Bergquist CML-11006 Ceramic Multi-Layer PCB: Datasheet & Design Guide

If you landed here searching for the Bergquist CML-11006 datasheet, you already know the answer to the basic product question: CML stands for Circuit Material Laminate, the Bergquist Thermal Clad prepreg product family designed for multi-layer IMS construction. What most online resources get wrong — or skip entirely — is why the “ceramic” framing matters to your design decision, what the 1.1 W/m-K thermal conductivity actually means for a real stackup, and where CML-11006 fits as a ceramic DBC replacement in power electronics packaging.

This guide goes further than a datasheet summary. It explains the material physics behind the CML dielectric, walks through every published specification from the official Bergquist Thermal Clad Selection Guide, and gives you a direct engineering answer to the question that actually drives most CML-11006 searches: when should I use this over a standard single-layer HT-04503 board, and when should I consider ceramic DBC instead?

Understanding the CML-11006 Ceramic Dielectric: What “Ceramic” Actually Means Here

The word “ceramic” in IMS context needs unpacking because it means something different than it does in DBC (Direct Bond Copper on alumina or AlN ceramic) packaging. In Bergquist Thermal Clad terminology, “ceramic” refers to the ceramic filler dispersed through the polymer matrix of the dielectric — not a monolithic ceramic substrate. Every product in the Thermal Clad family uses a ceramic-polymer composite dielectric: a proprietary blend of ceramic particles (providing thermal conductivity and dielectric strength) suspended in a polymer resin (providing adhesion, electrical isolation, and mechanical compliance). The ceramic content of the filler directly determines thermal conductivity and dielectric strength.

Bergquist PCB CML-11006 carries that same ceramic-polymer architecture but adds a glass woven carrier — the key structural distinction that makes CML-11006 the only Thermal Clad product available in prepreg form. The glass fiber provides the mechanical integrity needed to handle the material as a freestanding B-stage sheet during multilayer lamination. The ceramic filler gives it the 1.1 W/m-K thermal conductivity that separates it from standard FR-4 prepreg at approximately 0.3 W/m-K. The combination of glass carrier and ceramic-polymer matrix is what makes CML-11006 function as a thermally upgraded prepreg — not as high-performance as the glass-free HT or HPL families, but far superior to anything FR-4 can provide in an interlayer position.

Understanding this architecture matters for a design decision that comes up regularly: “Can CML-11006 replace a ceramic substrate in my power module?” The answer is nuanced and depends on what your ceramic is doing. If it’s providing thermal management, CML-11006 at 1.1 W/m-K is vastly inferior to alumina at 24 W/m-K or AlN at 180 W/m-K — you need thermal vias to compensate. If it’s providing structural support and electrical isolation between two circuit layers in a multi-layer assembly, CML-11006 is a practical and mechanically robust alternative at substantially lower cost than ceramic, as long as your thermal and voltage requirements stay within spec.

Bergquist CML-11006 Official Datasheet Specifications

All specifications are from the Bergquist Thermal Clad Selection Guide (Bergquist document Q-6019). There is no separate standalone CML-11006 TDS — the Selection Guide master dielectric table is the primary published specification source for this material.

CML-11006 Thermal Specifications

Parameter	CML-11006 Value	Test Method
Dielectric Thermal Conductivity	1.1 W/m-K	Extended ASTM D5470
Thermal Resistance	0.21 °C·in²/W	Calculated from ASTM D5470
Thermal Impedance	1.1 °C/W	Internal TO-220 test (Bergquist RD2018)

The 1.1 W/m-K dielectric thermal conductivity is the direct result of the glass woven carrier diluting the ceramic-polymer composite. Glass fiber thermal conductivity is approximately 1 W/m-K — lower than the ceramic filler in the HT and LTI matrix systems at 2.2 W/m-K — so weaving glass through the composite pulls the effective conductivity down. This is not a design flaw; it is the physics of any glass-reinforced laminate. Standard FR-4 prepreg with its lower ceramic loading sits at approximately 0.3 W/m-K — CML-11006 at 1.1 W/m-K is a 3.7× improvement over FR-4 in the same prepreg format. But it does sit at the lower end of the Thermal Clad family performance range, and that has direct implications for how you must design to compensate.

