad	All-polyimide + CuNi	High (application-specific)	EV, thermal management, sensors	N/A (thermal focus)
GPL	Epoxy bondply	Sheet adhesive	High	High-speed rigid-flex bonding	Very High

DuPont Kapton: The Polyimide Film Behind the Portfolio

Kapton is DuPont’s brand for polyimide film — and it’s important to understand that Kapton is both an independent product and the base material inside most Pyralux laminates and Interra embedded capacitor products. It has set the industry standard for over 45 years in high-performance, high-reliability film applications.

The property that makes Kapton indispensable is its thermal stability. Kapton polyimide films have set the industry standard for over 45 years in high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments.

Kapton HN — The General-Purpose Standard

Kapton HN is the recommended choice when you need an all-polyimide film with a well-balanced set of properties across the widest possible temperature range. HN film has been used successfully at temperatures as low as -269°C (-452°F) and as high as 400°C (752°F), making it uniquely suited for applications that span cryogenic and high-temperature extremes. It carries UL V-0 flammability rating, and its polyimide chemistry means it does not melt or burn. There are no known organic solvents for Kapton film — it simply doesn’t dissolve.

Applications for Kapton HN span an enormous range: flexible printed circuit substrates, pressure-sensitive tape, wire and cable insulation, motor slot liners, transformer insulation, fiber optic cable reinforcement, and space program thermal blankets. NASA has used Kapton in the solar arrays and thermal management systems of multiple space missions.

Kapton FPC — Designed Specifically for Flex Circuit Fabricators

Kapton FPC is treated on both sides and offers the same core property balance as HN, but with specifically engineered superior dimensional stability and adhesion — the two most critical parameters for flex circuit fabrication. Low shrinkage means fine-pitch circuit patterns remain in registration through thermal cycling during lamination. High surface adhesion means the copper-to-dielectric bond survives the mechanical stress of dynamic flex applications.

Kapton MT and MT+ — Thermally Conductive Variants

The Kapton MT+ polyimide film family offers over 4x improved thermal conductivity with 0.8 W/mK compared to traditional Kapton films while maintaining superior mechanical, electrical, and thermal properties. MT+ sets the performance benchmark in the polyimide category for thermal conductivity. For the MT grade without the plus designation, thermal conductivity is approximately 0.45 W/mK — still significantly better than standard HN. These grades are increasingly relevant as power density in electronics continues to rise and conventional polyimide’s insulating properties become a thermal bottleneck.

Kapton RS — Electrically Conductive for Heating Applications

Kapton RS incorporates electrically conductive polyimide with tightly controlled surface resistivity of 100 ohms/square. This enables its use as a thin, lightweight, flexible heating element — resistance heating built directly into the film layer. Applications include anti-icing systems, laboratory sample heating, and any application requiring uniform, distributed, low-profile heat generation.

Kapton Types Overview

Type	Key Feature	Primary PCB/Electronics Use
HN	Best-balanced general properties, -269°C to 400°C	Wire insulation, flex substrates, space applications
FPC	Superior adhesion and dimensional stability	Flex circuit fabrication base film
FN	FEP fluoropolymer coating on HN	Chemical resistance, heat bonding
MT	Enhanced thermal conductivity 0.45 W/mK	Heat management in assemblies
MT+	4x thermal conductivity vs HN, 0.8 W/mK	High power density flex applications
RS	100 ohms/sq surface resistivity	Flexible heating elements
JP	Improved formability for deep-drawing	3D formed electronic parts

DuPont Riston: The Industry-Standard Dry Film Photoresist

Riston is DuPont’s brand for dry film photopolymer photoresist — the material used to image copper patterns onto PCB panels during etching and plating operations. DuPont invented dry film photoresist over 40 years ago and Riston remains the industry standard for yield, productivity, and process latitude in PCB imaging.

How Riston Fits into the PCB Process

Riston is a process consumable, not a structural PCB material — it’s applied during fabrication and stripped off before the board is shipped. But it fundamentally determines what resolution is achievable in your circuit patterns, how reliably those patterns transfer to copper, and how efficiently your imaging line runs. Choosing the wrong Riston grade for your chemistry or exposure system is one of the most common root causes of yield problems in PCB shops.

Conventional Riston Series for Standard UV Exposure

The conventional series covers the standard applications found on most production lines using broadband UV (mercury lamp) exposure equipment:

TentMaster is engineered for tent-and-etch applications where the resist must bridge across and cover drilled through-holes without collapsing. Its patented resist technology eliminates developer sludge buildup — a practical yield and maintenance benefit that’s often undervalued until you’ve spent time cleaning a developer conveyor.

