The XCZU6EG-2FFVC900E is a high-performance System-on-Chip (SoC) from the AMD/Xilinx Zynq UltraScale+ MPSoC EG series. This advanced multiprocessor combines a quad-core ARM Cortex-A53 application processor, dual ARM Cortex-R5 real-time processors, ARM Mali-400 MP2 graphics processing unit, and programmable logic featuring 469K+ logic cells. Built on 16nm FinFET+ process technology, this device delivers exceptional computing power for wired and wireless infrastructure, data center acceleration, and aerospace applications.
Explore our complete selection of Xilinx FPGA products for your embedded system design.
XCZU6EG-2FFVC900E Key Features and Capabilities
The XCZU6EG-2FFVC900E integrates a feature-rich 64-bit processing system with UltraScale+ programmable logic architecture on a single chip. This multiprocessor SoC provides exceptional system-level differentiation through hardware, software, and I/O programmability combined with dedicated graphics processing capabilities.
Quad-Core ARM Cortex-A53 Application Processor
The processing system features quad ARM Cortex-A53 MPCore processors with CoreSight debug technology. Operating at speeds up to 1.3 GHz (speed grade -2), these 64-bit application processors deliver substantial computational power for complex embedded applications including network processing, data analytics, and intelligent edge computing solutions.
Dual ARM Cortex-R5 Real-Time Processing Unit
Complementing the application processors, the XCZU6EG-2FFVC900E includes dual ARM Cortex-R5 real-time processing units running at 533 MHz. These processors handle time-critical operations with deterministic response times, making this device ideal for applications requiring precise timing and low-latency control loops.
ARM Mali-400 MP2 Graphics Processing Unit
The integrated ARM Mali-400 MP2 GPU distinguishes the EG variant from other Zynq UltraScale+ devices. This graphics processor enables hardware-accelerated 2D and 3D graphics rendering, display composition, and GPU computing workloads without consuming programmable logic resources.
469K+ Programmable Logic Cells
The integrated Zynq UltraScale+ FPGA fabric provides more than 469,000 system logic cells built on advanced 16nm FinFET+ technology. This programmable logic enables custom hardware acceleration, parallel processing implementations, and application-specific functionality that complements software running on the ARM processing system.
XCZU6EG-2FFVC900E Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU6EG-2FFVC900E |
| Manufacturer |
AMD (Xilinx) |
| Series |
Zynq UltraScale+ MPSoC EG |
| System Logic Cells |
469,446+ (469K+) |
| Application Processor |
Quad ARM Cortex-A53 MPCore @ 1.3 GHz |
| Real-Time Processor |
Dual ARM Cortex-R5 @ 533 MHz |
| Graphics Processor |
ARM Mali-400 MP2 |
| Process Technology |
16nm FinFET+ |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-2 (High Performance) |
| Package Type |
900-FCBGA (31mm x 31mm) |
| Operating Temperature |
0°C to +100°C (Extended) |
| RoHS Compliance |
Yes (Lead-Free) |
XCZU6EG-2FFVC900E Programmable Logic Resources
The UltraScale+ FPGA fabric in the XCZU6EG-2FFVC900E provides comprehensive programmable logic resources optimized for high-performance signal processing and custom hardware implementations.
Configurable Logic Blocks (CLBs)
Each CLB contains 8 lookup tables (LUTs) and 16 flip-flops. The LUTs can be configured as either one 6-input LUT with one output or as two 5-input LUTs with separate outputs. SLICEM-type LUTs support 64-bit distributed RAM and 32-bit shift register (SRL32) configurations.
DSP Slices for Signal Processing
The device includes advanced DSP48E2 slices featuring 27×18 multipliers, 27-bit pre-adders, and 30-bit A inputs. These DSP slices perform multiply-accumulate, multiply-add, pattern detection, and 96-bit XOR operations essential for digital signal processing applications.
Block RAM and UltraRAM Memory
The XCZU6EG-2FFVC900E provides 36Kb block RAMs with built-in FIFO and ECC support. Additionally, UltraRAM blocks offer 4Kx72 high-density dual-port synchronous memory that can be cascaded from 288Kb to 36Mb, providing an ideal solution for replacing external SRAM devices.
XCZU6EG-2FFVC900E Connectivity and Peripheral Interfaces
The XCZU6EG-2FFVC900E provides comprehensive connectivity options essential for modern embedded systems and infrastructure applications.
High-Speed Communication Interfaces
| Interface |
Description |
| Gigabit Ethernet |
High-speed networking for infrastructure applications |
| USB OTG |
Universal Serial Bus with On-The-Go capability |
| CANbus |
Industrial communication for automotive and automation |
| PCIe |
PCI Express for high-bandwidth peripheral connectivity |
Serial Communication Protocols
| Interface |
Description |
| SPI |
Serial Peripheral Interface for sensor connectivity |
| I²C |
Two-wire serial interface for device communication |
| UART/USART |
Universal serial communication ports |
Memory and Storage Interfaces
| Interface |
Description |
| DDR4/DDR3/DDR3L/LPDDR4 |
High-performance external memory support |
| MMC/SD/SDIO |
Secure Digital and MultiMediaCard interfaces |
| EBI/EMI |
External Bus Interface for legacy memory |
| NAND/NOR Flash |
Non-volatile storage controller support |
Extended Temperature Range Performance
The “E” suffix in XCZU6EG-2FFVC900E indicates extended temperature grade qualification. This device operates reliably across the temperature range from 0°C to +100°C junction temperature. Extended-grade operation ensures dependable performance in commercial and light industrial environments where temperature variations are expected.