The thermal resistance of 0.21 °C·in²/W, and the corresponding 1.1 °C/W thermal impedance measured by the standard TO-220 test, are the highest of any Thermal Clad dielectric. A 10 W device on a 1 cm² pad contributes approximately 13.5°C across the CML-11006 interlayer before reaching the metal base. The engineering response to this — thermal via arrays that bypass the dielectric with copper — is not optional for high-power designs. It is the fundamental design technique that makes CML-11006 viable for power electronics.

CML-11006 Electrical Specifications

Parameter	CML-11006 Value	Test Method
Dielectric Constant (Permittivity)	7	ASTM D150
AC Breakdown Voltage	10.0 kVAC	ASTM D149
Typical Proof Test Voltage	2500 VDC	500 V/sec ramp, 5 sec hold

The 10.0 kVAC AC breakdown voltage deserves emphasis: despite being the lowest thermal performer in the Thermal Clad family, CML-11006 is the second-highest voltage-isolation performer at the standard 6 mil dielectric thickness. The 6 mil (150 µm) dielectric thickness that the glass carrier necessitates for the prepreg format also happens to be the thickness that pushes breakdown voltage well above the 3 mil class. For context: HT-04503 at 3 mil achieves 6.0 kVAC; HT-07006 at 6 mil achieves 11.0 kVAC. CML-11006 at 6 mil achieves 10.0 kVAC — slightly below the glass-free HT-07006 at the same thickness, because the glass weave introduces minor inconsistencies that reduce the worst-case breakdown margin, but well above anything needed for standard industrial power electronics.

The 2500 VDC typical proof test voltage is the standard fabrication hipot test for 6 mil dielectric IMS boards.

CML-11006 Mechanical and Agency Specifications

Parameter	CML-11006 Value	Test Method / Standard
Dielectric Thickness	6 mil (0.006″ / ~150 µm)	Optical
Glass Transition Temperature (Tg)	90°C	Internal MDSC test (RD2014)
UL RTI (Electrical / Mechanical)	130°C / 130°C	UL 746E
UL Flammability	V-0	UL 94
Peel Strength	10 lb/in (1.8 N/mm)	ASTM D2861
Solder Limit Rating	260°C / 60 seconds	UL Material Standard
Lead-Free Solder Compatible	Yes	—
RoHS Compliant	Yes	—

The peel strength of 10 lb/in (1.8 N/mm) is the highest in the entire Thermal Clad catalog — exceeding HT-04503 (6 lb/in), MP-06503 (9 lb/in), and HPL-03015 (5 lb/in). The glass weave carrier, which reduces thermal conductivity, simultaneously contributes to the highest interlayer bond strength in the family. In a pressed multi-layer stackup where CML-11006 bonds two copper-clad circuit layers under heat and pressure, that 10 lb/in peel strength is what resists delamination under thousands of thermal cycles over the product lifetime.

The 260°C/60-second solder limit is the tightest in the Thermal Clad family. SAC305 lead-free reflow peaks at 245–260°C, exactly at this limit. Profile management is mandatory: target peak at 250°C, not 260°C, with time above 217°C (SAC305 liquidus) kept to 30–45 seconds. AuSn eutectic solder at 280–320°C is outside this limit — designs requiring AuSn die attach must use HT-04503 on the base layer rather than CML-11006 as the prepreg if those processes must coexist.

CML-11006 vs FR-4 Prepreg: The Thermal Upgrade in Numbers

Parameter	CML-11006	Standard FR-4 Prepreg	Improvement
Dielectric Thermal Conductivity	1.1 W/m-K	~0.3 W/m-K	3.7× higher
Interlayer Thermal Resistance (6 mil)	0.21 °C·in²/W	~0.76 °C·in²/W	3.6× lower
Breakdown Voltage	10.0 kVAC	~1.5–2.0 kVAC	5–6× higher
Peel Strength	10 lb/in	~8–10 lb/in	Comparable
Flammability	V-0	V-0	Same
Max Solder Temp	260°C	260°C	Same
Cost	Higher	Lower	FR-4 cheaper

This comparison is the engineering justification for replacing FR-4 prepreg with CML-11006 in multilayer power electronics boards. Bergquist’s own guidance in the Selection Guide states that power conversion applications can be enhanced by substituting CML-11006 prepreg for FR-4 in multilayer constructions. The thermal resistance improvement alone — from 0.76 to 0.21 °C·in²/W at the interlayer — is significant for high-power-density boards where the interlayer thermal resistance is in the heat path.

