Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-1FBVB900I: Zynq UltraScale+ MPSoC FPGA System-on-Chip

Product Details

The AMD XCZU5EG-1FBVB900I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EG family. This advanced programmable device combines a powerful 64-bit ARM processing system with flexible FPGA programmable logic, making it ideal for embedded vision, industrial IoT, 5G wireless, and next-generation ADAS applications.


XCZU5EG-1FBVB900I Key Features and Specifications

The XCZU5EG-1FBVB900I delivers exceptional processing power through its heterogeneous computing architecture. This device integrates multiple processing engines optimized for different workloads, enabling engineers to accelerate functions across entire applications.

Processing System Architecture

Component Specification
Application Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
APU Max Frequency Up to 1.2 GHz
Real-Time Processor Dual ARM® Cortex™-R5F with CoreSight™
RPU Max Frequency Up to 600 MHz
Graphics Processing ARM Mali™-400 MP2 GPU
Platform Management Dedicated Platform Management Unit (PMU)

Programmable Logic Resources

Resource XCZU5EG Specification
Logic Cells 256,200 (256K+)
CLB Flip-Flops 234,240
CLB LUTs 117,120
DSP Slices (27×18 Multipliers) 1,248
Block RAM (36Kb) 7.6 Mb Total
UltraRAM 1.8 Mb
Technology Node 20nm FinFET

XCZU5EG-1FBVB900I Package and Electrical Specifications

The -1FBVB900I variant comes in a compact 900-ball FCBGA package with industrial temperature grade rating. Understanding these specifications is critical for proper PCB design and thermal management.

Package Information

Parameter Value
Package Type 900-FCBGA (31×31 mm)
Ball Pitch 1.0 mm
Speed Grade -1 (Standard Performance)
Temperature Grade Industrial (I): -40°C to +100°C
Core Voltage (VCCINT) 0.85V
RoHS Compliance EU RoHS Compliant (Lead-Free)

I/O and Connectivity

I/O Type Description
Max User I/O 204
High-Performance (HP) I/O 1.0V to 1.8V support
High-Density (HD) I/O 1.2V to 3.3V support
PS-GTR Transceivers Up to 6 Gb/s (USB 3.0, SATA, DisplayPort)
MIO Pins Up to 78 multiplexed I/O pins

AMD Zynq UltraScale+ MPSoC EG Device Variant Explained

The “EG” designation in XCZU5EG indicates this device includes the quad-core Cortex-A53 application processor unit (APU) plus the integrated ARM Mali-400 MP2 graphics processing unit. This differentiates it from CG (dual-core, no GPU) and EV (includes H.264/H.265 video codec) variants.

Speed Grade Options for XCZU5EG

Speed Grade Performance Level VCCINT Voltage
-3E Highest Performance 0.90V
-2E / -2I High Performance 0.85V
-1E / -1I Standard Performance 0.85V
-2LE / -1LI Low Power Options 0.72V or 0.85V

The XCZU5EG-1FBVB900I uses the -1 speed grade with industrial temperature rating, providing reliable performance across demanding operating environments.


Integrated Peripherals and Memory Interfaces

External Memory Controller Specifications

Memory Type Controller Specification
DDR4 Up to 2400 Mb/s (64-bit + ECC)
DDR3/DDR3L Up to 1866 Mb/s
LPDDR3/LPDDR4 Low-power memory support

On-Chip Connectivity Peripherals

Peripheral Availability
USB 2.0 2× Controllers
USB 3.0 Via PS-GTR Transceivers
Gigabit Ethernet 4× GEM Controllers
SATA 3.1 Supported via PS-GTR
PCIe® Gen2 Integrated Block
DisplayPort 1.2a Source Controller
SPI 2× Controllers
I2C 2× Controllers
UART 2× Controllers
CAN 2.0B 2× Controllers
GPIO Up to 78 MIO + EMIO

Security and Configuration Features

The XCZU5EG-1FBVB900I incorporates comprehensive security features essential for industrial, automotive, and communications applications.

Hardware Security Features

Security Feature Description
Secure Boot RSA-4096 and ECDSA authentication
AES-GCM Encryption 256-bit hardware encryption engine
SHA-3/384 Secure hash algorithm support
Anti-Tamper Physical unclonable function (PUF)
eFUSE One-time programmable memory
BBRAM Battery-backed secure key storage

Configuration Options

Configuration Mode Description
JTAG Standard debug and programming
Quad SPI Flash Up to 4× parallel configuration
SD/eMMC Boot from SD card or eMMC
NAND Flash 8-bit or 16-bit interface
USB Boot Device firmware upgrade support

Development Tools and Software Support

Xilinx Vivado Design Suite Compatibility

The XCZU5EG-1FBVB900I is fully supported by AMD’s Vivado Design Suite for hardware design and the Vitis Unified Software Platform for embedded software development. The device is compatible with Vivado ML Standard Edition (formerly WebPACK), offering free access to synthesis, implementation, and hardware debugging tools.

Operating System Support

OS/Platform Support Level
PetaLinux Full BSP support
FreeRTOS Real-time OS for RPU
Bare Metal Standalone application development
Ubuntu Community support available

Target Applications for XCZU5EG-1FBVB900I

The combination of heterogeneous processing and programmable logic makes this SoC ideal for demanding embedded applications:

  • 5G Wireless Infrastructure — Baseband processing and beamforming
  • Industrial Automation — Real-time control with machine vision
  • Advanced Driver Assistance Systems (ADAS) — Sensor fusion and object detection
  • Medical Imaging — Ultrasound and endoscopy systems
  • Aerospace and Defense — Software-defined radio and radar
  • Edge AI/ML Acceleration — CNN inference at the edge
  • Video Surveillance — Multi-channel video analytics
  • Test and Measurement — High-speed data acquisition

XCZU5EG-1FBVB900I Part Number Breakdown

Understanding the AMD/Xilinx part numbering convention helps identify device specifications:

Segment Value Meaning
XC XC Xilinx Commercial
Family ZU5 Zynq UltraScale+ Size 5
Variant EG EG (Quad APU + GPU)
Speed Grade -1 Standard performance
Package FBVB900 900-ball FCBGA, 1.0mm pitch
Temperature I Industrial (-40°C to +100°C)

Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells Package Notes
XCZU5EG-2FBVB900I 256K+ 900-FCBGA Higher speed grade
XCZU5EG-1SFVC784I 256K+ 784-FCBGA Smaller package
XCZU5CG-1FBVB900I 256K+ 900-FCBGA CG variant (no GPU)
XCZU7EG-1FBVB900I 504K+ 900-FCBGA Larger device
XCZU3EG-1SBVA484I 154K+ 484-SBGA Smaller device

Where to Buy AMD XCZU5EG-1FBVB900I

For genuine AMD/Xilinx XCZU5EG-1FBVB900I components and related Zynq UltraScale+ MPSoC products, visit authorized distributors. Explore our complete selection of Xilinx FPGA products for your embedded system design needs.


Technical Documentation and Resources

For complete specifications, refer to the official AMD documentation:

  • DS891 — Zynq UltraScale+ MPSoC Data Sheet: Overview
  • DS925 — Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
  • UG1085 — Zynq UltraScale+ Device Technical Reference Manual
  • UG1075 — Zynq UltraScale+ MPSoC Packaging and Pinouts

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.