The XCZU6EG-2FFVC900I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced EG-series device combines a powerful 64-bit quad-core ARM Cortex-A53 application processing unit with high-density programmable logic in a compact 900-pin FC-BGA package. Built on 20nm FinFET technology, the XCZU6EG-2FFVC900I delivers exceptional performance for industrial automation, edge computing, AI/ML inference, and embedded vision applications.
XCZU6EG-2FFVC900I Product Overview
The XCZU6EG-2FFVC900I represents the second-generation Zynq MPSoC architecture, delivering significant enhancements over the first-generation Zynq-7000 series. As an EG-series device, it includes a Mali-400 MP2 GPU for graphics acceleration, making it ideal for applications requiring both processing power and programmable hardware flexibility. Operating at industrial temperature range (-40°C to +100°C), this Xilinx FPGA ensures reliable performance in harsh environments.
Key Technical Specifications of XCZU6EG-2FFVC900I
General Specifications
| Parameter |
Value |
| Part Number |
XCZU6EG-2FFVC900I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Series |
EG (with GPU) |
| Process Technology |
20nm FinFET |
| Package Type |
900-Pin FC-BGA (FFVC900) |
| Speed Grade |
-2 (Industrial) |
| Operating Temperature |
-40°C to +100°C (Industrial) |
| Core Voltage (VCCINT) |
0.85V |
| RoHS Compliant |
Yes (Lead-Free) |
Processing System (PS) Specifications
| Component |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 @ up to 1.5 GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F @ 533 MHz |
| Graphics Processing Unit (GPU) |
ARM Mali-400 MP2 GPU |
| Architecture |
64-bit AArch64 with 32-bit AArch32 support |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB shared |
Programmable Logic (PL) Specifications
| Resource |
Quantity |
| System Logic Cells |
469,446 |
| CLB Flip-Flops |
430,080 |
| CLB LUTs |
215,040 |
| Block RAM (36Kb each) |
312 Blocks (11.2 Mb) |
| UltraRAM (288Kb each) |
16 Blocks (4.5 Mb) |
| DSP Slices |
1,248 |
I/O and Connectivity Features
| Interface |
Specification |
| PS-GTR Transceivers |
4 lanes @ up to 6 Gb/s |
| GTH Transceivers |
Up to 16.3 Gb/s per lane |
| DDR Memory Support |
DDR3/DDR4, LPDDR3/LPDDR4 with ECC |
| PCIe |
Gen3 x4 / Gen2 x4 |
| USB |
USB 3.0 / USB 2.0 |
| Ethernet |
Dual Gigabit Ethernet (GigE) |
| SATA |
SATA 3.0 |
| Additional Interfaces |
SPI, I2C, CAN, UART, QSPI-NOR, SD/eMMC, ONFI NAND |
Key Features and Benefits of XCZU6EG-2FFVC900I
Heterogeneous Multi-Core Processing Architecture
- 64-bit processor scalability with advanced AArch64 architecture
- Real-time control with dual ARM Cortex-R5F processors for deterministic operations
- Integrated Mali-400 MP2 GPU for graphics and compute acceleration
- UltraScale+ programmable logic for custom hardware acceleration
- Shared memory architecture between PS and PL domains
Advanced On-Chip Memory and Storage
- High-density UltraRAM for low-latency data buffering
- Distributed Block RAM with flexible configuration options
- DDR memory controller with ECC for error-free data integrity
- L3 cache for improved system performance
Enhanced Security and Power Management
- Hardware-based encryption with AES-256 and RSA-4096 support
- Secure boot with authentication and anti-tamper features
- Advanced power management with dynamic voltage scaling
- Up to 30% lower static power consumption compared to previous generations
Target Applications for XCZU6EG-2FFVC900I
The XCZU6EG-2FFVC900I is engineered for demanding applications requiring a combination of real-time processing, hardware acceleration, and programmable logic flexibility:
- Industrial Automation and Motor Control: Precision servo drives, multi-axis motion control, and real-time industrial Ethernet protocols
- Edge Computing and AI/ML Inference: Deep learning inference at the network edge with Vitis AI support for CNNs and neural networks
- Embedded Vision and Image Processing: Real-time video analytics, object detection, and multi-camera sensor fusion
- Medical and Healthcare Devices: Diagnostic imaging equipment, ultrasound systems, and patient monitoring devices
- Communications Infrastructure: 5G wireless baseband processing and software-defined radio (SDR) platforms
- Aerospace and Defense: Mission-critical embedded systems with high reliability requirements
- Test and Measurement: High-speed data acquisition systems and protocol analyzers
Development Ecosystem and Software Support
AMD provides a comprehensive development ecosystem for the XCZU6EG-2FFVC900I:
- Vivado Design Suite: Complete RTL-to-bitstream implementation with advanced synthesis and timing closure
- Vitis Unified Software Platform: Embedded software development with AI acceleration libraries
- PetaLinux Tools: Embedded Linux distribution optimized for Zynq UltraScale+ devices
- Vitis AI: Deep learning inference optimization with pre-trained model support
- Vitis Model Composer: Model-based design for signal processing and communications
Why Choose the XCZU6EG-2FFVC900I for Your Design?
The XCZU6EG-2FFVC900I offers an exceptional balance of processing power, programmable logic resources, and power efficiency. With its industrial temperature rating and robust feature set, this Zynq UltraScale+ MPSoC is ideal for designs that demand long-term reliability and performance.
AMD’s commitment to extended product lifecycles—with UltraScale+ devices supported through 2045—ensures design longevity and supply chain stability for products with extended market lifespans.
Ordering Information and Resources
The XCZU6EG-2FFVC900I is available through authorized distributors worldwide. For comprehensive specifications, reference designs, and technical documentation, visit the AMD Xilinx product page.
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