CML-11006 in the Full Bergquist Thermal Clad Family Context

Complete Family Specification Table

Product	Format	Thickness	Conductivity	Thermal Resist.	Breakdown	Tg	UL RTI	Peel
HPL-03015	Laminate	1.5 mil	3.0 W/m-K	0.02 °C·in²/W	5.0 kVAC	185°C	140°C	5 lb/in
LTI-04503	Laminate	3 mil	2.2 W/m-K	0.05 °C·in²/W	6.5 kVAC	90°C	130/130°C	6 lb/in
HT-04503	Laminate	3 mil	2.2 W/m-K	0.05 °C·in²/W	6.0 kVAC	150°C	140/140°C	6 lb/in
MP-06503	Laminate	3 mil	1.3 W/m-K	0.09 °C·in²/W	8.5 kVAC	90°C	130/140°C	9 lb/in
LTI-07006	Laminate	6 mil	2.2 W/m-K	0.11 °C·in²/W	11.0 kVAC	90°C	130°C	6 lb/in
HT-07006	Laminate	6 mil	2.2 W/m-K	0.11 °C·in²/W	11.0 kVAC	150°C	140/140°C	6 lb/in
CML-11006	Prepreg	6 mil	1.1 W/m-K	0.21 °C·in²/W	10.0 kVAC	90°C	130/130°C	10 lb/in
HT-09009	Laminate	9 mil	2.2 W/m-K	0.16 °C·in²/W	20.0 kVAC	150°C	150/150°C	6 lb/in

CML-11006 is the sole prepreg in the table — every other product is a fully cured laminate. That prepreg format is the core differentiator, enabling the multi-layer construction capabilities that no other Thermal Clad product supports.

CML-11006 Multi-Layer Construction: Three Stackup Architectures

Architecture 1: Two-Layer Circuit Pair on Metal Base

The primary CML-11006 application as documented in the Bergquist Selection Guide. The stackup from top to bottom: top copper circuit layer (power components), CML-11006 prepreg interlayer (thermally conductive isolation), bottom copper circuit layer (control/logic), Thermal Clad dielectric laminate (HT-04503 or LTI-04503 typically), aluminum or copper metal base.

During fabrication, the CML-11006 prepreg B-stage sheet is stacked between the two copper-clad inner layers and pressed in a heated multilayer press. The prepreg flows slightly, fills micro-gaps, and cures — bonding the two circuit layers into a rigid assembly before the combination is laminated to the metal base.

The Bergquist Selection Guide explicitly shows thermal vias in this construction: drilled through both circuit layers and the CML-11006 interlayer, plated with copper, providing direct heat paths from the top copper layer to the bottom copper layer and onward to the metal base. Via density under power component thermal pads is the primary thermal design parameter for this construction.

Architecture 2: FR-4 Prepreg Replacement in Mixed Multilayer

CML-11006 replaces FR-4 prepreg 1080 or 2116 in the interlayer position of a conventional multilayer press. The outer layers use Thermal Clad HT-04503 laminates, and CML-11006 bonds them together. The result is a multilayer board with thermally conductive interlayer bonding at 1.1 W/m-K — 3.7× the thermal conductivity of the FR-4 prepreg it replaces — without the full complexity of a metal-base IMS construction. This is described in the Selection Guide as a route for power conversion designers to upgrade thermal performance beyond what standard FR-4 multilayer allows.

Architecture 3: Metal-Base-Free Ultra-Thin Circuit

CML-11006 bonds two copper-clad circuit layers without a metal base. The resulting board is a double-sided assembly of minimal total thickness — typically 0.5–0.8 mm including the copper layers and the CML-11006 interlayer — designed to mount directly into a heatsink cavity or bond to a chassis surface. The Bergquist Selection Guide describes this as a “ceramic submount replacement.” Component mounting is possible on both surfaces. This construction is used in module packaging, power hybrid assemblies, and applications where the standard aluminum base would add unacceptable thickness or weight.

CML-11006 vs Ceramic DBC: When Each Is the Right Choice

This comparison comes up in high-power module and power semiconductor packaging decisions where ceramic DBC has historically been the standard, and engineers evaluate whether CML-11006 provides an acceptable alternative.

