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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-1FFVC1156I: Xilinx Zynq UltraScale+ MPSoC for Industrial Applications

Product Details

The XCZU7CG-1FFVC1156I is a high-performance System-on-Chip (SoC) from the AMD/Xilinx Zynq UltraScale+ MPSoC CG series. This industrial-grade multiprocessor combines dual ARM Cortex-A53 and dual ARM Cortex-R5 cores with programmable logic featuring over 504,000 logic cells. Designed for demanding industrial motor control, sensor fusion, and embedded computing applications, this device delivers exceptional performance in a compact 1156-pin FCBGA package.

Explore our complete selection of Xilinx FPGA products for your next project.

XCZU7CG-1FFVC1156I Key Features and Benefits

The XCZU7CG-1FFVC1156I integrates advanced processing system architecture with programmable logic on a single chip. This multiprocessor SoC provides 64-bit processor scalability while combining real-time control capabilities with hardware engines for graphics, video, waveform, and packet processing.

Dual-Core ARM Cortex-A53 Application Processor

The processing system features dual ARM Cortex-A53 MPCore processors with CoreSight debug technology. These application processors operate at speeds up to 1.2 GHz, delivering sufficient computational power for complex embedded applications including industrial automation, machine vision, and intelligent edge computing.

Dual ARM Cortex-R5 Real-Time Processor

Complementing the application processors, the XCZU7CG-1FFVC1156I includes dual ARM Cortex-R5 real-time processing units running at 500 MHz. These processors handle time-critical operations with deterministic response times, making this device ideal for industrial control systems requiring precise timing.

504K+ Programmable Logic Cells

The integrated Zynq UltraScale+ FPGA fabric provides more than 504,000 logic cells built on advanced 20nm technology. This programmable logic enables custom hardware acceleration, parallel processing, and application-specific implementations that complement the software running on the ARM cores.

XCZU7CG-1FFVC1156I Technical Specifications

Parameter Specification
Part Number XCZU7CG-1FFVC1156I
Manufacturer AMD (Xilinx)
Series Zynq UltraScale+ MPSoC CG
Logic Cells 504,000+
Application Processor Dual ARM Cortex-A53 @ 1.2 GHz
Real-Time Processor Dual ARM Cortex-R5 @ 500 MHz
On-Chip RAM 256 KB
Process Technology 20nm
Core Voltage (VCCINT) 0.85V
Speed Grade -1
Package Type 1156-FCBGA (35mm x 35mm)
User I/O Pins 360
Operating Temperature -40°C to +100°C (Industrial)
RoHS Compliance Yes (Lead-Free)

XCZU7CG-1FFVC1156I Connectivity and Peripheral Interfaces

The XCZU7CG-1FFVC1156I provides comprehensive connectivity options essential for industrial and embedded systems integration.

Communication Interfaces

  • Ethernet: High-speed networking for industrial IoT applications
  • USB OTG: Universal Serial Bus with On-The-Go capability
  • CANbus: Industrial communication protocol for automotive and factory automation
  • SPI: Serial Peripheral Interface for sensor and peripheral connectivity
  • I²C: Two-wire serial interface for low-speed device communication
  • UART/USART: Universal asynchronous/synchronous serial communication

Memory and Storage Interfaces

  • DDR4/DDR3/DDR3L: External memory controller support
  • MMC/SD/SDIO: Secure Digital and MultiMediaCard interfaces
  • EBI/EMI: External Bus Interface for legacy memory connectivity
  • NAND Flash: Support for NAND-based storage solutions

On-Chip Peripherals

  • DMA Controller: Direct Memory Access for efficient data transfer
  • Watchdog Timer (WDT): System reliability and fault recovery
  • GPIO: General-purpose input/output for custom interfaces

Industrial Temperature Range Performance

The “I” suffix in XCZU7CG-1FFVC1156I indicates industrial temperature grade qualification. This device operates reliably across the extended temperature range from -40°C to +100°C junction temperature. Industrial-grade operation ensures dependable performance in harsh environments including factory floors, outdoor installations, and transportation systems.

