The XC2S200-6FGG477C is a high-performance Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan-II family. This 200,000 system gate FPGA delivers exceptional programmable logic capabilities for industrial, telecommunications, and embedded system applications. Designed with advanced 0.18µm CMOS technology, the XC2S200-6FGG477C offers engineers a cost-effective alternative to mask-programmed ASICs with unlimited reprogrammability.
XC2S200-6FGG477C Key Features and Benefits
The XC2S200-6FGG477C combines robust architecture with flexible I/O capabilities, making it an ideal choice for complex digital designs requiring high-speed performance and reliability.
High-Capacity Programmable Logic Resources
The XC2S200-6FGG477C features 5,292 logic cells organized in a 28×42 CLB (Configurable Logic Block) array, providing 1,176 total CLBs for implementing sophisticated digital circuits. This generous logic capacity supports complex designs including digital signal processing, protocol conversion, and custom controller applications.
Advanced Memory Architecture
This Xilinx FPGA integrates a dual-memory architecture optimized for diverse application requirements:
- Block RAM: 56 Kbits of dedicated block RAM organized in 4-Kbit configurable modules
- Distributed RAM: 75,264 bits of LUT-based distributed RAM for local data storage
- Total Memory Capacity: Over 131,000 bits of on-chip memory resources
High-Speed -6 Speed Grade Performance
The -6 speed grade designation indicates optimized timing characteristics for high-frequency applications. The XC2S200-6FGG477C supports system clock frequencies up to 263 MHz, enabling real-time signal processing and high-throughput data handling capabilities.
XC2S200-6FGG477C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| DLLs |
4 |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V / 2.5V / 3.3V |
| Technology |
0.18µm CMOS |
| Speed Grade |
-6 |
| Package Type |
FGG (Fine-Pitch BGA, Pb-Free) |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG477C Package Information
FGG477 Fine-Pitch Ball Grid Array Package
The FGG477 package offers a high-density BGA configuration with Pb-free (RoHS compliant) ball finish. The “G” designator in FGG indicates lead-free solder balls, making the XC2S200-6FGG477C fully compliant with environmental regulations for electronics manufacturing.
Package Characteristics
- Package Style: Fine-Pitch Ball Grid Array (FBGA)
- Pin Count: 477 balls
- Ball Pitch: 1.0mm
- RoHS Compliance: Yes (Pb-Free)
- Moisture Sensitivity Level: MSL-3
XC2S200-6FGG477C I/O Capabilities
Versatile I/O Standards Support
The XC2S200-6FGG477C supports 16 different I/O signaling standards, providing exceptional interface flexibility for mixed-voltage system designs:
- LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
- PCI (3.3V, 33 MHz and 66 MHz compliant)
- GTL and GTL+
- HSTL Class I, II, III, IV
- SSTL2 Class I and II
- SSTL3 Class I and II
- CTT
- AGP-2X
Programmable I/O Features
Each I/O block provides programmable slew rate control, drive strength adjustment, and optional weak pull-up/pull-down resistors. The zero hold time architecture simplifies system timing constraints and improves design reliability.
XC2S200-6FGG477C Clock Management
Four Dedicated Delay-Locked Loops (DLLs)
The XC2S200-6FGG477C integrates four DLLs positioned at each corner of the die for advanced clock management:
- Clock deskewing and phase shifting
- Clock multiplication and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
- Duty cycle correction
- Low-jitter clock distribution
Global Clock Distribution Network
Four primary low-skew global clock networks ensure precise clock delivery across the entire device, supporting multi-clock domain designs and complex timing requirements.
XC2S200-6FGG477C Applications
The XC2S200-6FGG477C excels in numerous industrial and commercial applications:
Telecommunications and Networking
- Protocol bridging and conversion
- Network interface cards
- Base station controllers
- VoIP gateway equipment
Industrial Automation
- Motor control systems
- Programmable logic controllers
- Process automation
- Machine vision preprocessing
Consumer Electronics
- Digital video processing
- Audio signal processing
- Display controllers
- Gaming peripherals
Medical and Scientific Instruments
- Data acquisition systems
- Signal conditioning
- Medical imaging preprocessing
- Laboratory automation
XC2S200-6FGG477C Configuration Options
Supported Configuration Modes
The XC2S200-6FGG477C supports multiple configuration methods for maximum design flexibility:
- Master Serial Mode: Uses external PROM for standalone operation
- Slave Serial Mode: Configuration from external processor or controller
- Slave Parallel Mode: 8-bit parallel configuration interface
- JTAG/Boundary Scan Mode: IEEE 1149.1 compliant configuration
Configuration Data Size
The XC2S200 requires approximately 1,335,840 bits (167 KB) of configuration data, compatible with standard Xilinx Platform Flash and third-party configuration memories.
XC2S200-6FGG477C Development Support
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG477C is fully supported by the Xilinx ISE Design Suite, providing comprehensive tools for:
- HDL synthesis (VHDL and Verilog)
- Schematic capture
- Constraint-driven place and route
- Static timing analysis
- Simulation and verification
Design Resources
Engineers can access extensive documentation including datasheets, user guides, application notes, and reference designs to accelerate development timelines.
Why Choose XC2S200-6FGG477C for Your Design
Cost-Effective ASIC Alternative
The XC2S200-6FGG477C eliminates the high NRE (Non-Recurring Engineering) costs associated with custom ASIC development while maintaining competitive per-unit pricing for volume production.
Field Upgradability
Unlike fixed-function ASICs, the XC2S200-6FGG477C enables in-system reprogramming for feature additions, bug fixes, and design optimizations without hardware changes.
Reduced Time-to-Market
Programmable logic technology accelerates product development cycles, enabling faster prototyping and iterative design improvements compared to traditional ASIC flows.
Long-Term Availability
The Spartan-II family benefits from established manufacturing processes and broad industry adoption, ensuring reliable supply chain availability for production programs.
XC2S200-6FGG477C Ordering Information
Part Number Breakdown
XC2S200-6FGG477C
| Code |
Description |
| XC2S200 |
Spartan-II, 200K system gates |
| -6 |
Speed grade (highest performance) |
| FG |
Fine-pitch BGA package |
| G |
Pb-free (RoHS compliant) |
| 477 |
Pin count |
| C |
Commercial temperature (0°C to +85°C) |
Conclusion
The XC2S200-6FGG477C Spartan-II FPGA delivers an optimal balance of performance, capacity, and cost-effectiveness for demanding programmable logic applications. With 200,000 system gates, comprehensive memory resources, flexible I/O standards, and advanced clock management features, this device enables engineers to implement complex digital designs efficiently. Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG477C provides the programmable logic foundation for success.