Parameter	CML-11006 IMS	Alumina DBC	AlN DBC
Dielectric Thermal Conductivity	1.1 W/m-K	24 W/m-K	180 W/m-K
Thermal Resistance (6 mil dielectric)	0.21 °C·in²/W	~0.0005 °C·in²/W	Very low
Breakdown Voltage	10.0 kVAC	>15 kVAC	>15 kVAC
Mechanical Fragility	Ductile, punched/routed	Brittle, must be diced	Brittle, must be diced
Form Factor Flexibility	Large panel, arbitrary shapes	Limited by ceramic tile size	Limited
Current Carrying Capacity	High (heavy copper capable)	Lower (thick-film or thin copper)	Lower
Relative Cost	Medium	High	Very high
Thermal Via Compensation	Required for high power	Not applicable	Not applicable

For very high power density per unit area — bare SiC or GaN die at 100+ W/cm² — ceramic DBC remains superior because nothing compensates for a 200× difference in dielectric thermal conductivity. For designs where power density is moderate (under 20–30 W/cm²), the application requires large-format substrates (>50 × 50 mm), or the circuit needs to carry high currents through thick copper traces — all of which favor CML-11006 — the IMS multi-layer approach delivers competitive thermal performance (with via compensation) at significantly lower cost and without the fragility and limited form factor of ceramic.

The Bergquist Selection Guide includes this comparison explicitly under “DBC Replacement,” noting that Thermal Clad can replace large-area ceramic substrates and provides more current carrying capability than thick-film ceramic technology in its copper circuit layer.

Designing with CML-11006: Key Engineering Rules

Thermal Via Design Methodology

Since CML-11006 thermal resistance of 0.21 °C·in²/W is the highest in the Thermal Clad family, thermal vias are mandatory in any high-power design. Each copper-plated via (diameter typically 0.3–0.5 mm) drilled through the CML-11006 interlayer and plated with copper provides a conductance path through copper (385 W/m-K) rather than through the dielectric (1.1 W/m-K). To calculate the number of vias needed:

For a device dissipating P watts over a pad area A (cm²) with a target interlayer temperature rise of ΔT°C: Required thermal conductance G = P / ΔT (W/°C). Each 0.3 mm via with 25 µm copper plating contributes a thermal conductance of approximately 0.5–1.0 W/°C depending on plating thickness and via depth. A 20 W device targeting 5°C interlayer rise needs G = 4 W/°C, requiring approximately 4–8 vias under the thermal pad at 0.3 mm drill in a 1 mm pitch grid. Increase via count for tighter temperature budgets or higher power.

The Bergquist Selection Guide models this explicitly: well-designed thermal via arrays in CML-11006 two-layer constructions can match the device case temperature of single-layer designs.

Copper Weight Selection for CML-11006 Multi-Layer Boards

Layer Position	Copper Weight	Application
Top circuit (power)	2–4 oz (70–140 µm)	High current traces, FET thermal pads
Top circuit (signal/control)	1 oz (35 µm)	Gate drive traces, measurement circuits
Bottom circuit (control)	1–2 oz (35–70 µm)	Controller, gate driver, feedback network
Bottom circuit (heavy internal copper)	4–10 oz	High current bus bars, heat spreaders

The Selection Guide includes a notable example: a cross-sectional view of a heavy copper two-layer construction with 10 oz over 10 oz copper using HT dielectric on a 0.5 mm (0.020″) copper base heat spreader. CML-11006 supports equivalent heavy-copper constructions, enabling current bus applications where both high current-carrying capacity and interlayer thermal isolation are required simultaneously.

Lamination Process Requirements

CML-11006 requires a multilayer press cycle distinct from standard single-layer MCPCB lamination. Key parameters: the B-stage CML-11006 sheet must reach full cure temperature (typically 170–180°C) under controlled pressure in the multilayer press; ramp rate affects void formation at the interlayer interface; pressure must be sufficient for complete wetting of the copper surfaces but not so high as to squeeze out ceramic filler preferentially. Fabricators without specific CML-11006 lamination experience may apply FR-4 press cycles, which may under-cure the CML dielectric or produce voids at the interlayer — request production history confirmation before placing volume orders.

CML-11006 Applications in Power Electronics

DC-DC Power Converter Integration Modules

High-power-density brick and half-brick DC-DC converters (48 V bus to 12 V or 5 V output, 100–300 W) need to fit switching FETs, rectifiers, gate drivers, and PWM controller on a single thermally managed substrate. CML-11006 two-layer construction places power semiconductors on one copper layer and control circuitry on the other, with CML-11006 providing both the interlayer electrical isolation (10.0 kVAC) and thermal continuity (augmented by thermal vias) to the aluminum base.

