Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU6CG-2FFVB1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU6CG-2FFVB1156E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC CG family. This advanced embedded processor combines dual ARM Cortex-A53 cores with flexible FPGA programmable logic, delivering exceptional processing power for industrial automation, motor control, sensor fusion, and IoT applications.

XCZU6CG-2FFVB1156E Key Features and Benefits

The XCZU6CG-2FFVB1156E integrates a powerful heterogeneous processing system with industry-leading programmable logic. Built on 16nm FinFET+ process technology, this device offers an optimal balance of performance, power efficiency, and flexibility for demanding embedded applications.

Processing System Architecture

The processing system features a robust multi-core configuration:

Processor Configuration Clock Speed
Application Processing Unit (APU) Dual ARM Cortex-A53 MPCore with CoreSight Up to 1.3 GHz
Real-Time Processing Unit (RPU) Dual ARM Cortex-R5 with CoreSight Up to 533 MHz

Both processor subsystems include single and double precision floating-point units, 32KB/32KB L1 cache per core, and advanced debug capabilities through CoreSight technology.

Programmable Logic Resources

The XCZU6CG-2FFVB1156E provides substantial FPGA resources for custom hardware acceleration:

Resource Specification
System Logic Cells 504,000+
CLB Flip-Flops 461K
CLB LUTs (6-input) 230K
Distributed RAM 6.2 Mb
Block RAM (36Kb) 312 blocks (11.0 Mb)
DSP Slices (27×18 multipliers) 1,728
Clock Management Tiles (CMTs) 8

XCZU6CG-2FFVB1156E Technical Specifications

Package and Electrical Characteristics

Parameter Value
Part Number XCZU6CG-2FFVB1156E
Manufacturer AMD (formerly Xilinx)
Package Type 1156-FCBGA (35mm × 35mm)
Speed Grade -2 (Standard Performance)
Temperature Grade Extended (E): 0°C to +100°C
Core Voltage (VCCINT) 0.85V
Process Technology 16nm FinFET+
Lead-Free/RoHS Yes

Memory Controller and Connectivity

The XCZU6CG-2FFVB1156E includes comprehensive memory and peripheral interfaces:

Feature Specification
On-Chip Memory 256KB with ECC
DDR Support DDR4, DDR3, DDR3L, LPDDR4, LPDDR3
Flash Controllers Quad-SPI, NAND, SD/eMMC
GTH Transceivers 24 channels (up to 16.3 Gb/s)
Max HP I/O 416 pins
Max HD I/O 48 pins
PS I/O 214 pins

Integrated Peripheral Interfaces

Interface Details
USB 2× USB 2.0 (Host/Device/OTG)
Ethernet 4× Tri-Speed Gigabit Ethernet MAC
PCIe PS-GTR support for PCIe Gen1/Gen2
Serial Interfaces UART, SPI, I2C, CAN 2.0B
SATA SATA 3.1 support
Display DisplayPort 1.2a
GPIO 128-bit (78 MIO + 96 EMIO)

Understanding the XCZU6CG-2FFVB1156E Part Number

The part number provides essential information about device configuration:

  • XC: Xilinx Commercial
  • ZU6: Zynq UltraScale+ MPSoC, size class 6
  • CG: CG variant (dual-core Cortex-A53, no GPU)
  • -2: Speed grade 2 (standard performance)
  • FF: Flip-chip fine-pitch BGA package
  • VB: Lead-free packaging
  • 1156: 1156-ball package
  • E: Extended temperature range (0°C to +100°C)

XCZU6CG-2FFVB1156E Applications

This versatile SoC FPGA excels in numerous demanding applications:

Industrial and Automation

  • Industrial motor control systems
  • Programmable logic controllers (PLCs)
  • Factory automation equipment
  • Robotics and motion control

Communications and Networking

  • 5G wireless infrastructure
  • Software-defined networking (SDN)
  • Network function virtualization (NFV)
  • Edge computing gateways

Aerospace and Defense

  • Radar and signal processing
  • Electronic warfare systems
  • Avionics computing platforms
  • Secure communications

IoT and Edge Computing

  • Sensor fusion applications
  • Industrial IoT gateways
  • Smart city infrastructure
  • Predictive maintenance systems

Why Choose the XCZU6CG-2FFVB1156E

Heterogeneous Processing Power

The combination of dual ARM Cortex-A53 application processors with dual Cortex-R5 real-time processors provides the flexibility to run complex operating systems while maintaining deterministic, low-latency responses for time-critical tasks.

Extensive FPGA Fabric

With over 504K system logic cells and 1,728 DSP slices, the programmable logic enables hardware acceleration of compute-intensive algorithms, custom peripheral development, and real-time signal processing that software alone cannot achieve.

Power Efficiency

The 16nm FinFET+ technology delivers superior power efficiency compared to previous generations. The device supports multiple power management modes, allowing designers to optimize for specific application requirements.

Development Ecosystem

AMD provides comprehensive development tools including:

  • Vivado Design Suite for FPGA development
  • Vitis unified software platform
  • PetaLinux for embedded Linux development
  • Extensive IP library and reference designs

XCZU6CG-2FFVB1156E vs. Related Devices

Device Cortex-A53 Cores Logic Cells DSP Slices GPU
XCZU6CG 2 (Dual) 504K 1,728 No
XCZU6EG 4 (Quad) 504K 1,728 Mali-400 MP2
XCZU4CG 2 (Dual) 256K 1,248 No
XCZU9CG 2 (Dual) 600K 2,520 No

Order XCZU6CG-2FFVB1156E Today

The XCZU6CG-2FFVB1156E represents AMD’s commitment to providing cutting-edge heterogeneous computing solutions. Whether you’re developing next-generation industrial systems, communications infrastructure, or IoT applications, this device delivers the processing power, flexibility, and reliability your designs require.

Browse our complete selection of Xilinx FPGA devices to find the perfect solution for your embedded system design needs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.