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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCZU5EV-3FBVB900E: Xilinx Zynq UltraScale+ MPSoC FPGA – Complete Specifications & Features

Product Details

The XCZU5EV-3FBVB900E is a high-performance System on Chip (SoC) from the Xilinx Zynq UltraScale+ MPSoC family. This advanced embedded processor combines powerful ARM Cortex processing cores with programmable FPGA logic, making it ideal for demanding applications in artificial intelligence, 5G communications, and industrial automation.

Key Features of XCZU5EV-3FBVB900E

The XCZU5EV-3FBVB900E delivers exceptional performance through its heterogeneous computing architecture. This device integrates a quad-core ARM Cortex-A53 application processor running at 1.5GHz alongside dual ARM Cortex-R5 real-time processors operating at 600MHz. With 256K+ logic cells and 256KB of on-chip RAM, this SoC provides the computational power and flexibility required for next-generation embedded systems.

Processing Architecture

The hybrid MCU and FPGA architecture enables developers to partition workloads between software and hardware acceleration. The Cortex-A53 cores handle complex operating systems and application software, while the Cortex-R5 cores manage real-time control tasks. The programmable logic fabric offers unlimited customization possibilities for application-specific acceleration.

Connectivity Options

Comprehensive peripheral support includes CANbus for automotive and industrial networks, Gigabit Ethernet for high-speed networking, USB OTG for device connectivity, and multiple serial interfaces including I2C, SPI, and UART/USART. The MMC/SD/SDIO interface supports external storage expansion, while the EBI/EMI interface enables connection to external memory devices.

XCZU5EV-3FBVB900E Technical Specifications

Parameter Specification
Part Number XCZU5EV-3FBVB900E
Manufacturer Xilinx (AMD)
Product Family Zynq UltraScale+ MPSoC
Device Type EV Series
Architecture MCU + FPGA Hybrid
Application Processor Quad ARM Cortex-A53 MPCore with CoreSight
Real-Time Processor Dual ARM Cortex-R5 with CoreSight
Processing Speed 1.5GHz (A53) / 600MHz (R5)
Logic Cells 256K+
On-Chip RAM 256KB
Package Type 900-BBGA, FCBGA
Package Dimensions 31mm x 31mm
Pin Count 900 Pins
Operating Temperature 0°C to 100°C (TJ)
Speed Grade -3 (Highest Performance)

Peripheral and Interface Specifications

Interface Type Details
Network CANbus, Gigabit Ethernet
Serial Communication I2C, SPI, UART/USART
USB USB OTG
Storage MMC/SD/SDIO
Memory Interface EBI/EMI
System Features DMA, WDT (Watchdog Timer)

Applications for XCZU5EV-3FBVB900E

This versatile SoC FPGA excels across multiple industry sectors due to its combination of processing power, programmable logic, and integrated peripherals.

Artificial Intelligence and Machine Learning

The XCZU5EV-3FBVB900E supports AI inference acceleration through its programmable logic fabric. Developers can implement custom neural network accelerators while the ARM cores handle pre-processing and system management tasks.

5G Wireless Infrastructure

With high-speed serial I/O capabilities and real-time processing features, this device serves critical roles in 5G base stations, small cells, and radio units. The programmable logic enables implementation of custom signal processing algorithms.

Industrial Automation and Control

The dual Cortex-R5 real-time processors ensure deterministic response times essential for motor control, robotics, and safety-critical industrial systems. CANbus connectivity enables seamless integration with industrial networks.

Medical Equipment

Healthcare applications benefit from the device’s ability to perform real-time image processing, patient monitoring, and diagnostic analysis. The wide operating temperature range ensures reliable operation in clinical environments.

Video Processing and Surveillance

The high logic cell count and processing power make the XCZU5EV-3FBVB900E suitable for 4K video encoding, decoding, and analytics applications in security and broadcasting systems.

Why Choose the Zynq UltraScale+ XCZU5EV Series

The EV (Embedded Vision) variant of the Zynq UltraScale+ family includes dedicated hardware for video codec operations, making it particularly suited for vision-guided robotics, autonomous vehicles, and surveillance systems. The -3 speed grade designation indicates the highest performance tier, ensuring maximum clock frequencies and shortest propagation delays.

Development Ecosystem

Xilinx Vivado Design Suite provides comprehensive tools for hardware design, while the Vitis unified software platform streamlines application development. Extensive documentation, reference designs, and community support accelerate time-to-market for new products.

Quality and Reliability

As a FinFET-based device manufactured on advanced process technology, the XCZU5EV-3FBVB900E delivers excellent power efficiency alongside high performance. The industrial temperature rating ensures operation in demanding environments.

Ordering Information

When sourcing the XCZU5EV-3FBVB900E, verify the complete part number to ensure correct speed grade, temperature range, and package options. This component is available through authorized distributors and directly from Xilinx FPGA suppliers worldwide.

Related Zynq UltraScale+ MPSoC Parts

Part Number Package Description
XCZU5EV-2SFVC784I 784-FCBGA Industrial Temperature, -2 Speed
XCZU5EV-2SFVC784E 784-FCBGA Extended Temperature, -2 Speed
XCZU5EV-3SFVC784E 784-FCBGA Extended Temperature, -3 Speed
XCZU5EV-L1FBVB900I 900-FCBGA Industrial, Low Power Grade

Summary

The XCZU5EV-3FBVB900E represents Xilinx’s commitment to delivering high-performance heterogeneous computing solutions. Combining quad-core ARM Cortex-A53 processors, dual real-time Cortex-R5 cores, and extensive programmable logic in a 900-pin FCBGA package, this Zynq UltraScale+ MPSoC addresses the most demanding requirements in AI, 5G, industrial automation, and embedded vision applications. The comprehensive peripheral set, wide temperature range, and top-tier speed grade make it an excellent choice for engineers developing next-generation embedded systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.