Motor Drive and Variable Frequency Drive Power Modules

VFD power modules for 0.75–22 kW motors use IGBT or MOSFET power stages with gate driver and protection circuitry. CML-11006 multi-layer IMS allows the gate driver output to be on the board layer adjacent to the power transistor gate — minimizing the gate loop inductance that causes ringing and EMI in hard-switched topologies — while the power stage components and the control circuitry share a common thermally managed base.

Solid-State Relay Arrays and Power Semiconductor Modules

Multi-output SSR designs or thyristor power controllers where multiple power semiconductors and their trigger circuits must coexist on a compact, thermally managed substrate are natural CML-11006 applications. The 10.0 kVAC breakdown voltage provides adequate interlayer isolation for standard industrial voltages.

Telecom Power Supply and Server Power Delivery

Server power delivery networks and telecom base station rectifiers operate at 48 VDC bus, high component density, and demanding thermal environments. CML-11006 boards replace the two-board (power + control) assembly with a single integrated IMS substrate, reducing assembly cost and connector count.

Useful Resources for Bergquist CML-11006

Resource	Content	Link
Bergquist Thermal Clad Selection Guide (tjk.com.au)	Complete CML-11006 specification table, multi-layer construction diagrams, thermal via guidance, DBC replacement discussion, heavy copper examples — primary engineering reference	PDF
Bergquist Thermal Clad Selection Guide (Digikey)	Alternate hosted version with complete dielectric comparison data	PDF
Bergquist HT-04503 TDS (Henkel/mclpcb)	Primary single-layer HT laminate used as base layer dielectric in CML-11006 two-layer assemblies	PDF
Bergquist HT-07006 TDS (Henkel/mclpcb)	6 mil glass-free HT dielectric — comparison reference at same thickness with higher thermal conductivity	PDF
Henkel Electronics Portal	Current Thermal Clad product documentation, SDS, and technical support	henkel.com/electronics
IPC-2221B	PCB design standard — via design, current capacity, creepage and clearance rules for multi-layer IMS	ipc.org
IPC-6012	Qualification and performance specification for rigid PCBs — applicable for IPC class specification in CML-11006 fabrication	ipc.org
Digikey — Bergquist Thermal Clad	Stock and pricing for Bergquist IMS materials	digikey.com

FAQs: Bergquist CML-11006

Q1: Why is CML-11006 called a “ceramic” material when it only achieves 1.1 W/m-K thermal conductivity — far below actual ceramic substrates?

The “ceramic” in CML-11006 refers to the ceramic particle filler in the polymer matrix, not to a monolithic ceramic substrate. Every Bergquist Thermal Clad dielectric uses a ceramic-polymer composite: ceramic particles (aluminum oxide, boron nitride, or similar) dispersed in a polymer resin. The ceramic filler is what makes the Thermal Clad family thermally superior to standard FR-4 prepreg. CML-11006’s 1.1 W/m-K is lower than the glass-free Thermal Clad family members (2.2 W/m-K) because the glass woven carrier in the prepreg dilutes the ceramic-polymer composite conductivity. It is far above the 0.3 W/m-K of standard FR-4 prepreg, which also uses a polymer matrix but with much lower ceramic loading. Monolithic ceramic substrates (alumina at 24 W/m-K, AlN at 180 W/m-K) are not polymer composites at all — they are sintered ceramic with no polymer phase. CML-11006 bridges polymer-based IMS and monolithic ceramic in capability and cost, enabling multi-layer constructions at a cost and process compatibility level that ceramic technology cannot match at large-panel scale.

Q2: Can CML-11006 be ordered as a standalone prepreg sheet, and how is it different from what a fabricator typically uses?

CML-11006 is available as a raw prepreg material in panel form (standard Bergquist panel sizes are 18″ × 24″ and 20″ × 24″) through authorized Bergquist/Henkel distributors. Fabricators who process CML-11006 receive it in this B-stage prepreg sheet form, stack it with the inner-layer copper laminates, and cure it in a heated multilayer press. This is similar to how standard FR-4 prepreg (1080, 2116, 7628 styles) is handled in conventional multilayer board production — the process knowledge transfer for a multilayer PCB shop is not enormous, but CML-11006 requires different press parameters (higher cure temperature, specific pressure profile for the ceramic-polymer matrix) than standard FR-4 prepreg. Fabricators who have not run CML-11006 before should conduct a qualification lamination run before committing to production quantities.

