The XC2S200-6FGG473C is a high-performance Field Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-II family. This 200,000 system gate FPGA delivers exceptional programmable logic capabilities for industrial, telecommunications, and embedded applications. Engineers seeking cost-effective ASIC alternatives will find the XC2S200-6FGG473C an ideal solution for rapid prototyping and production deployment.
XC2S200-6FGG473C Key Features and Benefits
The XC2S200-6FGG473C combines advanced architecture with reliable performance. This Xilinx FPGA offers significant advantages over traditional mask-programmed ASICs, including unlimited reprogrammability and shorter development cycles.
Core Architecture Specifications
The XC2S200-6FGG473C features a robust internal architecture designed for demanding digital applications:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
| Maximum Frequency |
263 MHz |
FGG473 Package Specifications
The FGG473 Fine-Pitch Ball Grid Array package provides optimal board-level integration:
| Package Parameter |
Value |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Total Pins |
473 |
| Ball Pitch |
1.0mm |
| RoHS Compliance |
Lead-free (Pb-free) option available |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG473C Technical Architecture
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG473C contains 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB includes four logic cells (LCs) organized into two identical slices. The CLB architecture provides:
- Look-Up Tables (LUTs): Four-input function generators capable of implementing any Boolean function
- Storage Elements: D-type flip-flops with clock enable and synchronous/asynchronous reset
- Carry Logic: Fast arithmetic operations for adders and counters
- Multiplexers: F5 and F6 multiplexers for implementing wider functions
Block RAM Memory Resources
The XC2S200-6FGG473C integrates 56 Kbits of dedicated Block RAM organized in dual-port 4,096-bit memory blocks. Block RAM features include:
- Fully synchronous dual-port operation
- Independent read/write clocks per port
- Configurable data widths (1, 2, 4, 8, or 16 bits)
- Built-in initialization capability
- Cascade configuration for larger memory arrays
Distributed RAM Capabilities
Beyond Block RAM, the XC2S200-6FGG473C offers 75,264 bits of distributed SelectRAM memory. Each CLB slice can implement 16 bits of synchronous RAM, providing:
- Single-port RAM (16×1)
- Dual-port RAM (16×1)
- Shift register capability (16 bits)
- ROM implementation
Clock Management with DLLs
Four Delay-Locked Loops (DLLs) positioned at the die corners deliver advanced clock management:
- Zero propagation delay clock distribution
- Clock multiplication and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
- Precise phase shifting (0°, 90°, 180°, 270°)
- Clock deskewing across multiple devices
- Jitter reduction for stable timing
XC2S200-6FGG473C I/O Capabilities
Supported I/O Standards
The XC2S200-6FGG473C supports 16 single-ended and differential I/O standards for maximum design flexibility:
| I/O Standard |
Voltage Level |
| LVTTL |
3.3V |
| LVCMOS2 |
2.5V |
| PCI 3.3V |
3.3V |
| GTL+ |
1.0V reference |
| HSTL Class I/II/III/IV |
1.5V |
| SSTL2 Class I/II |
2.5V |
| SSTL3 Class I/II |
3.3V |
| CTT |
1.5V |
| AGP-2× |
3.3V |
I/O Bank Organization
User I/O pins are organized into four I/O banks, each with independently configurable VCCO supply. This organization enables simultaneous interfacing with multiple voltage standards across different board regions.
XC2S200-6FGG473C Applications
Industrial Automation and Control
The XC2S200-6FGG473C excels in industrial environments requiring reliable digital processing:
- Programmable Logic Controllers (PLCs)
- Motor control systems
- Process automation
- Sensor interface applications
- Real-time monitoring systems
Telecommunications Equipment
High-speed I/O and robust clock management make the XC2S200-6FGG473C suitable for:
- Network interface cards
- Protocol conversion bridges
- Base station equipment
- Data multiplexing systems
- Signal processing modules
Embedded Systems and Consumer Electronics
Cost-effective programmability benefits embedded applications:
- Display controllers
- Audio/video processing
- USB and serial interfaces
- Peripheral controllers
- Custom protocol implementations
Prototyping and Development
FPGA reprogrammability accelerates development cycles:
- ASIC emulation and verification
- Algorithm prototyping
- Hardware-software co-design
- System integration testing
XC2S200-6FGG473C Configuration Options
Configuration Modes
The XC2S200-6FGG473C supports multiple configuration methods:
| Mode |
Description |
Data Width |
| Master Serial |
FPGA generates CCLK |
1-bit |
| Slave Serial |
External CCLK source |
1-bit |
| Slave Parallel |
External CCLK, 8-bit data |
8-bit |
| Boundary Scan |
JTAG configuration |
1-bit |
Configuration Memory Requirements
The XC2S200-6FGG473C requires 1,335,840 configuration bits. Compatible configuration PROMs include the Xilinx XC18V04 and Platform Flash devices.
XC2S200-6FGG473C Design Resources
Development Tools
Design implementation requires the Xilinx ISE Design Suite, which provides:
- Schematic capture and HDL synthesis
- Place-and-route optimization
- Static timing analysis
- Bitstream generation
- In-system debugging with ChipScope
Documentation and Support
Technical resources available for XC2S200-6FGG473C designs:
- DS001 Complete Datasheet (DC/AC specifications)
- User Guide with architectural details
- Application notes for common implementations
- Reference designs and IP cores
- PCB layout guidelines
XC2S200-6FGG473C Part Number Decoder
Understanding the XC2S200-6FGG473C part number:
| Code |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (fastest commercial) |
| FG |
Fine-Pitch BGA Package |
| G |
Pb-free (RoHS Compliant) |
| 473 |
Pin Count |
| C |
Commercial Temperature (0°C to +85°C) |
Why Choose XC2S200-6FGG473C
Cost-Effective ASIC Alternative
The XC2S200-6FGG473C eliminates non-recurring engineering (NRE) costs associated with ASIC development. Field programmability allows design updates without hardware replacement.
Proven Reliability
Built on mature 0.18µm process technology, the Spartan-II family delivers consistent performance across commercial temperature ranges.
Rapid Time-to-Market
Reprogram the XC2S200-6FGG473C throughout development, enabling parallel hardware and software design. Shorten product development cycles while maintaining design flexibility.
Legacy Design Support
The XC2S200-6FGG473C maintains compatibility with existing Spartan-II designs, facilitating drop-in replacements and design migrations.
XC2S200-6FGG473C Ordering Information
Contact authorized AMD Xilinx distributors for pricing, availability, and volume discounts on XC2S200-6FGG473C devices. Standard lead times apply for commercial quantities.
Frequently Asked Questions About XC2S200-6FGG473C
What is the XC2S200-6FGG473C?
The XC2S200-6FGG473C is a 200,000 system gate FPGA from AMD Xilinx’s Spartan-II family, packaged in a 473-pin Fine-Pitch BGA with -6 speed grade for commercial temperature applications.
What voltage does the XC2S200-6FGG473C require?
The XC2S200-6FGG473C operates with a 2.5V core voltage (VCCINT) and supports multiple I/O voltages (1.5V to 3.3V) through configurable I/O banks.
How many logic cells does the XC2S200-6FGG473C have?
The XC2S200-6FGG473C contains 5,292 logic cells organized within 1,176 Configurable Logic Blocks (CLBs).
What is the maximum operating frequency of XC2S200-6FGG473C?
The XC2S200-6FGG473C achieves system performance up to 263 MHz with the -6 speed grade designation.
Is the XC2S200-6FGG473C RoHS compliant?
Yes, the “G” designation in XC2S200-6FGG473C indicates Pb-free (lead-free) packaging that meets RoHS compliance requirements.