EtchMaster is specifically formulated for acid etch chemistry (ferric chloride, cupric chloride acid systems), which is considerably more aggressive toward standard resists than alkaline etching. The 213 grade handles multi-metal surfaces including stainless steel, aluminum, and nickel-iron alloys. The 830 grade targets fine-line innerlayers down to 2 mil (50 µm) features.

PlateMaster PM200 is the workhorse plating resist — proven on copper, tin, and tin-lead processes in 40, 50, and 75 µm thicknesses. Development chemistry is sodium or potassium carbonate at 0.7–1.0 wt% concentration. PM300 is the next-generation fine-line plating grade for more demanding feature geometries.

GoldMaster solves the historically problematic area of ENIG and hard gold plating. It eliminates the UV curing and thermal baking steps previously required to survive gold bath chemistry, cutting cycle time on ENIG lines.

MultiMaster MM-500 addresses job shops running multiple board types: one resist grade that covers both demanding alkaline etch and nickel/gold plating applications, reducing film changeovers and inventory complexity.

FX250 and Special FX target the most demanding fine-line applications requiring ENIG compatibility — the combination of tight geometry and harsh plating chemistry that trips up standard resist grades.

Riston Direct Imaging Series for LDI Equipment

As Laser Direct Imaging (LDI) and LED direct imaging have become standard equipment in HDI production, DuPont has built out a parallel lineup specifically for these narrowband (typically 405 nm) light sources. Standard conventional Riston formulations don’t respond efficiently to laser wavelengths — they require the LaserSeries or DI-specific films.

DuPont began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston LaserSeries films. These films offer vivid print-out image (POI) color after exposure for easy pre-development inspection, fast photospeed to maximize LDI throughput, and compatibility with conventional downstream chemistry.

The DI8600 and DI9000 series target HDI designs at pitch ≥ 70 µm, with DI8600 offering balanced inner/outer layer capability and DI9000 optimized for maximum resolution in tent/etch processes. The DI6100M handles the most demanding application — HDI mSAP (modified Semi-Additive Process) with demonstrated 6 µm line resolution for smartphone SLP (substrate-like PCB) applications.

Riston Series Quick-Reference Table

Series	Process Type	Exposure System	Resolution	Best For
TentMaster	Tent-and-etch	Conventional UV	Standard	Via tenting, alkaline etch
EtchMaster 213	Acid etching	Conventional UV	Standard	Multi-metal surfaces
EtchMaster 830	Acid etch innerlayers	Conventional UV	2 mil / 50 µm	Fine innerlayer lines
PlateMaster PM200	Cu/Sn/Pb plating	Conventional UV	Standard-fine	High-volume plating
PlateMaster PM300	Fine-line plating	Conventional UV	Fine	Next-gen Cu/Sn geometry
GoldMaster	ENIG / Ni-Au	Conventional UV	Standard	Gold plating, no bake required
MultiMaster MM-500	Alk. etch + Ni/Au	Conventional UV	Standard	Job shop, single-resist production
FX250	ENIG + fine features	Conventional UV	Fine	Harsh plating + tight lines
LaserSeries	P&E, T&E, PP&E	LDI 405 nm	Fine	LDI-equipped lines
DI8600	Inner + outer layer	LDI multi-wavelength	70–100 µm pitch	Balanced HDI
DI9000	Tent/etch HDI	LDI multi-wavelength	70–100 µm pitch	HDI resolution
DI6100M	mSAP / SLP	LDI i-line + h-line	6 µm	Smartphone SLP substrates

DuPont Interra: Embedded Capacitance for High-Speed Multilayer PCBs

Interra is the most specialized of the four DuPont PCB material families, and the one least familiar to engineers outside of high-speed digital design. It’s a thin copper-clad laminate — extremely thin — whose function is to act as a distributed embedded capacitor within a multilayer board’s power distribution network (PDN), not to carry signal traces.

The Problem Interra Solves

Every high-speed digital board needs bypass capacitors to decouple the power supply from the noise generated by simultaneously switching logic devices. Conventional practice is to place discrete SMT ceramic capacitors on the board surface adjacent to power pins. But at multi-gigabit data rates, those SMT capacitors have too much parasitic inductance from their mounting pads and the via stubs connecting them to the power plane. The inductance turns them into band-pass filters rather than bypasses at the frequencies where switching noise actually occurs.