Q3: What is the maximum power a CML-11006 two-layer board can handle without thermal vias, and at what point do vias become mandatory?

Without thermal vias, the CML-11006 interlayer presents 0.21 °C·in²/W of thermal resistance between the top and bottom circuit layers. For a device occupying 1 cm² of thermal pad area on the top layer, that equates to 1.35 °C/W per cm² of device footprint. If you allow 5°C of temperature rise budget across the CML-11006 interlayer alone, the maximum power without vias is approximately 3.7 W for a 1 cm² device. For most practical power electronics — a 20 W FET, a 10 W rectifier, a 50 W IGBT — that budget is far too tight, and thermal vias become not just recommended but essential. Designs with multiple low-power SMD components (passives, low-power ICs under 1 W each) on a top circuit layer separated from the power ground and heat-spreading copper on the bottom layer can operate without vias if total power density stays below roughly 3 W/cm². Above that threshold, design the via array first, then lay out the rest of the board around it.

Q4: How does CML-11006 compare to using Bond-Ply in a multi-layer construction, and when should I choose one over the other?

Bergquist Bond-Ply is a thermally conductive adhesive available in pressure-sensitive and heat-cured formats, used for bonding two substrates or assemblies together. CML-11006 prepreg and Bond-Ply serve different structural roles. CML-11006 is a stiff, cured prepreg interlayer that bonds two copper-clad circuit layers into a rigid printed wiring board stack — it becomes part of the PCB structure itself. Bond-Ply is used for bonding completed assemblies to heat sinks, bonding copper bus bars to substrates, or attaching ceramic spacers to Thermal Clad boards in hybrid constructions. Bond-Ply provides mechanical decoupling for mismatched CTE materials and is available in thin film form for minimal bondline thickness. For a two-layer IMS PCB construction where both circuit layers need to be integrated into one board through a standard multilayer press cycle, CML-11006 prepreg is the correct material. For bonding a completed board assembly to an external heat spreader or for adhesive joining of mismatched-CTE subassemblies, Bond-Ply is the appropriate choice.

Q5: What should I check in a CML-11006 fabricated board before accepting it from a fabricator?

For production acceptance of CML-11006 multi-layer IMS boards, specify and verify the following: (1) Interlayer electrical hipot test at 2500 VDC minimum, with ramp rate controlled to avoid capacitive nuisance trips — accept only boards with zero failures; (2) Request Certificate of Conformance with Bergquist CML-11006 lot number traceable to Henkel production — this confirms the dielectric is genuine Bergquist material, not a generic ceramic-filled prepreg substitute; (3) Delamination inspection — cross-section one board per panel per lot under optical or SEM to confirm CML-11006 interlayer is fully cured with no voids at the copper-dielectric interface, especially under high-power component pad areas; (4) Thermal via continuity — verify electrical continuity of thermal vias from top to bottom copper layer with four-wire resistance measurement; plated thermal vias should read below 10 mΩ, indicating full copper barrel; (5) Copper weight verification — measure outer and inner copper layer thickness at multiple points to confirm ordered copper weight was achieved, particularly on heavy-copper power layers where electrodeposition uniformity affects both current carrying and thermal spreading; (6) Confirm solder mask and surface finish specifications match your assembly process requirements, particularly maximum reflow temperature being profiled below CML-11006’s 260°C solder limit.

Conclusion: Where CML-11006 Belongs in Your Design

Bergquist CML-11006 occupies a specific and valuable position in power electronics substrate design: it is the thermally conductive prepreg that enables genuine two-layer IMS construction within the Bergquist Thermal Clad system. Its ceramic-polymer-glass composite delivers 3.7× better interlayer thermal conductivity than standard FR-4 prepreg, a 10.0 kVAC breakdown voltage that exceeds all 3 mil Thermal Clad dielectrics, and the highest peel strength in the family at 10 lb/in — all in a prepreg format compatible with standard multilayer press processes.

The design rules are clear: use thermal vias for any component dissipating more than a few watts, stay within the 260°C SAC305 reflow profile, keep continuous operation within the 130°C UL RTI, and confirm your fabricator has CML-11006 lamination experience. Specify it as Bergquist CML-11006 prepreg — not generic ceramic prepreg — and require lot traceability.