Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5CG-1SFVC784E: Zynq UltraScale+ MPSoC System-on-Chip

Product Details

The AMD XCZU5CG-1SFVC784E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining powerful ARM Cortex processors with flexible FPGA programmable logic. This advanced Xilinx FPGA delivers exceptional performance for embedded systems, edge computing, and industrial automation applications.

Key Features of the XCZU5CG-1SFVC784E

The XCZU5CG-1SFVC784E integrates a feature-rich processing system with adaptable programmable logic, making it ideal for demanding applications that require both real-time control and hardware acceleration.

Dual ARM Cortex-A53 Application Processor

Specification Value
Processor Type Dual ARM Cortex-A53 MPCore with CoreSight
Maximum Clock Speed 1.2 GHz
L1 Cache 32KB Instruction / 32KB Data
L2 Cache 1MB Shared
Architecture 64-bit ARMv8

Dual ARM Cortex-R5 Real-Time Processor

Specification Value
Processor Type Dual ARM Cortex-R5 with CoreSight
Maximum Clock Speed 500 MHz
Precision Single/Double Precision Floating Point
Features Tightly Coupled Memory (TCM)

XCZU5CG-1SFVC784E Programmable Logic Specifications

The programmable logic (PL) section of this Zynq UltraScale+ MPSoC provides extensive resources for custom hardware implementations.

Logic Resources

Parameter Specification
System Logic Cells 256,200
CLB LUTs 117,120
CLB Flip-Flops 234,240
Distributed RAM 3.5 Mb
Process Technology 20nm

Memory Resources

Memory Type Capacity
Block RAM Blocks 144
Block RAM 5.1 Mb
DSP Slices 1,248

Package and Electrical Specifications

XCZU5CG-1SFVC784E Package Information

Attribute Value
Package Type 784-FCBGA (Fine-pitch Ball Grid Array)
Package Dimensions 23mm x 23mm
Ball Pitch 0.8mm
Pin Count 784
Mounting Type Surface Mount
Speed Grade -1 (Standard Speed)
Temperature Grade Extended (E)

Operating Conditions

Parameter Specification
Core Voltage (VCCINT) 0.85V
I/O Voltage Range (HP) 1.0V to 1.8V
I/O Voltage Range (HD) 1.2V to 3.3V
Operating Temperature 0°C to +100°C (Extended)

I/O and Connectivity Features

High-Performance I/O Capabilities

The XCZU5CG-1SFVC784E offers extensive I/O options for connecting to external devices and peripherals.

I/O Type Quantity/Specification
High-Performance (HP) I/O Up to 156 pins
High-Density (HD) I/O Up to 96 pins
PS I/O 214 pins
GTH Transceivers 4 channels
Transceiver Data Rate Up to 12.5 Gb/s

Processing System Connectivity

Interface Specification
USB 2.0 2 Controllers (Host/Device/OTG)
Gigabit Ethernet 4 MACs (Triple Speed)
UART Yes
I2C Yes
SPI Yes
CAN 2.0B ISO11898-1 Compliant
GPIO 128 bits (78 MIO, 96 EMIO)

Memory Interface Support

The XCZU5CG-1SFVC784E supports multiple high-speed memory standards through its integrated memory controller.

Supported Memory Types

Memory Standard Support
DDR4 Yes
DDR3/DDR3L Yes
LPDDR4 Yes
LPDDR3 Yes
Quad SPI Yes
NAND Flash Yes
eMMC Yes

XCZU5CG-1SFVC784E Target Applications

This Zynq UltraScale+ MPSoC is designed for a wide range of demanding applications.

Industrial and Embedded Applications

  • Edge AI and Machine Learning: Hardware acceleration for inference workloads
  • Industrial Automation: Real-time control systems with deterministic response
  • Motor Control: High-precision motor drive applications
  • Robotics: Sensor fusion and real-time processing

Communications and Networking

  • Wireless Infrastructure: 4G/5G base station processing
  • Software-Defined Radio: Flexible waveform processing
  • Network Acceleration: Packet processing and security

Automotive and Aerospace

  • Advanced Driver Assistance Systems (ADAS): Sensor processing and fusion
  • Avionics: Safety-critical control systems
  • Test and Measurement: High-speed data acquisition

Development Tools and Software Support

Vivado Design Suite Compatibility

The XCZU5CG-1SFVC784E is fully supported by AMD Vivado Design Suite, providing comprehensive tools for hardware design.

Tool Purpose
Vivado Design Suite RTL synthesis, implementation, and analysis
Vitis Unified Platform Software development and AI engine programming
PetaLinux Embedded Linux development
SDK Bare-metal and RTOS application development

Evaluation and Development Platforms

Platform Description
ZCU102 Full-featured evaluation kit
ZCU104 AI and video processing platform
ZCU106 Video codec and connectivity platform

Part Number Breakdown: XCZU5CG-1SFVC784E

Understanding the AMD/Xilinx part numbering convention:

Code Meaning
XC Xilinx Commercial
ZU5 Zynq UltraScale+ size 5
CG CG subfamily (no video codec, no GPU)
-1 Speed grade -1 (standard)
SF Package type (0.8mm pitch)
V Lead-free/RoHS compliant
C784 784-ball FCBGA package
E Extended temperature range

Why Choose the XCZU5CG-1SFVC784E?

Performance Advantages

  • Heterogeneous Processing: Combines application and real-time processors with programmable logic
  • 20nm Technology: Superior power efficiency with high performance
  • Flexible I/O: Extensive connectivity options for diverse applications
  • Scalable Architecture: Part of the footprint-compatible Zynq UltraScale+ family

Design Benefits

  • Single-Chip Solution: Reduces BOM cost and PCB complexity
  • Hardware-Software Partitioning: Optimal allocation of processing tasks
  • Future-Proof: Programmable logic allows field updates and feature additions
  • Industry Support: Extensive ecosystem of IP cores and development resources

Technical Documentation Resources

Document Description
DS891 Zynq UltraScale+ MPSoC Overview
DS925 DC and AC Switching Characteristics
UG1075 Packaging and Pinouts User Guide
UG1085 Technical Reference Manual

Ordering Information

Attribute Specification
Manufacturer Part Number XCZU5CG-1SFVC784E
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC
RoHS Status Compliant
Packaging Tray
Lead Time Contact distributor

Frequently Asked Questions

What is the difference between XCZU5CG and XCZU5EG?

The XCZU5CG is part of the CG subfamily, which does not include the Mali-400 GPU or video codec found in the EG (with GPU) and EV (with video codec) variants. This makes the CG version more cost-effective for applications that do not require integrated graphics or video processing.

Is the XCZU5CG-1SFVC784E footprint compatible with other devices?

Yes, packages with the same last letter and number sequence (C784) are footprint compatible with other UltraScale+ devices. This allows for easy migration between different capacity devices within the family.

What speed grades are available for the XCZU5CG?

The XCZU5CG is available in -1, -2, and -3 speed grades, with -1 being standard, -2 offering improved performance, and -3 providing the highest performance. The -1E designation indicates extended temperature range operation.

Does the XCZU5CG-1SFVC784E support security features?

Yes, the device includes 256-bit AES-GCM decryption capability, secure boot support, and options for AES key storage using battery-backed RAM or eFUSE technology.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.