The XCZU6EG-L1FFVB1156I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This powerful Xilinx FPGA combines a quad-core ARM Cortex-A53 processor with advanced programmable logic, making it ideal for embedded systems, industrial automation, and AI edge computing applications.
XCZU6EG-L1FFVB1156I Product Overview
The XCZU6EG-L1FFVB1156I represents AMD Xilinx’s commitment to delivering heterogeneous computing solutions that merge powerful ARM processing with flexible FPGA fabric. Built on 16nm FinFET+ process technology, this MPSoC device offers exceptional performance-per-watt efficiency for demanding industrial and commercial applications.
Key Features of XCZU6EG-L1FFVB1156I
- Quad-Core ARM Cortex-A53 application processor running up to 1.5GHz
- Dual-Core ARM Cortex-R5F real-time processor for deterministic operations
- 214,604 CLB LUTs for custom logic implementation
- 1,973 DSP Slices for high-throughput signal processing
- Industrial Temperature Range (-40°C to +100°C)
- 1156-Ball FCBGA Package for reliable board-level integration
XCZU6EG-L1FFVB1156I Technical Specifications
General Specifications
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU6EG-L1FFVB1156I |
| Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EG (Embedded Graphics) |
| Process Technology |
16nm FinFET+ |
| Speed Grade |
-1 (Low Power) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| Package Type |
1156-FCBGA (FFVB1156) |
| Ball Pitch |
1.0mm |
| RoHS Status |
Compliant |
Processing System (PS) Specifications
| Component |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 MPCore |
| APU Features |
NEON SIMD, Single/Double Precision FPU |
| APU L1 Cache |
32KB Instruction / 32KB Data per core |
| APU L2 Cache |
1MB Unified with ECC |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F |
| RPU Features |
Lock-step or Split Mode, TCM with ECC |
| Graphics Processing Unit |
ARM Mali-400 MP2 with 64KB L2 Cache |
| On-Chip Memory |
256KB with ECC Protection |
Programmable Logic (PL) Specifications
| Resource |
Quantity |
| System Logic Cells |
469,446 |
| CLB Lookup Tables (LUTs) |
214,604 |
| CLB Flip-Flops |
429,208 |
| Distributed RAM |
2.9 Mb |
| Block RAM |
11.0 Mb (312 × 36Kb blocks) |
| DSP Slices (DSP48E2) |
1,973 |
| Clock Management Tiles |
4 |
High-Speed Connectivity
| Interface |
Specification |
| GTH Transceivers |
24 channels (up to 16.3 Gb/s) |
| PS-GTR Transceivers |
4 channels (up to 6.0 Gb/s) |
| PCIe Support |
Gen1/Gen2 |
| USB 3.0 |
Supported via PS-GTR |
| SATA |
3.1 Compliant |
| DisplayPort |
1.2a (4K@30fps) |
| Gigabit Ethernet |
SGMII/RGMII Support |
I/O Configuration
| I/O Type |
Maximum Count |
| High-Performance (HP) I/O |
208 |
| High-Density (HD) I/O |
120 |
| Total User I/O |
328 |
| HP I/O Voltage Range |
1.0V to 1.8V |
| HD I/O Voltage Range |
1.2V to 3.3V |
| PS MIO Pins |
78 |
| PS DDR Interface |
32/64-bit |
Memory Controller Specifications
| Feature |
Support |
| DDR4 |
Up to 2400 MT/s |
| DDR3/DDR3L |
Up to 1866 MT/s |
| LPDDR4 |
Up to 2133 MT/s |
| LPDDR3 |
Up to 1866 MT/s |
| ECC Support |
Yes |
| Data Width |
32-bit / 64-bit |
XCZU6EG-L1FFVB1156I Part Number Decoder
Understanding the XCZU6EG-L1FFVB1156I part number helps engineers select the correct device variant:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 6 |
Device Density (6th in series) |
| EG |
Embedded Graphics variant |
| L1 |
Low Power, Speed Grade -1 |
| FF |
Flip-Chip, Fine-pitch |
| VB |
Lead-free BGA |
| 1156 |
1156 Ball Count |
| I |
Industrial Temperature (-40°C to +100°C) |
XCZU6EG-L1FFVB1156I Application Areas
The XCZU6EG-L1FFVB1156I excels in applications requiring heterogeneous computing with real-time processing capabilities.
Industrial Automation and Control
The combination of ARM Cortex-R5F real-time processors and programmable logic enables deterministic motor control, industrial networking (EtherCAT, PROFINET), and sensor fusion applications with microsecond-level latency.
Embedded Vision and AI Inference
With 1,973 DSP slices and extensive parallel processing capabilities, this MPSoC supports real-time image processing, machine learning inference at the edge, and computer vision applications including object detection and tracking.
Aerospace and Defense Systems
Industrial temperature rating and hardware-based security features make the XCZU6EG-L1FFVB1156I suitable for radar signal processing, software-defined radio, and secure communications in harsh environments.
Medical Imaging Equipment
High-bandwidth data paths and deterministic processing support ultrasound imaging, CT/MRI data acquisition, and patient monitoring systems requiring both computational performance and regulatory compliance.
Test and Measurement Instrumentation
The device’s high-speed transceivers and flexible I/O enable protocol analysis, high-speed data acquisition, and arbitrary waveform generation with sample rates exceeding 1 GSPS.
XCZU6EG-L1FFVB1156I Development Support
Vivado Design Suite Compatibility
AMD’s Vivado Design Suite provides comprehensive support for the XCZU6EG-L1FFVB1156I, including IP Integrator for system-level design, High-Level Synthesis (HLS) for C/C++ to RTL conversion, and advanced timing closure tools.
PetaLinux and Bare-Metal Development
The processing system supports multiple software environments including PetaLinux (Yocto-based Linux), FreeRTOS, and bare-metal applications, enabling flexible partitioning of workloads between software and hardware.
Available Evaluation Platforms
Engineers can prototype designs using compatible development boards featuring Zynq UltraScale+ devices, accelerating time-to-market for embedded system development.
XCZU6EG-L1FFVB1156I Ordering Information
| Attribute |
Specification |
| Full Part Number |
XCZU6EG-L1FFVB1156I |
| Manufacturer |
AMD (formerly Xilinx) |
| Package |
Tray |
| Lead Time |
Contact supplier |
| Lifecycle Status |
Active |
| ECCN |
5A002.A.4 |
| HTSUS Code |
8542.39.0001 |
Why Choose XCZU6EG-L1FFVB1156I for Your Next Design
The XCZU6EG-L1FFVB1156I delivers an optimal balance of processing power, programmable logic resources, and power efficiency for mid-range embedded applications. The low-power -L1 speed grade minimizes thermal design challenges while maintaining sufficient performance for most industrial workloads.
Designers benefit from AMD Xilinx’s extensive ecosystem including pre-verified IP cores, reference designs, and comprehensive documentation. The industrial temperature rating ensures reliable operation in factory automation, outdoor installations, and transportation systems.
For projects requiring additional resources, pin-compatible upgrade paths exist within the Zynq UltraScale+ family, protecting hardware investments and enabling scalable platform development.
