Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU6EG-1FFVC900I: AMD Zynq UltraScale+ MPSoC FPGA – Complete Technical Guide

Product Details

The XCZU6EG-1FFVC900I is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family. This industrial-grade FPGA combines powerful ARM processors with flexible programmable logic, delivering exceptional performance for embedded systems, industrial automation, and edge computing applications.

XCZU6EG-1FFVC900I Overview and Key Features

The XCZU6EG-1FFVC900I represents AMD’s second-generation multiprocessing SoC platform, offering significant improvements over the first-generation Zynq-7000 series. This device integrates a feature-rich processing system with UltraScale+ programmable logic architecture, making it ideal for applications requiring heterogeneous computing capabilities.

Why Choose the XCZU6EG-1FFVC900I?

Engineers and system designers select the XCZU6EG-1FFVC900I for several compelling reasons:

  • Heterogeneous Computing: Combines quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and Mali-400 MP2 GPU
  • Industrial Temperature Rating: Operates reliably from -40°C to +100°C
  • High Logic Density: 469,446+ logic cells for complex digital designs
  • Advanced Connectivity: Supports PCIe Gen1/2, SATA 3.1, USB 3.0, and DisplayPort 1.2a
  • Flexible Memory Options: Compatible with DDR4, DDR3, DDR3L, LPDDR4, and LPDDR3

For more high-quality AMD/Xilinx programmable devices, explore our comprehensive Xilinx FPGA collection.

XCZU6EG-1FFVC900I Technical Specifications

Core Processor Specifications

Parameter Specification
Application Processing Unit (APU) Quad-core ARM Cortex-A53 MPCore with CoreSight
APU Features NEON & Single/Double Precision Floating Point
APU Cache 32KB/32KB L1 Cache, 1MB L2 Cache
APU Frequency Up to 1.2GHz
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5 with CoreSight
RPU Features Single/Double Precision Floating Point
RPU Cache 32KB/32KB L1 Cache, TCM
RPU Frequency Up to 600MHz
Graphics Processing Unit (GPU) ARM Mali-400 MP2
GPU Cache 64KB L2 Cache
GPU Frequency Up to 600MHz

Programmable Logic Resources

Resource Quantity
System Logic Cells 469,446
CLB Flip-Flops 429,208
CLB LUTs 214,604
Block RAM Blocks 714
Block RAM Capacity 25.1 Mb
Distributed RAM 6.9 Mb
DSP Slices 1,973

Package and Electrical Specifications

Parameter Value
Package Type 900-FCBGA (Flip-Chip Ball Grid Array)
Package Dimensions 31mm x 31mm
Ball Pitch 1.0mm
Core Voltage (VCCINT) 0.85V
Process Technology 16nm FinFET+
Temperature Grade Industrial (I)
Operating Temperature -40°C to +100°C
Speed Grade -1
RoHS Compliance Yes

XCZU6EG-1FFVC900I Memory and I/O Capabilities

Memory Interface Support

The XCZU6EG-1FFVC900I features a multi-protocol dynamic memory controller with extensive memory type support:

Memory Type Interface Width ECC Support
DDR4 32-bit or 64-bit Yes
DDR3/DDR3L 32-bit or 64-bit Yes
LPDDR4 32-bit Yes
LPDDR3 32-bit or 64-bit Yes

Additional Memory Features

  • On-Chip Memory: 256KB with ECC protection
  • Quad-SPI NOR Flash: 1-bit, 2-bit, 4-bit, or dual Quad-SPI (8-bit) support
  • eMMC 4.51: Managed NAND flash support
  • ONFI 3.1 NAND: With 24-bit ECC
  • Address Space: Up to 32GB using single or dual rank configurations

High-Speed Transceiver Specifications

Transceiver Type Data Rate Quantity
PS-GTR Up to 6.0 Gb/s 4 channels

I/O Pin Summary

I/O Type Description Voltage Support
PS I/O Processing System I/O 1.8V – 3.3V
HP I/O High-Performance I/O 1.0V – 1.8V
HD I/O High-Density I/O 1.2V – 3.3V
MIO Pins Multiplexed I/O Up to 78 pins

XCZU6EG-1FFVC900I Connectivity Options

High-Speed Serial Interfaces

The XCZU6EG-1FFVC900I provides comprehensive high-speed connectivity through its PS-GTR transceivers:

Interface Standard Speed
PCIe Gen1/Gen2 Up to 5.0 GT/s
Serial ATA SATA 3.1 Up to 6.0 Gb/s
DisplayPort 1.2a Up to 5.4 Gb/s
USB USB 3.0 5.0 Gb/s
Ethernet SGMII 1.25 Gb/s

General Connectivity Peripherals

Peripheral Quantity Features
Triple Speed Ethernet MAC 4 10/100/1000 Mbps
USB 2.0 Controllers 2 Host/Device/OTG
CAN 2.0B Controller 1 ISO11898-1 compliant
I2C Controller 1 Standard/Fast mode
UART 1 Full-featured
SPI Controller 2 Master/Slave
GPIO 128 bits 78 MIO + 96 EMIO

