The AMD XC2S200-6FGG478C is a powerful Field Programmable Gate Array from the renowned Spartan-II family, delivering exceptional digital processing capabilities for demanding electronic design applications. This 478-pin Fine-Pitch Ball Grid Array (FBGA) device combines high logic density with superior performance, making it an ideal choice for telecommunications, industrial automation, and embedded systems development.
XC2S200-6FGG478C Key Features and Specifications
The XC2S200-6FGG478C represents the flagship member of the Spartan-II FPGA family, offering impressive technical specifications designed for complex digital implementations.
System Gate Count and Logic Resources
This FPGA delivers 200,000 system gates with 5,292 logic cells arranged in a 28 x 42 Configurable Logic Block (CLB) array. The device contains 1,176 total CLBs, providing ample resources for implementing sophisticated digital circuits including state machines, arithmetic units, and custom peripheral interfaces.
Memory Architecture
The XC2S200-6FGG478C features a comprehensive memory architecture combining 56K bits of dedicated Block RAM with 75,264 bits of distributed RAM. This dual-memory approach enables designers to implement high-speed data buffers, lookup tables, and register files without consuming additional logic resources.
Input/Output Capabilities
With 284 maximum user I/O pins, the device supports extensive connectivity options for interfacing with external components. The I/O architecture supports 16 different electrical standards, ensuring seamless integration with various system voltages and communication protocols.
Technical Specifications Overview
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Block RAM |
56K bits |
| Distributed RAM |
75,264 bits |
| Maximum User I/O |
284 |
| Package Type |
478-Pin FBGA |
| Core Voltage |
2.5V |
| Speed Grade |
-6 |
| Temperature Range |
Commercial (0°C to 85°C) |
| Process Technology |
0.18µm |
| Maximum Frequency |
263 MHz |
XC2S200-6FGG478C Architecture Details
Configurable Logic Blocks
Each CLB in the XC2S200-6FGG478C contains four logic cells organized into two slices. Every slice includes two 4-input function generators (lookup tables), carry logic, arithmetic logic, and two storage elements. This architecture enables efficient implementation of combinatorial and sequential logic functions.
Delay-Locked Loop Technology
The device incorporates four Delay-Locked Loops (DLLs), positioned at each corner of the die. These DLLs provide zero-propagation-delay clock distribution and low clock skew between output signals. The DLL technology supports clock frequencies up to 200 MHz while maintaining precise timing relationships across the entire device.
Block RAM Configuration
The 56K bits of Block RAM are organized in columns positioned between the CLB array and I/O blocks. Each Block RAM module can be configured as single-port or dual-port memory with synchronous read and write operations. Supported configurations include 4K x 1, 2K x 2, 1K x 4, 512 x 8, and 256 x 16 organizations.
Package Information: 478-Pin FBGA
The FGG478C package designation indicates a Fine-Pitch Ball Grid Array with 478 balls. The “G” character signifies Pb-free (lead-free) packaging, ensuring compliance with RoHS environmental directives. This surface-mount package offers excellent thermal performance and signal integrity characteristics essential for high-speed digital designs.
Package Dimensions and Mounting
The 478-ball FBGA package provides optimal board space utilization while maintaining excellent electrical performance. The fine-pitch ball arrangement enables dense routing on multilayer printed circuit boards, supporting complex system implementations in space-constrained applications.
Speed Grade -6 Performance Characteristics
The -6 speed grade represents the fastest performance tier available in the Spartan-II commercial range. This designation ensures optimized timing parameters for high-frequency operation, including reduced propagation delays through logic elements and enhanced setup/hold timing margins.
Industrial Applications for XC2S200-6FGG478C
Telecommunications and Networking
The XC2S200-6FGG478C excels in telecommunications infrastructure applications including protocol processing, data routing, and signal conditioning. Its high logic density and fast operating frequency support implementation of complex communication interfaces and real-time data processing algorithms.
Industrial Automation and Control
Manufacturing and process control systems benefit from the device’s reliable performance and extensive I/O capabilities. Applications include motor control systems, programmable logic controllers, sensor interfaces, and factory automation equipment.
Medical and Scientific Instrumentation
The FPGA’s precise timing characteristics and configurable architecture make it suitable for medical imaging systems, diagnostic equipment, and laboratory instruments requiring custom digital signal processing implementations.
Embedded Systems Development
Designers developing embedded platforms leverage the XC2S200-6FGG478C for implementing custom peripherals, hardware accelerators, and system-on-chip prototypes. The device’s in-system programmability enables rapid design iterations and field upgrades.
Development Tools and Design Support
The XC2S200-6FGG478C is fully supported by the Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. Engineers can develop using industry-standard hardware description languages including VHDL and Verilog.
Configuration Options
The device supports multiple configuration modes including Master Serial, Slave Serial, Master Parallel, and JTAG boundary scan. Configuration data can be stored in external PROMs, flash memory, or loaded dynamically from a processor or microcontroller.
Why Choose the AMD XC2S200-6FGG478C
The XC2S200-6FGG478C offers compelling advantages over mask-programmed ASICs and alternative programmable logic solutions. Its field-programmable architecture eliminates lengthy ASIC development cycles and associated NRE costs while enabling in-field design updates without hardware replacement.
For engineers seeking a reliable, high-performance FPGA solution with proven architecture and extensive design resources, the XC2S200-6FGG478C delivers exceptional value. The combination of high logic density, abundant memory resources, and fast operating speeds addresses diverse digital design challenges across multiple industry segments.
Explore our complete selection of Xilinx FPGA products for your next electronic design project.
Ordering Information
Part Number: XC2S200-6FGG478C
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (fastest commercial)
- FG: Fine-Pitch BGA package
- G: Pb-free packaging
- 478: Pin count
- C: Commercial temperature range (0°C to 85°C)
Related Spartan-II FPGA Devices
| Device |
System Gates |
Logic Cells |
Max I/O |
Block RAM |
| XC2S15 |
15,000 |
432 |
86 |
16K |
| XC2S30 |
30,000 |
972 |
92 |
24K |
| XC2S50 |
50,000 |
1,728 |
176 |
32K |
| XC2S100 |
100,000 |
2,700 |
176 |
40K |
| XC2S150 |
150,000 |
3,888 |
260 |
48K |
| XC2S200 |
200,000 |
5,292 |
284 |
56K |