The XCZU6EG-2FFVB1156I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade device combines quad-core ARM Cortex-A53 application processors with powerful programmable logic, making it ideal for demanding embedded computing applications in aerospace, defense, 5G infrastructure, and industrial automation.
Whether you’re designing next-generation wireless systems, advanced driver assistance systems (ADAS), or industrial IoT solutions, the XCZU6EG-2FFVB1156I delivers the processing power, flexibility, and reliability your project demands.
XCZU6EG-2FFVB1156I Key Features and Benefits
The XCZU6EG-2FFVB1156I stands out in the Zynq UltraScale+ EG family for its exceptional balance of processing capability and programmable logic resources. Here’s why engineers choose this device for mission-critical applications:
Powerful Heterogeneous Processing Architecture
This MPSoC integrates multiple processing engines on a single chip, eliminating the need for discrete components and reducing board complexity. The heterogeneous architecture enables workload optimization across different processing domains.
Industrial-Grade Temperature Rating
The “-I” suffix indicates industrial temperature range support (-40°C to +100°C), ensuring reliable operation in harsh environmental conditions typical of industrial, automotive, and aerospace applications.
High-Speed Connectivity Options
Built-in support for PCIe Gen2/Gen3, USB 3.0, SATA 3.0, and Gigabit Ethernet provides extensive connectivity options for modern embedded systems without requiring additional interface chips.
XCZU6EG-2FFVB1156I Technical Specifications
| Specification |
Details |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU6EG-2FFVB1156I |
| Family |
Zynq UltraScale+ MPSoC |
| Series |
EG (Embedded + Graphics) |
| Process Technology |
16nm FinFET+ |
| Package Type |
FCBGA-1156 |
| Pin Count |
1156 |
| Speed Grade |
-2 |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Core Voltage (VCCINT) |
0.85V |
| RoHS Status |
Compliant |
XCZU6EG-2FFVB1156I Processor Subsystem Specifications
Application Processing Unit (APU)
| Feature |
Specification |
| Processor Cores |
Quad-core ARM Cortex-A53 |
| Max Frequency |
1.5 GHz |
| Architecture |
64-bit ARMv8-A |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB shared |
| NEON/FPU |
Included |
Real-Time Processing Unit (RPU)
| Feature |
Specification |
| Processor Cores |
Dual-core ARM Cortex-R5F |
| Max Frequency |
600 MHz |
| Architecture |
32-bit ARMv7-R |
| Floating Point Unit |
Included |
| Memory Protection |
Yes |
| Operating Modes |
Lock-step or Split |
Graphics Processing Unit (GPU)
| Feature |
Specification |
| GPU Core |
ARM Mali-400 MP2 |
| Pixel Processors |
2 |
| OpenGL ES Support |
1.1, 2.0 |
| OpenVG Support |
1.1 |
XCZU6EG-2FFVB1156I Programmable Logic Resources
The XCZU6EG-2FFVB1156I features extensive programmable logic (PL) resources built on AMD’s UltraScale architecture, enabling custom hardware acceleration and I/O expansion.
| Logic Resource |
Quantity |
| System Logic Cells |
429,208 |
| CLB Flip-Flops |
469,446 |
| CLB LUTs |
234,720 |
| Distributed RAM (Mb) |
3.7 |
| Block RAM (Mb) |
11.0 |
| UltraRAM (Mb) |
9.0 |
| DSP Slices |
1,368 |
XCZU6EG-2FFVB1156I Memory and Interface Specifications
DDR Memory Controller
| Feature |
Specification |
| DDR Standards |
DDR3, DDR3L, DDR4, LPDDR3, LPDDR4 |
| Max Data Rate |
2,400 Mb/s |
| ECC Support |
Yes |
| Max Capacity |
32GB per controller |
High-Speed Serial Transceivers
| Feature |
Specification |
| PS-GTR Transceivers |
4 |
| Max Data Rate |
6.0 Gb/s |
| Supported Protocols |
USB 3.0, SATA 3.0, DisplayPort, PCIe Gen2 |
Integrated Peripherals
| Peripheral |
Quantity/Details |
| Gigabit Ethernet |
4× GEM with IEEE 1588 |
| USB 3.0 |
2× with PHY |
| SATA 3.0 |
2× ports |
| PCIe |
Gen2 x4 |
| DisplayPort |
Dual-lane, 4K@30fps |
| SPI |
2× |
| I2C |
2× |
| UART |
2× |
| CAN |
2× (CAN 2.0B) |
| GPIO |
78× MIO + 96× EMIO |
XCZU6EG-2FFVB1156I Package Information
FFVB1156 Package Details
| Parameter |
Value |
| Package Type |
Flip-Chip Fine-Pitch BGA |
| Dimensions |
35mm × 35mm |
| Ball Pitch |
1.0mm |
| Ball Count |
1156 |
| Lead-Free |
Yes (RoHS Compliant) |
| Alpha Particle Emission |
Ultra-Low Alpha (ULA) |
Maximum User I/O
| I/O Type |
Quantity |
| High-Performance (HP) I/O |
156 |
| High-Density (HD) I/O |
48 |
| Total User I/O |
204 |
XCZU6EG-2FFVB1156I Applications
The XCZU6EG-2FFVB1156I is designed for demanding applications requiring high processing performance, hardware acceleration, and industrial reliability.
Aerospace and Defense Systems
The industrial temperature rating and comprehensive security features make the XCZU6EG-2FFVB1156I suitable for avionic systems, radar processing, secure communications, and electronic warfare applications.
