The AMD XC2S200-6FGG479C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This cost-effective programmable logic device delivers exceptional functionality with 200,000 system gates, making it an ideal solution for engineers seeking reliable digital design capabilities without the overhead costs of custom ASICs.

Overview of AMD XC2S200-6FGG479C FPGA

The XC2S200-6FGG479C represents the flagship device within the Spartan-II series, offering the highest logic density available in this product line. Built on mature 0.18μm CMOS technology with a 2.5V core voltage, this FPGA provides proven reliability for mission-critical embedded applications. The device operates at frequencies up to 263 MHz, ensuring adequate performance for demanding digital signal processing and control system implementations.

Engineers worldwide choose the Xilinx FPGA platform for its combination of flexibility, performance, and comprehensive development ecosystem. The Spartan-II architecture continues to serve countless industrial, automotive, and consumer electronics applications where proven reliability matters most.

Key Specifications of XC2S200-6FGG479C

Logic Resources and Capacity

The XC2S200-6FGG479C delivers substantial programmable logic resources suitable for complex digital designs:

• System Gates: 200,000 equivalent gates (including logic and RAM)
• Logic Cells: 5,292 configurable logic cells
• CLB Array: 28 × 42 matrix providing 1,176 total CLBs
• Slices: 2,352 logic slices for flexible resource allocation

Memory Architecture Specifications

This Spartan-II FPGA incorporates both distributed and block RAM configurations:

• Distributed RAM: 75,264 bits of flexible LUT-based memory
• Block RAM: 56 Kbits organized in dedicated memory columns
• Dual-Port Capability: Block RAM supports true dual-port operation
• Maximum RAM Bandwidth: Synchronous read and write operations

I/O Features and Connectivity

The XC2S200-6FGG479C provides extensive I/O capabilities:

• Maximum User I/O: 284 programmable pins
• Package Type: Fine-pitch Ball Grid Array (FBGA)
• I/O Standards: Support for 16+ industry-standard interfaces including LVTTL, LVCMOS, PCI, GTL, and SSTL

Clocking and Timing Resources

• Delay-Locked Loops: 4 integrated DLLs for clock management
• Clock Distribution: Global clock networks with low-skew routing
• Maximum Frequency: Up to 263 MHz system clock support

Speed Grade Explanation for -6 Designation

The “-6” suffix in XC2S200-6FGG479C indicates the fastest commercially available speed grade for Spartan-II devices. This speed grade is exclusively offered in the commercial temperature range (0°C to +85°C), providing optimal timing performance for applications where maximum operating frequency is critical.

Speed Grade Comparison

Package Information: FGG479 BGA Configuration

Physical Package Characteristics

The FGG479 designation indicates a Fine-pitch Ball Grid Array package with Pb-free (lead-free) solder ball composition. The “G” character in the part number confirms RoHS compliance through lead-free manufacturing:

• Package Style: Fine-pitch BGA
• Ball Count: 479 solder balls
• Ball Pitch: 1.0 mm
• Package Dimensions: 23 mm × 23 mm footprint
• Environmental Compliance: RoHS compliant (Pb-free)

Thermal Considerations

Proper thermal management ensures reliable operation:

• Junction Temperature Range: 0°C to +85°C (commercial)
• Thermal Resistance: Optimized BGA thermal path
• Power Dissipation: Design-dependent, requires thermal analysis

Industrial Applications for XC2S200-6FGG479C FPGA

Protocol Bridging and Interface Conversion

The Spartan-II architecture excels at implementing protocol translation between different communication standards. Common bridging applications include:

• Legacy-to-modern interface conversion
• Multi-protocol gateway implementations
• Custom bus interface adapters
• Real-time data format translation

Motor Control and Industrial Automation

Engineers deploy the XC2S200-6FGG479C in industrial control systems requiring:

• PWM generation for motor drives
• Encoder interface processing
• PID controller implementations
• Safety interlock logic

Consumer Electronics Integration

The cost-optimized nature of Spartan-II makes it suitable for:

• Display controller applications
• Audio processing systems
• Video timing generators
• Peripheral interface expansion

Automotive Infotainment Systems

Vehicle electronics benefit from Spartan-II capabilities in:

• Display interface management
• Audio routing and processing
• Communication gateway functions
• Sensor data aggregation

Design Tool Support and Development Environment

ISE Design Suite Compatibility

The XC2S200-6FGG479C is fully supported by the ISE Design Suite, providing a complete development workflow:

• Schematic capture and HDL entry
• Synthesis and implementation tools
• Timing analysis and verification
• Bitstream generation and programming

HDL Language Support

Designers can implement their logic using industry-standard languages:

• Verilog HDL for hardware description
• VHDL for complex system modeling
• Mixed-language projects supported
• IP core integration capabilities

Simulation and Verification

Comprehensive verification tools ensure design correctness:

• Behavioral simulation
• Post-synthesis timing verification
• Post-implementation analysis
• Hardware debugging support

Advantages Over Custom ASIC Solutions

Cost-Effective Development

The XC2S200-6FGG479C eliminates significant ASIC-related expenses:

• No mask charges or NRE costs
• Reduced development timeline
• Lower minimum order quantities
• Simplified inventory management

Design Flexibility Benefits

Programmable logic provides inherent advantages:

• Field-upgradable functionality
• Last-minute design changes possible
• Multiple design iterations without hardware changes
• Rapid prototyping capabilities

Risk Mitigation

Choosing FPGA over ASIC reduces project risks:

• Proven silicon eliminates fabrication uncertainty
• Shorter time-to-market
• Design reuse across product variants
• Simplified qualification process

Ordering Information and Part Number Breakdown

Part Number Structure Explained

XC2S200-6FGG479C decodes as follows:

Alternative Part Numbers

Related devices in the same family include:

• XC2S200-5FGG456I (industrial temperature, -5 speed)
• XC2S200-5FGG456C (commercial, -5 speed)
• XC2S200-6PQG208C (PQFP package option)

Technical Documentation Resources

Essential Reference Documents

Engineers should consult the following resources:

• Spartan-II Family Data Sheet (DS001)
• Spartan-II User Guide
• Package Pinout Specifications
• ISE Design Suite Documentation

Design Support Materials

Additional resources for successful implementation:

• Application notes and design examples
• Reference designs for common applications
• PCB layout guidelines
• Thermal design recommendations

Migration and Long-Term Support Considerations

Product Lifecycle Status

AMD (formerly Xilinx) has demonstrated commitment to supporting Spartan-II devices. Engineers should verify current product status and consider:

• Long-term availability requirements
• Migration paths to newer FPGA families
• Last-time-buy notifications
• Alternative sourcing options

Upgrade Path Options

For new designs requiring enhanced capabilities, consider:

• Spartan-6 for similar cost optimization
• Artix-7 for improved performance
• Spartan-7 for latest-generation features

Conclusion: Why Choose XC2S200-6FGG479C

The AMD XC2S200-6FGG479C Spartan-II FPGA remains a viable solution for embedded applications requiring proven reliability, adequate logic density, and cost-effective programmable logic. Its combination of 200,000 system gates, comprehensive I/O support, and mature development tools makes it particularly suitable for industrial control, protocol bridging, and legacy system maintenance applications.

For engineers maintaining existing products or implementing well-defined functionality without cutting-edge requirements, the Spartan-II family continues to deliver value through its established track record and available design resources.