Interra solves this by embedding capacitance directly between the power and ground planes of the PCB stackup. Interra HK04M provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. It replaces surface mount by-pass capacitors and their plated-through-holes, which improves the reliability, design flexibility, packaging size and cost of the PWB.

Interra HK04J — The Established Standard

HK04J is the production-proven grade of embedded capacitance laminate, used in high-speed multilayer PCBs for servers, routers, telecom backpanels, military/aerospace boards, and GPU cards. It uses an all-polyimide dielectric layer in 12 µm or 25 µm thicknesses, laminated between reverse-treated electrodeposited copper in ½ oz, 1 oz, or 2 oz weights.

Key specifications for HK04J:

Property	25 µm Dielectric	12 µm Dielectric
Dielectric constant (Dk) at 1 MHz	3.5	3.5
Capacitance density	125 pF/cm² (0.8 nF/in²)	~260 pF/cm² (1.7 nF/in²)
Dielectric type	All-polyimide	All-polyimide
IPC certification	IPC-4562 Grade 3	IPC-4562 Grade 3

The all-polyimide dielectric in HK04J will not delaminate during standard PWB processing, and the film’s flexibility gives it high initiation and propagation tear strengths — a critical practical benefit when processing what is essentially a very thin flexible laminate through the develop/etch/strip steps in a rigid board process.

HK04J is compatible with double-sided processing and can be imaged and etched simultaneously on both copper sides of the dielectric, enabling patterned power islands if the design requires it rather than solid continuous power planes.

Interra HK04M — Higher Capacitance Density

HK04M is the next-generation Interra grade, offering capacitance density up to 240 pF/cm² at 12 µm dielectric thickness — roughly double the 25 µm HK04J grade. For dense HDI boards with many switching devices per square inch, the higher capacitance density reduces the number of Interra layers needed to meet PDN impedance targets. HK04M maintains the same Dk of 3.5 across its dielectric thickness range, ensuring predictable PDN modeling.

DuPont Interra thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide-based dielectric. This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards.

Where Interra Fits in a PCB Stackup

In practice, Interra laminates are processed as embedded layers within the board, sitting between power and ground planes in the inner layer stackup. They don’t carry routed signal traces. A typical application might replace hundreds of SMT bypass capacitors on a server motherboard with one or two Interra core layers in the stackup — reducing board layer count, component count, assembly cost, and improving PDN performance simultaneously.

Applications targeting Interra include high-speed multilayer boards in servers, routers, telecom infrastructure, backpanels, military electronics, and GPU boards with high SMT capacitor density.

How to Choose the Right DuPont PCB Material for Your Application

The selection logic for DuPont PCB materials follows the board type first, then the specific performance requirements within that type.

Material Selection Guide by Board Type and Requirement

Board Type	Primary Material Need	DuPont Product	Key Selection Driver
Rigid board, standard	Photoresist only	Riston TentMaster / PlateMaster	Process chemistry (etch vs. plate)
Rigid board, high-speed	Embedded decoupling	Interra HK04J or HK04M	PDN impedance, switching frequency
Single-sided flex, consumer	Flex laminate	Pyralux LF	Cost, availability, UL rating
Double-sided flex, high-reliability	Flex laminate	Pyralux AP	Thermal stability, signal integrity
Flex, extreme temperature	Flex laminate	Pyralux HT	MOT >200°C
Rigid-flex, high-frequency	Laminate + adhesive	Pyralux AP + GPL bondply	Low loss at high frequency
Flex, low-loss RF/microwave	Flex laminate	Pyralux HP	Insertion loss, Dk stability
HDI rigid, LDI imaging	Photoresist	Riston DI8600 / DI9000	Feature pitch, LDI wavelength
SLP / smartphone substrate	Photoresist	Riston DI6100M	Sub-10 µm line resolution
Thermal management flex	Flex laminate	Pyralux ML	Thermal conductivity, EV/aerospace
Prototype-to-volume flex	Flex laminate	Pyralux AG	Global supply availability

Useful Resources and Datasheet Downloads for DuPont PCB Materials

These datasheets and technical resources are worth bookmarking. Many are publicly available PDFs from distributors or DuPont directly.