5G Wireless Infrastructure
Advanced signal processing capabilities and high-speed transceivers enable implementation of 5G base station equipment, massive MIMO systems, and beamforming applications.
Industrial Automation and IoT
Motor control, sensor fusion, predictive maintenance systems, and industrial robots benefit from the real-time processing capability of the dual Cortex-R5F cores combined with programmable logic.
Advanced Driver Assistance Systems (ADAS)
Camera processing, sensor fusion, and machine learning inference for automotive safety systems leverage the heterogeneous processing architecture and high-bandwidth interfaces.
Medical Imaging Equipment
Ultrasound, CT, and MRI systems utilize the high-performance DSP slices and programmable logic for real-time image processing and reconstruction.
Video and Broadcast Equipment
Professional video processing, encoding, and switching equipment benefits from the Mali-400 GPU and extensive programmable logic resources.
XCZU6EG-2FFVB1156I Development Tools and Software Support
AMD provides comprehensive development tools and software support for the XCZU6EG-2FFVB1156I.
Hardware Design Tools
| Tool |
Purpose |
| Vivado Design Suite |
FPGA synthesis, implementation, and debugging |
| Vitis Unified Software Platform |
Embedded software development and acceleration |
| PetaLinux Tools |
Linux kernel and rootfs development |
Operating System Support
| OS |
Support Level |
| Linux (PetaLinux) |
Full |
| FreeRTOS |
Full |
| VxWorks |
Third-party |
| QNX |
Third-party |
| Ubuntu |
Community |
Evaluation and Development Kits
Engineers can prototype designs using AMD evaluation boards such as the ZCU102 and ZCU104, or third-party development kits from partners like Avnet, Trenz Electronic, and Digilent.
XCZU6EG-2FFVB1156I Part Number Decoder
Understanding the part number helps ensure you order the correct device variant:
XCZU6EG - 2 - FFVB1156 - I
│ │ │ │ └── Temperature Grade: I = Industrial (-40°C to +100°C)
│ │ │ └────────── Package: FFVB1156 = 1156-ball Flip-Chip BGA
│ │ └───────────────── Speed Grade: -2 (Standard performance)
│ └───────────────────── Family: EG = Embedded + Graphics (with Mali GPU)
└───────────────────────── Device: ZU6 = Zynq UltraScale+ ZU6 resources
Available Speed Grades
| Speed Grade |
Performance Level |
| -1 |
Standard |
| -2 |
High Performance |
| -3 |
Highest Performance |
Temperature Grade Options
| Suffix |
Temperature Range |
| E |
Extended (0°C to +100°C) |
| I |
Industrial (-40°C to +100°C) |
| Q |
Automotive Q-Grade |
Why Choose XCZU6EG-2FFVB1156I Over Competitors
Single-Chip Solution
The XCZU6EG-2FFVB1156I integrates processors, GPU, programmable logic, and connectivity in one device, reducing BOM cost, board space, and power consumption compared to multi-chip alternatives.
Scalable Architecture
Pin-compatible with other Zynq UltraScale+ devices allows design migration to higher or lower resource variants without PCB redesign.
Long-Term Availability
AMD commits to extended product longevity for UltraScale+ devices through 2045, providing supply chain security for products with long lifecycle requirements.
Comprehensive Security Features
Built-in security includes secure boot, RSA-4096 authentication, AES-256 encryption, and anti-tamper capabilities essential for defense and critical infrastructure applications.
Buy XCZU6EG-2FFVB1156I – Where to Purchase
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XCZU6EG-2FFVB1156I Frequently Asked Questions
What is the difference between XCZU6EG and XCZU6CG?
The XCZU6EG (EG series) includes the ARM Mali-400 MP2 GPU for graphics processing and has a quad-core Cortex-A53 running at 1.5GHz. The XCZU6CG (CG series) lacks the GPU and features a dual-core Cortex-A53 at 1.3GHz.
Is XCZU6EG-2FFVB1156I suitable for automotive applications?
While the “-I” industrial grade operates from -40°C to +100°C, for full automotive qualification, consider the “-Q” automotive grade variants that meet AEC-Q100 requirements.
What development board supports XCZU6EG?
The AMD ZCU102 evaluation kit is the primary development platform for XCZU6EG designs, providing access to all key interfaces and featuring production-equivalent silicon.
Can I migrate my design from Zynq-7000 to XCZU6EG?
Yes, with code modifications. The Zynq UltraScale+ uses 64-bit Cortex-A53 cores versus 32-bit Cortex-A9 in Zynq-7000. Vivado and Vitis tools support design migration with IP and software adaptation.
What is the typical power consumption?
Power consumption varies by clock speed, logic utilization, and I/O configuration. Use the Vivado Power Estimator tool for accurate estimates. Typical designs range from 5W to 25W depending on configuration.
Related AMD Xilinx Products
| Part Number |
Description |
Logic Cells |
| XCZU4EG-2FBVB900I |
Zynq UltraScale+ ZU4EG, 900-ball BGA |
178K |
| XCZU9EG-2FFVB1156I |
Zynq UltraScale+ ZU9EG, 1156-ball BGA |
600K |
| XCZU15EG-2FFVB1156I |
Zynq UltraScale+ ZU15EG, 1156-ball BGA |
727K |
| XCZU6CG-2FFVB1156I |
Zynq UltraScale+ ZU6CG (No GPU) |
429K |
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