The XCZU6EG-L2FFVB1156E is a high-performance multiprocessor system-on-chip (MPSoC) from AMD Xilinx’s Zynq UltraScale+ EG family. This advanced heterogeneous computing platform combines a powerful 64-bit quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5F real-time processor, ARM Mali-400 MP2 GPU, and programmable logic (PL) fabric in a single 16nm FinFET+ device. Designed for demanding industrial, communications, and embedded vision applications, this Xilinx FPGA delivers exceptional processing capabilities with extended temperature reliability.
XCZU6EG-L2FFVB1156E Key Features and Specifications
The XCZU6EG-L2FFVB1156E integrates heterogeneous processing elements with high-performance programmable logic, making it ideal for applications requiring real-time processing, hardware acceleration, and advanced connectivity.
Part Number Breakdown
| Segment |
Value |
Description |
| XCZU |
— |
Zynq UltraScale+ MPSoC Family |
| 6EG |
— |
Device size with EG variant (includes GPU) |
| L2 |
— |
Low-power -2 speed grade |
| FFVB1156 |
— |
1156-ball FCBGA package (35mm × 35mm) |
| E |
— |
Extended temperature range (-40°C to +100°C) |
XCZU6EG-L2FFVB1156E Technical Specifications
Processing System (PS) Specifications
| Feature |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53, 64-bit, up to 1.5 GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F, 32-bit, up to 600 MHz |
| Graphics Processing Unit (GPU) |
ARM Mali-400 MP2, up to 667 MHz |
| L1 Cache (per A53 core) |
32 KB I-Cache + 32 KB D-Cache |
| L2 Cache |
1 MB shared (APU) |
| On-Chip Memory (OCM) |
256 KB |
| Floating Point |
Single and double precision (APU and RPU) |
| Security Features |
AES-256, SHA-256, RSA, secure boot |
Programmable Logic (PL) Specifications
| Resource |
Quantity |
| System Logic Cells |
504,000+ |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Distributed RAM |
9.0 Mb |
| Block RAM |
19.1 Mb |
| UltraRAM |
9.0 Mb |
| DSP Slices |
1,973 |
| Max. HP I/O |
208 |
| Max. HD I/O |
96 |
High-Speed Transceiver Specifications
| Transceiver Type |
Quantity |
Max Data Rate |
| GTH Transceivers |
16 |
16.3 Gb/s |
| PS-GTR Transceivers |
4 |
6.0 Gb/s |
Memory Interface Support
| Memory Type |
Max Data Rate |
| DDR4 |
2400 Mb/s |
| DDR3/DDR3L |
2133 Mb/s |
| LPDDR4 |
2133 Mb/s |
| LPDDR3 |
2133 Mb/s |
XCZU6EG-L2FFVB1156E Package Information
FFVB1156 Package Details
| Parameter |
Specification |
| Package Type |
Flip-Chip Fine-Pitch BGA |
| Total Balls |
1156 |
| Body Size |
35 mm × 35 mm |
| Ball Pitch |
1.0 mm |
| Mounting Type |
Surface Mount (SMD/SMT) |
| Lead-Free Status |
RoHS Compliant |
XCZU6EG-L2FFVB1156E Electrical Characteristics
Operating Conditions
| Parameter |
Min |
Typ |
Max |
Unit |
| VCCINT (Core Voltage) |
0.825 |
0.85 |
0.876 |
V |
| VCCAUX (Auxiliary Voltage) |
1.746 |
1.8 |
1.854 |
V |
| Junction Temperature |
-40 |
— |
+100 |
°C |
| Storage Temperature |
-65 |
— |
+150 |
°C |
Integrated Peripheral Interfaces
The XCZU6EG-L2FFVB1156E processing system includes comprehensive peripheral connectivity for system integration.
Connectivity Features
| Interface |
Specification |
| USB |
2× USB 2.0 (Host/Device/OTG) |
| Gigabit Ethernet |
4× RGMII/SGMII MAC |
| PCIe |
Gen2 x4 / Gen1 x8 via PS-GTR |
| SATA |
3.1 (6 Gb/s) via PS-GTR |
| DisplayPort |
1.2 (via PS-GTR) |
| UART |
2× channels |
| SPI |
2× channels |
| I2C |
2× channels |
| CAN |
2× CAN 2.0B |
| GPIO |
78 MIO + 96 EMIO |
| SD/eMMC |
2× SDIO 3.0 / eMMC 4.51 |
XCZU6EG-L2FFVB1156E Target Applications
Industrial and Automation
The XCZU6EG-L2FFVB1156E excels in industrial applications requiring deterministic real-time control with the dual-core ARM Cortex-R5F processor, combined with parallel processing capabilities in the programmable logic fabric. Ideal applications include motor control systems, industrial robotics, machine vision inspection, and programmable logic controllers (PLCs).
