Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS20-3VQG100C: High-Performance Xilinx Spartan FPGA for Industrial Applications

Product Details

The XCS20-3VQG100C is a versatile field-programmable gate array (FPGA) from Xilinx’s renowned Spartan series, designed to deliver reliable performance for industrial and commercial applications. This programmable logic device combines cost-effectiveness with robust functionality, making it an ideal choice for engineers seeking ASIC replacement solutions.

Product Overview: XCS20-3VQG100C FPGA Specifications

The XCS20-3VQG100C represents Xilinx’s commitment to providing high-volume production FPGA solutions. As part of the Spartan family, this component delivers essential features required for modern digital design while maintaining competitive pricing suitable for large-scale deployment.

Key Features of XCS20-3VQG100C

  • 20,000 logic gates providing substantial design capacity
  • 950 logic cells/elements for complex circuit implementations
  • 125 MHz maximum operating frequency for high-speed applications
  • 77 user I/O pins in a compact 100-pin package
  • 400 Configurable Logic Blocks (CLBs) for flexible architecture
  • 1,120 registers for efficient data storage and transfer
  • 5V power supply compatibility (4.75V~5.25V operating range)

Technical Specifications Table

Specification Value
Part Number XCS20-3VQG100C
Manufacturer Xilinx Inc. (AMD)
Product Family Spartan FPGA Series
Logic Gates 20,000 gates
Logic Elements 950 cells
CLBs 400
Registers 1,120
I/O Pins 77
Maximum Frequency 125 MHz
Supply Voltage 5V (4.75V-5.25V)
Package Type 100-VQFP / 100-TQFP
Pin Count 100
Mounting Type Surface Mount
Operating Temperature 0°C to 85°C (TJ)
RoHS Status Lead-free / RoHS Compliant

Package Information

Parameter Details
Package Style VQFP (Very Thin Quad Flat Pack) / TQFP
Dimensions 14mm x 14mm
Pitch 0.5mm
Total Pins 100
Terminations 100

Understanding the XCS20-3VQG100C Part Number

Breaking down the part number helps identify specific device characteristics:

  • XCS20 – Spartan family, 20K gate equivalent
  • -3 – Speed grade (commercial temperature, standard performance)
  • VQG100 – Package type (Very Thin Quad, 100-pin)
  • C – Commercial temperature range

Why Choose XCS20-3VQG100C for Your Design?

Cost-Effective ASIC Replacement

The XCS20-3VQG100C serves as an excellent alternative to application-specific integrated circuits (ASICs), offering flexibility without the high non-recurring engineering costs and extended development cycles associated with traditional ASICs. For high-volume production runs, the Spartan series pricing approaches mask-programmed ASIC equivalents while maintaining reprogrammability.

Versatile Application Support

This Xilinx FPGA excels in various demanding applications including:

  • Communications equipment and infrastructure
  • Wireless telecommunications systems
  • Industrial automation and control systems
  • Test and measurement instrumentation
  • Enterprise computing systems
  • Data acquisition devices
  • Digital signal processing applications

Proven Spartan Architecture

The Spartan family architecture has been field-proven across countless applications worldwide. The XCS20-3VQG100C inherits this reliability while offering:

  • On-chip RAM for efficient data handling
  • Simplified feature set optimized for production efficiency
  • Advanced process technology for reduced power consumption
  • IEEE 1149.1/1532 boundary-scan (JTAG) support for testing and programming

Performance Characteristics

Speed Grade and Timing

With a -3 speed grade, the XCS20-3VQG100C delivers reliable performance for most commercial applications. The 125 MHz maximum frequency enables rapid signal processing while maintaining stable operation across the full commercial temperature range.

Logic Density Comparison

Spartan Model Gates Logic Cells CLBs
XCS10 10,000 466 196
XCS20 20,000 950 400
XCS30 30,000 1,368 576
XCS40 40,000 1,862 784

The XCS20 provides an optimal balance of logic resources for medium-complexity designs

Programming and Configuration

Development Tool Compatibility

The XCS20-3VQG100C is fully compatible with Xilinx’s industry-standard development tools:

  • ISE Design Suite – Classic development environment
  • Vivado Design Suite – Modern, user-friendly interface
  • JTAG programming – Standard IEEE 1149.1/1532 support
  • In-system programmability – Field updates without board removal

Configuration Options

Multiple configuration methods provide design flexibility:

  • Serial PROM configuration
  • Parallel configuration interfaces
  • JTAG-based programming and debugging
  • Boundary-scan testing capabilities

Environmental and Compliance Standards

RoHS Compliance and Green Initiative

The XCS20-3VQG100C is manufactured as a lead-free, RoHS-compliant component, meeting stringent environmental regulations for electronic equipment. This green manufacturing approach ensures compatibility with modern electronics assembly processes while reducing environmental impact.

Temperature Performance

Operating Temperature Range: 0°C to 85°C (Junction Temperature)

This commercial temperature range suits most indoor and controlled-environment applications, from telecommunications equipment to industrial control systems.