Resource	Description	Link
DuPont Laminates Overview	Official product page covering all Pyralux, Interra, and adhesive systems	dupont.com/electronics-industrial/laminates
Kapton Polyimide Films Page	Full Kapton grade listing and overview	dupont.com/kapton
Kapton HN General Specifications (PDF)	Complete property tables for Kapton HN, FN, and VN	electro-wind.com PDF
Kapton HN Technical Datasheet (PDF)	Temperature range, electrical, mechanical properties	rs-online PDF
Pyralux AP Laminate Datasheet (PDF)	Full AP electrical and mechanical specs	multi-circuit-boards.eu PDF
Pyralux FR Coverlay Datasheet (PDF)	FR coverlay construction and properties	epectec.com PDF
Interra HK04J Datasheet (PDF)	HK04J product codes, capacitance density, specifications	dupont.com PDF
Interra HK04M Product Page	HK04M specifications and application guidance	dupont.com
Riston Dry Film Photoresist Page	Full Riston product lineup	dupont.com/dry-film
Riston PM200 Datasheet (PDF)	PlateMaster PM200 process parameters	allenwoodsgroup.com PDF
Riston LDI7300 Datasheet (PDF)	LaserSeries direct imaging parameters	insulectro.com PDF
Insulectro DuPont Supplier Page	North American distributor with full product listings	insulectro.com/suppliers/dupont
CCI Eurolam Pyralux Page	European distributor resource	ccieurolam.com
DuPont PCB Materials Reference	Broader PCB application context	pcbsync.com/Dupont-pcb/

Frequently Asked Questions About DuPont PCB Materials

Q1: What is the difference between Pyralux AP and Pyralux LF, and which should I specify?

The fundamental difference is construction. Pyralux LF is a three-layer system — copper foil, acrylic adhesive, Kapton polyimide film. Pyralux AP is a two-layer adhesiveless all-polyimide system — copper bonded directly to polyimide without adhesive. For low-cost consumer electronics with moderate reliability requirements, LF is the economical and proven choice. For high-reliability, military, aerospace, or any application where you’re running controlled-impedance lines at high frequencies, AP is the right specification: its Dk of 3.4 and Df of 0.002 are significantly better than acrylic-adhesive systems, and its thermal stability far exceeds LF’s limits.

Q2: Can DuPont Riston dry film photoresist be used with any PCB laminate, including Pyralux flex materials?

Yes, with some important caveats. Riston is used to pattern the copper layers regardless of whether the underlying laminate is FR-4, Pyralux, or any other substrate. However, the lamination and development parameters need to be adjusted for flex substrates — particularly lamination temperature, which affects the polyimide film’s dimensional stability. For fine-line work on flex substrates, the YieldMaster wet lamination system provides better resist adhesion than dry lamination. Confirm compatibility between your specific Riston grade and flex processing with DuPont’s application engineering team for production qualification.

Q3: How does DuPont Interra embedded capacitance actually replace SMT bypass capacitors, and does it eliminate all of them?

Interra provides distributed broadband capacitance that targets the high-frequency noise above the effective frequency range of SMT capacitors. It doesn’t eliminate all SMT capacitors — bulk capacitors at lower frequencies still need to be placed on the board surface. What Interra eliminates is the high-frequency decoupling capacitors, typically those in the 1–10 nF range placed immediately adjacent to power pins of high-speed ICs. Real-world implementations have shown reductions of 800 to 2,000+ SMT capacitors on high-density server and telecom boards, while improving PDN performance at multi-gigabit frequencies simultaneously.

Q4: What DuPont PCB material is appropriate for flex circuits in electric vehicles (EV) powertrain applications?

EV powertrain is one of the most demanding flex circuit environments: high operating temperatures, thermal cycling, vibration, and increasingly high-frequency switching from inverters. The right material depends on the specific subsystem. For under-hood general wiring interconnects at moderate temperatures, Pyralux AP is well-proven. For inverter-adjacent applications approaching or exceeding 200°C continuous service, Pyralux HT is the correct specification. For thermal management components — heat spreaders, flexible heaters, sensors — the new Pyralux ML with its copper-nickel alloy cladding and Kapton dielectric is DuPont’s current offering specifically targeting this application space.

Q5: Where can I get DuPont PCB material qualification data for IPC or military specifications?

Most Riston, Pyralux, and Interra products are certified to relevant IPC standards. Interra HK04J and HK04M, for example, are certified to IPC-4821/1 and IPC-4562 Grade 3. Pyralux AP is certified per IPC-4204/11. Kapton HN meets ASTM D-5213 and MIL-P-46112. For military-specific qualification data (MIL-PRF-55110, MIL-PRF-50884, etc.), contact your DuPont authorized distributor — Insulectro and Allen Woods Group in North America carry application engineering support as well as printed qualification documentation. DuPont’s own distributor portal at insulectro.com/suppliers/dupont is a good starting point.