Communications and Networking
With 16 GTH transceivers supporting up to 16.3 Gb/s line rates and integrated PCIe Gen2 capability, this MPSoC addresses high-bandwidth networking applications such as 5G wireless infrastructure, software-defined radio (SDR), network function virtualization (NFV), and high-speed packet processing.
Embedded Vision and Video Processing
The integrated ARM Mali-400 MP2 GPU with OpenGL ES 2.0 support enables advanced embedded vision applications including ADAS (advanced driver assistance systems), surveillance systems, medical imaging equipment, and broadcast video processing.
Aerospace and Defense
Extended temperature operation (-40°C to +100°C) ensures reliable performance in harsh environments, making the XCZU6EG-L2FFVB1156E suitable for avionics, radar systems, secure communications, and rugged embedded systems.
Development Tools and Software Ecosystem
AMD Xilinx Design Tools
| Tool |
Purpose |
| Vivado Design Suite |
RTL synthesis, implementation, bitstream generation |
| Vitis Unified Platform |
Embedded software development, AI acceleration |
| PetaLinux Tools |
Linux BSP development and customization |
| Vivado HLS |
C/C++ to RTL high-level synthesis |
Supported Operating Systems
| Operating System |
Support Level |
| Linux (PetaLinux) |
Full support with BSP |
| FreeRTOS |
Full support for RPU |
| VxWorks |
Available |
| QNX |
Available |
XCZU6EG-L2FFVB1156E Ordering Information
| Part Number |
Speed Grade |
Temperature Range |
Package |
| XCZU6EG-L2FFVB1156E |
-2 (Low Power) |
Extended (-40°C to +100°C) |
1156-ball FCBGA |
Related Part Numbers
| Part Number |
Variation |
| XCZU6EG-1FFVB1156I |
-1 Speed Grade, Industrial Temp |
| XCZU6EG-2FFVB1156I |
-2 Speed Grade, Industrial Temp |
| XCZU6EG-1FFVC900E |
FFVC900 Package, Extended Temp |
| XCZU6EG-2FFVC900E |
FFVC900 Package, Extended Temp |
Why Choose the XCZU6EG-L2FFVB1156E?
The XCZU6EG-L2FFVB1156E delivers an optimal balance of processing performance, programmable logic resources, and power efficiency for next-generation embedded systems. The heterogeneous architecture enables hardware/software partitioning flexibility, allowing designers to accelerate compute-intensive algorithms in programmable logic while running application software on the high-performance ARM processors.
Key Advantages
- Heterogeneous Computing: Combines 64-bit application processor, real-time processor, GPU, and FPGA fabric in one device
- Low Power Operation: L2 speed grade optimized for reduced power consumption at 0.85V or 0.72V operation
- Extended Temperature: Operates reliably from -40°C to +100°C for industrial and automotive environments
- High-Speed Connectivity: 16× GTH transceivers at 16.3 Gb/s plus 4× PS-GTR at 6 Gb/s
- Advanced Security: Hardware-based security with AES-256 encryption, secure boot, and anti-tamper features
- 16nm FinFET+ Technology: Industry-leading process technology for optimal performance-per-watt
Documentation and Resources
For complete technical documentation, refer to the following AMD Xilinx resources:
| Document |
Description |
| DS891 |
Zynq UltraScale+ MPSoC Data Sheet: Overview |
| DS925 |
Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics |
| UG1085 |
Zynq UltraScale+ MPSoC Technical Reference Manual |
| UG1075 |
Zynq UltraScale+ MPSoC Packaging and Pinouts |
| UG571 |
UltraScale Architecture SelectIO Resources User Guide |
Conclusion
The XCZU6EG-L2FFVB1156E represents AMD Xilinx’s commitment to delivering high-performance, energy-efficient heterogeneous computing solutions. With its combination of quad-core ARM Cortex-A53 processors, dual-core ARM Cortex-R5F real-time processors, ARM Mali-400 MP2 GPU, and extensive programmable logic resources, this Zynq UltraScale+ MPSoC provides the flexibility and performance required for today’s most demanding embedded applications in industrial automation, communications, embedded vision, and aerospace systems.