XCZU6EG-1FFVC900I Graphics Processing Unit Details

ARM Mali-400 MP2 GPU Specifications

The integrated Mali-400 MP2 GPU enables hardware-accelerated graphics rendering:

Feature Specification
Architecture Utgard (Non-unified shaders)
Geometry Processor Single core
Pixel Processors 2 cores (MP2)
Vertex Processing 66 Million Triangles/second
Pixel Processing 1.2 Billion Pixels/second
L2 Cache 64KB
OpenGL ES Support 1.1 and 2.0
OpenVG Support 1.1
Power Management Power island gating

XCZU6EG-1FFVC900I Application Areas

Industrial Automation

The XCZU6EG-1FFVC900I excels in industrial environments due to its industrial temperature rating and robust processing capabilities:

  • Motor control systems
  • Programmable Logic Controllers (PLCs)
  • Industrial vision systems
  • Sensor fusion applications
  • Real-time control systems

Communications and Networking

With high-speed transceivers and flexible I/O, this SoC supports advanced communication systems:

  • Wireless base stations
  • Network switches and routers
  • Software-defined networking (SDN)
  • 5G infrastructure equipment
  • Packet processing systems

Aerospace and Defense

The XCZU6EG-1FFVC900I meets demanding requirements for mission-critical applications:

  • Radar signal processing
  • Electronic warfare systems
  • Avionics systems
  • Secure communications
  • Surveillance equipment

Edge Computing and AI

The combination of ARM processors and programmable logic enables:

  • Machine learning inference
  • Computer vision at the edge
  • Autonomous systems
  • Data center acceleration
  • Real-time analytics

XCZU6EG-1FFVC900I Development Tools and Software Support

AMD Vivado Design Suite

Vivado provides comprehensive RTL-to-bitstream development for the programmable logic:

  • High-level synthesis (HLS)
  • IP integrator for system design
  • Advanced debugging tools
  • Power estimation and optimization

Vitis Unified Software Platform

Vitis enables software development for the processing system:

  • Embedded software development
  • AI/ML model deployment
  • Hardware acceleration
  • Library optimization

PetaLinux Tools

For Linux-based embedded development:

  • Customizable Linux distribution
  • Device tree generation
  • Root filesystem configuration
  • Application development support

XCZU6EG-1FFVC900I Part Number Decoder

Understanding the XCZU6EG-1FFVC900I part number helps identify key specifications:

Code Meaning
XC Xilinx Commercial
ZU Zynq UltraScale+
6 Device size designator
EG EG variant (with GPU)
-1 Speed grade (-1 standard)
FF Flip-chip package
VC Package type identifier
900 900 ball count
I Industrial temperature

XCZU6EG-1FFVC900I Security Features

Hardware Security Capabilities

Feature Description
AES-GCM Decryption 256-bit hardware encryption
SHA/RSA Authentication Secure boot support
eFUSE Technology Permanent key storage
Battery-Backed RAM Volatile key storage option
SEU Detection Single Event Upset monitoring
SEU Correction Error correction capabilities
Partial Reconfiguration Secure dynamic updates

XCZU6EG-1FFVC900I vs Other Zynq UltraScale+ Devices

Device Logic Cells Block RAM DSP Slices GPU
XCZU2EG 103,320 5.3 Mb 240 Mali-400 MP2
XCZU3EG 154,350 7.6 Mb 360 Mali-400 MP2
XCZU4EG 192,150 4.5 Mb 728 Mali-400 MP2
XCZU5EG 256,200 5.1 Mb 1,248 Mali-400 MP2
XCZU6EG 469,446 25.1 Mb 1,973 Mali-400 MP2
XCZU7EG 504,000 11.0 Mb 1,728 Mali-400 MP2

Ordering Information

Parameter Specification
Manufacturer Part Number XCZU6EG-1FFVC900I
Manufacturer AMD (formerly Xilinx)
Product Status Active (Production)
Packaging Tray
Moisture Sensitivity Level (MSL) Check datasheet
Lead-Free Status RoHS Compliant

Summary

The XCZU6EG-1FFVC900I delivers a powerful combination of ARM processing, graphics acceleration, and programmable logic in a single industrial-grade package. With 469K+ logic cells, quad-core Cortex-A53 processors, Mali-400 MP2 GPU, and comprehensive connectivity options, this Zynq UltraScale+ MPSoC is the ideal choice for demanding embedded applications requiring heterogeneous computing, real-time processing, and hardware flexibility.

Whether you’re designing industrial automation systems, communications infrastructure, aerospace equipment, or edge AI solutions, the XCZU6EG-1FFVC900I provides the performance, reliability, and flexibility needed for next-generation embedded designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.