Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-2FBVB900E: Zynq UltraScale+ MPSoC FPGA SoC IC

Product Details

The AMD XCZU5EG-2FBVB900E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EG family. This advanced embedded processor combines powerful ARM processing cores with flexible FPGA programmable logic, making it ideal for AI, machine learning, industrial automation, and embedded vision applications.


XCZU5EG-2FBVB900E Key Features and Benefits

The XCZU5EG-2FBVB900E delivers exceptional heterogeneous processing capabilities by integrating multiple processing engines into a single device. Engineers benefit from reduced system complexity, lower power consumption, and accelerated time-to-market when designing next-generation embedded systems.

Quad-Core ARM Cortex-A53 Application Processing Unit

The application processing unit features a quad-core ARM Cortex-A53 MPCore with CoreSight technology, operating at frequencies up to 1.5 GHz. This 64-bit processor provides the computational power needed for running Linux-based operating systems, complex algorithms, and software applications.

Dual-Core ARM Cortex-R5F Real-Time Processing Unit

For deterministic real-time operations, the XCZU5EG-2FBVB900E includes a dual-core ARM Cortex-R5F running at up to 533 MHz. This real-time processing unit handles safety-critical tasks, motor control, and time-sensitive industrial processes.

ARM Mali-400 MP2 Graphics Processing Unit

The integrated ARM Mali-400 MP2 GPU operating at up to 667 MHz enables efficient graphics rendering for human-machine interfaces (HMI), display applications, and embedded vision systems without requiring external graphics hardware.


XCZU5EG-2FBVB900E Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU5EG-2FBVB900E
Product Family Zynq UltraScale+ MPSoC EG
Device Type System On Chip (SoC) IC
Process Technology 16nm FinFET+
Logic Cells 256,200+ (256K+)
Total On-Chip RAM 26.6 Mb
DSP Slices 1,248
Maximum I/O Pins 204

XCZU5EG-2FBVB900E Processor Specifications

Processing Unit Details
Application Processor Quad ARM Cortex-A53 @ 1.5 GHz
Real-Time Processor Dual ARM Cortex-R5F @ 533 MHz
Graphics Processor ARM Mali-400 MP2 @ 667 MHz
L2 Cache 1 MB (APU)
On-Chip Memory 256 KB RAM

Package and Operating Conditions

Parameter Value
Package Type 900-FCBGA (31mm × 31mm)
Ball Pitch 1.0 mm
Speed Grade -2 (Standard Performance)
Temperature Grade E (Extended: 0°C to +100°C Tj)
Core Voltage (VCCINT) 0.85V
Mounting Type Surface Mount

XCZU5EG-2FBVB900E High-Speed Connectivity Options

GTH Transceivers and Serial I/O

The device features 16 GTH transceivers supporting data rates up to 16.3 Gb/s, enabling high-bandwidth communication for networking, video streaming, and data acquisition applications.

Peripheral Connectivity Interfaces

Interface Capability
PCIe 2× Gen3 ×8 or 1× Gen3 ×16
USB USB 3.0 with integrated PHY
SATA SATA 3.1
DisplayPort v1.2 (Source only)
Ethernet Gigabit Ethernet with IEEE 1588
Memory DDR4, LPDDR4, DDR3, DDR3L, LPDDR3

Additional Peripheral Support

  • CAN Bus 2.0B
  • I²C, SPI, UART/USART
  • MMC/SD/SDIO
  • GPIO with interrupt capability

XCZU5EG-2FBVB900E Programmable Logic Resources

The FPGA fabric in the XCZU5EG-2FBVB900E provides extensive resources for implementing custom hardware accelerators and IP cores.

Logic and Memory Resources

Resource Quantity
System Logic Cells 256,200
CLB Flip-Flops 234,240
CLB LUTs 117,120
Block RAM (36Kb) 288 blocks
UltraRAM (288Kb) 48 blocks
DSP48E2 Slices 1,248

Clocking Resources

  • Multiple mixed-mode clock managers (MMCM)
  • Phase-locked loops (PLL)
  • Global clock buffers
  • Regional clock networks

XCZU5EG-2FBVB900E Target Applications

The versatile architecture of the XCZU5EG-2FBVB900E makes it suitable for demanding embedded applications:

Industrial and Automation

  • Industrial Internet of Things (IIoT)
  • Motor drive and motion control
  • Programmable logic controllers (PLC)
  • Factory automation systems

Automotive and Transportation

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment
  • Instrument clusters
  • Vehicle networking gateways

Communications and Networking

  • 5G wireless infrastructure
  • Software-defined radio (SDR)
  • Network packet processing
  • Test and measurement equipment

Vision and Video Processing

  • Embedded vision systems
  • Machine learning inference
  • Medical imaging equipment
  • Surveillance and security systems

Why Choose XCZU5EG-2FBVB900E for Your Design?

Heterogeneous Computing Architecture

The combination of application processors, real-time processors, GPU, and programmable logic enables whole-application acceleration. Engineers can optimize each function block for maximum performance and efficiency.

Power Management Flexibility

Multiple power domains allow granular power management, achieving up to 30% lower static power consumption compared to previous generations. Deep sleep mode draws as little as 180 nW for battery-powered applications.

Long Product Lifecycle Support

AMD supports UltraScale+ FPGAs and adaptive SoCs through 2045, providing confidence for long-lifecycle industrial and automotive designs.

Comprehensive Development Ecosystem

  • Vivado Design Suite for FPGA development
  • Vitis Software Platform for embedded application development
  • Vitis AI for machine learning deployment
  • Extensive reference designs and IP cores

XCZU5EG-2FBVB900E Ordering Information

Attribute Description
Full Part Number XCZU5EG-2FBVB900E
Device XCZU5EG
Speed Grade -2
Package FBVB900 (900-ball FCBGA)
Temperature Range E (Extended)
RoHS Status RoHS Compliant

Related Xilinx FPGA Products

Looking for other Zynq UltraScale+ MPSoC devices or Xilinx FPGA solutions? The XCZU5EG family offers multiple package options and speed grades to match your specific requirements, including XCZU5EG-2SFVC784E (784-pin FCBGA) and XCZU5EG-1FBVB900I (industrial temperature grade).


XCZU5EG-2FBVB900E Documentation and Resources

For detailed technical information, designers should reference:

  • DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
  • DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
  • UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
  • UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.