Pin Configuration and I/O Capabilities

I/O Resources

The 100-pin VQFP package provides:

  • 77 user-configurable I/O pins
  • Multiple I/O standards support
  • Programmable drive strength
  • Individual pin slew rate control
  • Flexible voltage compatibility

Package Advantages

The VQFP (Very Thin Quad Flat Pack) packaging offers several benefits:

  • Compact footprint (14mm x 14mm)
  • 0.5mm pin pitch for high-density PCB layouts
  • Surface mount technology for automated assembly
  • Good thermal characteristics for reliable operation
  • Cost-effective packaging for volume production

Design Considerations

Power Supply Requirements

The XCS20-3VQG100C operates from a 5V supply voltage with a tolerance of ±5% (4.75V to 5.25V). Proper decoupling capacitors should be placed near power pins to ensure stable operation and minimize supply noise.

Thermal Management

With a maximum junction temperature of 85°C, the device requires adequate thermal design:

  • Consider ambient temperature in your application environment
  • Provide appropriate PCB copper area for heat dissipation
  • Ensure adequate airflow in enclosed systems
  • Calculate power dissipation based on logic utilization

Comparison with Alternative Spartan Models

XCS20-3VQG100C vs Other Speed Grades

Part Number Speed Grade Package I/O Temp Range
XCS20-3VQG100C -3 (Standard) 100-VQFP 77 Commercial
XCS20-4VQG100C -4 (Faster) 100-VQFP 77 Commercial
XCS20-3PQ208C -3 (Standard) 208-PQFP 160 Commercial
XCS20-3TQ144C -3 (Standard) 144-TQFP 113 Commercial

Package Options for XCS20 Family

Designers can choose from multiple package options to match their PCB requirements and I/O needs. The VQG100 package offers an optimal balance between compact size and accessible I/O count.

Quality and Reliability

Manufacturing Standards

Xilinx (now part of AMD) manufactures the XCS20-3VQG100C to rigorous quality standards:

  • ISO 9001 certified manufacturing processes
  • Comprehensive testing protocols
  • Proven reliability in field applications
  • Extensive qualification testing

Long-Term Availability

While the Spartan series has been superseded by newer FPGA families, the XCS20-3VQG100C remains available through authorized distributors and maintains a strong presence in legacy system support and cost-sensitive applications.

Procurement and Availability

Sourcing Options

The XCS20-3VQG100C is available through multiple channels:

  • Authorized Xilinx/AMD distributors
  • Electronic component distributors
  • Franchise and independent distributors
  • Both new and refurbished inventory options

Packaging for Orders

Components are typically available in:

  • Tape and Reel (TR) – For automated pick-and-place assembly
  • Cut Tape (CT) – For prototype and small-volume orders
  • Trays – For manual assembly operations
  • Tubes – Alternative small-quantity packaging

Technical Support and Resources

Documentation and Datasheets

Comprehensive technical documentation is available including:

  • Detailed electrical specifications
  • AC/DC timing parameters
  • Package dimensions and pinout diagrams
  • Programming specifications
  • Application notes and design guides

Development Resources

Engineers working with the XCS20-3VQG100C benefit from:

  • Extensive Xilinx knowledge base
  • Community forums and support
  • Reference designs and IP cores
  • Training materials and tutorials

Applications in Modern Systems

Communications Infrastructure

The XCS20-3VQG100C finds extensive use in communications equipment where its logic capacity and I/O resources enable:

  • Protocol conversion and bridging
  • Data multiplexing and demultiplexing
  • Custom interface implementations
  • Signal processing functions

Industrial Control Systems

In industrial environments, this FPGA provides:

  • Real-time control logic implementation
  • Motor control interfaces
  • Sensor data acquisition and processing
  • Communication protocol handling

Test and Measurement Equipment

The device’s flexibility makes it ideal for:

  • Programmable test pattern generation
  • Data capture and analysis
  • Custom measurement algorithms
  • Interface adaptation

Getting Started with XCS20-3VQG100C

Design Entry

Begin your design using Xilinx development tools:

  1. Create schematic or HDL-based designs (VHDL/Verilog)
  2. Utilize IP cores for common functions
  3. Simulate designs before implementation
  4. Synthesize and map to XCS20 architecture

Implementation Flow

Standard FPGA development workflow:

  1. Design entry – Schematic or HDL coding
  2. Synthesis – Convert to logic gates
  3. Implementation – Place and route
  4. Timing analysis – Verify performance
  5. Configuration file generation – Create programming bitstream
  6. Programming – Load design into device

Conclusion: XCS20-3VQG100C for Reliable FPGA Solutions

The XCS20-3VQG100C represents a mature, cost-effective FPGA solution from Xilinx’s proven Spartan family. With 20,000 gates, 77 I/O pins, and 125 MHz performance in a compact 100-pin VQFP package, it addresses the needs of numerous industrial and commercial applications. Whether replacing ASICs, implementing custom logic, or building flexible digital systems, this RoHS-compliant device delivers reliable performance backed by Xilinx’s industry-leading FPGA technology.

For design engineers seeking a balance of capability, cost, and proven reliability, the XCS20-3VQG100C continues to serve as a practical choice for both new designs and legacy system support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.