XCZU7CG-1FFVC1156I Target Applications

The dual-core CG variant of Zynq UltraScale+ MPSoC excels in specific application domains where the combination of real-time processing and programmable logic delivers optimal results.

Industrial Motor Control Systems

High-performance motor drive applications benefit from the real-time ARM Cortex-R5 processors handling control loops while the FPGA fabric implements custom PWM generation and sensor interfaces. This architecture supports advanced motor control algorithms including field-oriented control and model predictive control.

Sensor Fusion Platforms

Multi-sensor systems leverage the parallel processing capabilities of the programmable logic combined with the computational power of the ARM Cortex-A53 cores. Applications include industrial inspection systems, robotics, and automated guided vehicles.

Embedded Vision and Image Processing

The XCZU7CG-1FFVC1156I supports embedded vision applications requiring real-time image acquisition and processing. The FPGA fabric handles pixel-level operations while the application processors run higher-level algorithms.

Industrial Internet of Things (IIoT)

Connected industrial devices benefit from the comprehensive networking capabilities and processing power. Edge computing implementations can perform local analytics and decision-making while maintaining connectivity to cloud platforms.

XCZU7CG-1FFVC1156I Package Information

The FFVC1156 package designation indicates a fine-pitch flip-chip ball grid array with 1156 solder balls arranged on a 35mm x 35mm substrate. This package style provides excellent thermal and electrical performance characteristics suitable for high-reliability industrial applications.

Package Specifications

Parameter Value
Package Code FFVC1156
Ball Count 1156
Package Dimensions 35mm x 35mm
Ball Pitch 1.0mm
Package Height 2.7mm (nominal)
Mounting Type Surface Mount (BGA)

Development Tools and Software Support

The XCZU7CG-1FFVC1156I is supported by AMD Vivado Design Suite for FPGA development and PetaLinux for embedded Linux deployment. These comprehensive development environments streamline the design process from initial prototyping through production.

Vivado Design Suite

The primary development environment for Zynq UltraScale+ devices provides integrated tools for hardware design, simulation, synthesis, and implementation. Vivado supports high-level synthesis for accelerated development workflows.

PetaLinux Tools

Embedded Linux development is supported through the PetaLinux tool chain, enabling rapid deployment of Linux-based applications on the ARM processing system.

Vitis Unified Software Platform

The Vitis platform provides application development tools including libraries, acceleration frameworks, and debugging capabilities for heterogeneous computing applications spanning the PS and PL domains.

XCZU7CG-1FFVC1156I Part Number Decoder

Understanding the AMD/Xilinx part numbering convention helps identify device capabilities:

Segment Value Meaning
XC XC Xilinx Commercial
ZU7 ZU7 Zynq UltraScale+ Size 7
CG CG Dual-Core Cortex-A53 Variant
-1 -1 Speed Grade (Standard)
FFVC FFVC Package Type
1156 1156 Pin Count
I I Industrial Temperature Range

Ordering Information

The XCZU7CG-1FFVC1156I is available from authorized AMD/Xilinx distributors worldwide. This device is typically supplied in tray packaging and classified as NCNR (Non-Cancellable, Non-Returnable) due to its specialized nature.

Related Zynq UltraScale+ MPSoC Devices

Engineers evaluating the XCZU7CG-1FFVC1156I may also consider these related devices based on specific project requirements:

  • XCZU7CG-2FFVC1156I: Higher speed grade (-2) variant with 1.3 GHz application processor speed
  • XCZU7EG-1FFVC1156I: Quad-core Cortex-A53 variant for increased processing capability
  • XCZU7EV-1FFVC1156I: Video codec-equipped variant for multimedia applications
  • XCZU7CG-1FFVC1156E: Extended temperature variant for wider operating range

Conclusion

The XCZU7CG-1FFVC1156I represents an optimal choice for industrial embedded applications requiring the combination of deterministic real-time processing, high-performance application processing, and flexible programmable logic. The industrial temperature rating, comprehensive peripheral set, and proven Zynq UltraScale+ architecture make this device suitable for demanding applications in motor control, sensor fusion, and embedded computing domains.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.