The XC2S200-6FGG468C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD Xilinx Spartan-II family. This 200,000-gate FPGA delivers exceptional programmable logic capabilities in a compact 468-pin Fine Pitch BGA package, making it an ideal solution for cost-sensitive embedded applications requiring reliable, field-upgradeable digital logic designs.

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XC2S200-6FGG468C Key Features and Benefits

The Spartan-II XC2S200-6FGG468C offers engineers a powerful alternative to traditional mask-programmed ASICs. Unlike ASICs, this FPGA eliminates lengthy development cycles and high initial costs while enabling seamless in-field design upgrades without hardware replacement.

High-Density Programmable Logic Architecture

This Xilinx FPGA features an advanced architecture optimized for complex digital designs:

• 5,292 Logic Cells for implementing sophisticated digital circuits
• 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
• 75,264 bits of Distributed RAM for flexible on-chip memory
• 56 Kbits of Dedicated Block RAM for high-speed data storage
• 284 Maximum User I/O Pins for extensive connectivity options

Advanced Clock Management

The XC2S200-6FGG468C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs provide precise clock management capabilities essential for timing-critical applications, supporting frequencies up to 263 MHz.

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XC2S200-6FGG468C Technical Specifications

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XC2S200-6FGG468C Package Information

468-Ball Fine Pitch BGA (FGG468) Package

The FGG468 package provides optimal thermal performance and signal integrity for high-speed designs. The “G” designation indicates this is a Pb-free (lead-free) package, fully compliant with RoHS environmental directives.

Package Dimensions and Mounting

• Ball Count: 468 balls
• Ball Pitch: Fine pitch configuration for space-efficient PCB layouts
• Mounting Type: Surface Mount Technology (SMT)

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Spartan-II FPGA Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG468C CLB architecture consists of two slices, each containing two 4-input function generators (Look-Up Tables), carry logic, and storage elements. This architecture enables efficient implementation of combinatorial and sequential logic functions.

Input/Output Blocks (IOBs)

Each IOB provides a bidirectional interface between package pins and internal logic. The IOBs support multiple I/O standards, including LVTTL, LVCMOS, PCI, and GTL+, offering design flexibility for various system requirements.

Block RAM Resources

Two columns of dedicated Block RAM modules are positioned on opposite sides of the die, providing 56 Kbits of high-speed dual-port memory. These resources are ideal for FIFO buffers, register files, and small on-chip memory applications.

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XC2S200-6FGG468C Applications

The XC2S200-6FGG468C Spartan-II FPGA is widely deployed across numerous industries:

Industrial Automation

• Programmable Logic Controllers (PLCs)
• Motor control systems
• Factory automation equipment

Consumer Electronics

• Set-top boxes
• Digital video processing
• Audio processing systems

Telecommunications

• Protocol bridging
• Data encryption/decryption
• Network interface controllers

Embedded Systems

• Custom peripheral interfaces
• Signal processing applications
• Real-time control systems

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Design Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG468C is supported by Xilinx ISE Design Suite, providing comprehensive tools for FPGA development:

• Schematic Entry and HDL-based design flows
• Synthesis and implementation optimization
• Timing Analysis and simulation capabilities
• JTAG Programming and debugging support

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Why Choose the XC2S200-6FGG468C FPGA?

Cost-Effective ASIC Alternative

The Spartan-II XC2S200-6FGG468C eliminates the high NRE (Non-Recurring Engineering) costs associated with ASIC development. Engineers can iterate designs rapidly without incurring additional manufacturing charges.

Field-Upgradeable Design

Unlike fixed-function devices, this FPGA allows hardware functionality updates in deployed systems. This capability extends product lifecycles and enables feature enhancements without physical hardware changes.

Proven Reliability

Built on mature 0.18 µm process technology, the XC2S200-6FGG468C delivers consistent performance and reliability backed by AMD Xilinx’s extensive quality assurance processes.

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Ordering Information

Note: The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C).

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Related Spartan-II FPGA Products

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Frequently Asked Questions

What is the XC2S200-6FGG468C?

The XC2S200-6FGG468C is a 200,000-gate Spartan-II FPGA manufactured by AMD Xilinx. It features 5,292 logic cells, 56 Kbits of Block RAM, and 284 user I/O pins in a 468-ball Fine Pitch BGA package.

Is the XC2S200-6FGG468C RoHS compliant?

Yes, the “G” in the FGG468 package designation indicates this is a Pb-free (lead-free) device that complies with RoHS environmental directives.

What development tools support the XC2S200-6FGG468C?

The Xilinx ISE Design Suite provides complete support for Spartan-II FPGA development, including synthesis, implementation, and programming tools.

What is the operating voltage of the XC2S200-6FGG468C?

The XC2S200-6FGG468C operates with a 2.5V core voltage, with I/O banks supporting multiple voltage standards.

What temperature range does the XC2S200-6FGG468C support?

The -6 speed grade variant operates within the Commercial temperature range of 0°C to +85°C.