XCZU6EG-2FFVC900E Speed Grade Advantages
The -2 speed grade designation indicates enhanced performance specifications compared to standard -1 grade devices. The XCZU6EG-2FFVC900E offers higher clock frequencies, faster timing specifications, and improved throughput capabilities ideal for demanding applications.
Speed Grade -2 Performance Highlights
| Parameter |
-2 Speed Grade |
| APU Frequency |
Up to 1.3 GHz |
| RPU Frequency |
Up to 533 MHz |
| Fabric Performance |
Enhanced timing margins |
| Transceiver Rates |
Up to 16.3 Gb/s |
XCZU6EG-2FFVC900E Target Applications
The quad-core EG variant of Zynq UltraScale+ MPSoC excels in application domains where the combination of processing power, graphics capability, and programmable logic delivers optimal system performance.
Wired and Wireless Infrastructure
Network infrastructure applications leverage the high-performance processing system and programmable logic for packet processing, protocol acceleration, and baseband implementations. The XCZU6EG-2FFVC900E supports 5G wireless infrastructure, enterprise networking, and data center applications.
Data Center Acceleration
Cloud computing and data center workloads benefit from the heterogeneous computing architecture combining ARM processors with FPGA acceleration. Applications include storage acceleration, network function virtualization, and machine learning inference.
Aerospace and Defense Systems
Military and aerospace applications utilize the robust processing capabilities and programmable logic for radar signal processing, electronic warfare, secure communications, and avionics systems requiring high reliability and performance.
Embedded Vision and Graphics
The integrated Mali-400 MP2 GPU combined with programmable logic enables advanced embedded vision applications including industrial inspection, medical imaging, and display systems requiring hardware-accelerated graphics rendering.
XCZU6EG-2FFVC900E Package Information
The FFVC900 package designation indicates a fine-pitch flip-chip ball grid array with 900 solder balls arranged on a compact 31mm x 31mm substrate. This package style provides excellent thermal and electrical performance characteristics.
Package Specifications
| Parameter |
Value |
| Package Code |
FFVC900 |
| Ball Count |
900 |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount (BGA) |
Development Tools and Software Ecosystem
The XCZU6EG-2FFVC900E is supported by AMD’s comprehensive development tool ecosystem enabling efficient design implementation from concept through production.
Vivado Design Suite
The primary development environment for Zynq UltraScale+ devices provides integrated tools for hardware design, simulation, synthesis, and implementation. Vivado supports high-level synthesis (HLS) for accelerated development workflows converting C/C++ algorithms to optimized RTL.
Vitis Unified Software Platform
The Vitis platform provides application development tools including libraries, acceleration frameworks, and debugging capabilities for heterogeneous computing applications spanning the processing system and programmable logic domains.
PetaLinux Tools
Embedded Linux development is supported through the PetaLinux tool chain, enabling rapid deployment of Linux-based applications on the ARM processing system with full driver support for all integrated peripherals.
XCZU6EG-2FFVC900E Part Number Decoder
Understanding the AMD/Xilinx part numbering convention helps identify device capabilities and specifications:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU6 |
ZU6 |
Zynq UltraScale+ Size 6 |
| EG |
EG |
Quad-Core A53 + Mali GPU Variant |
| -2 |
-2 |
Speed Grade (High Performance) |
| FFVC |
FFVC |
Package Type (Fine-Pitch Flip-Chip) |
| 900 |
900 |
Pin Count |
| E |
E |
Extended Temperature Range |
Comparing XCZU6EG Variants
Engineers evaluating the XCZU6EG-2FFVC900E may consider these related devices based on specific project requirements:
| Part Number |
Speed Grade |
Temperature |
Package |
| XCZU6EG-2FFVC900E |
-2 |
Extended (0-100°C) |
900-FCBGA |
| XCZU6EG-2FFVC900I |
-2 |
Industrial (-40 to 100°C) |
900-FCBGA |
| XCZU6EG-1FFVC900E |
-1 |
Extended (0-100°C) |
900-FCBGA |
| XCZU6EG-2FFVB1156E |
-2 |
Extended (0-100°C) |
1156-FCBGA |
XCZU6EG-2FFVC900E vs XCZU6CG Comparison
The EG and CG variants offer different processing configurations for varied application requirements:
| Feature |
XCZU6EG (EG) |
XCZU6CG (CG) |
| Application Processor |
Quad ARM Cortex-A53 |
Dual ARM Cortex-A53 |
| Graphics Processor |
Mali-400 MP2 |
Not Available |
| Target Applications |
Graphics, Infrastructure |
Motor Control, Sensor Fusion |
Ordering and Availability Information
The XCZU6EG-2FFVC900E is available from authorized AMD/Xilinx distributors worldwide. This device is typically supplied in tray packaging and may be classified as NCNR (Non-Cancellable, Non-Returnable) due to its specialized nature. Lead times vary based on market conditions and order quantities.
Conclusion
The XCZU6EG-2FFVC900E represents an optimal choice for applications requiring the combination of quad-core ARM processing, integrated graphics capability, real-time control, and flexible programmable logic. The -2 speed grade delivers enhanced performance for demanding infrastructure, data center, and aerospace applications. The comprehensive peripheral set, proven UltraScale+ architecture, and extensive software ecosystem make this device ideal for next-generation embedded systems requiring both processing power and hardware acceleration capabilities.
