Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-1FFVF1517I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA – Complete Technical Guide

Product Details

The XCZU7CG-1FFVF1517I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced Xilinx FPGA combines a powerful ARM Cortex processor with programmable logic, making it ideal for industrial automation, embedded vision, and edge computing applications.


XCZU7CG-1FFVF1517I Overview and Key Features

The XCZU7CG-1FFVF1517I belongs to the CG (Cost-optimized GPU-less) variant of the Zynq UltraScale+ MPSoC product line. Built on advanced 20nm FinFET technology, this SoC FPGA delivers exceptional performance-per-watt while maintaining cost efficiency for industrial-grade applications.

Why Choose the XCZU7CG-1FFVF1517I?

This versatile MPSoC addresses the growing demand for heterogeneous computing in modern embedded systems. Engineers select the XCZU7CG-1FFVF1517I for applications requiring:

  • Real-time processing with deterministic response times
  • Hardware acceleration for compute-intensive algorithms
  • Flexible I/O connectivity and protocol support
  • Industrial temperature range operation (-40°C to +100°C)

XCZU7CG-1FFVF1517I Technical Specifications

The table below presents the complete technical specifications for the XCZU7CG-1FFVF1517I AMD Xilinx FPGA.

General Specifications

Parameter Specification
Manufacturer AMD (Xilinx)
Part Number XCZU7CG-1FFVF1517I
Product Family Zynq UltraScale+ MPSoC
Device Type System on Chip (SOC) IC
Technology 20nm FinFET Process
Speed Grade -1 (Standard Speed)
Temperature Grade Industrial (-40°C to +100°C)
Package Type 1517-FCBGA (Flip Chip Ball Grid Array)
Package Dimensions 40mm × 40mm
Ball Pitch 1.0mm
RoHS Status Compliant

Processing System (PS) Specifications

Component Details
Application Processing Unit (APU) Dual-core ARM Cortex-A53 MPCore with CoreSight
APU Maximum Frequency Up to 1.3 GHz
L1 Cache (per core) 32KB Instruction / 32KB Data
L2 Cache (Shared) 1MB with ECC
Real-time Processing Unit (RPU) Dual-core ARM Cortex-R5F with CoreSight
RPU Features Single/Double Precision Floating Point
On-Chip Memory 256KB with ECC Protection
Core Voltage (VCCINT) 0.85V

Programmable Logic (PL) Resources

Resource Quantity
System Logic Cells 504,000+
CLB Flip-Flops 461,760
CLB LUTs 230,880
Distributed RAM 4.0 Mb Maximum
Block RAM 11.0 Mb (312 Blocks × 36Kb)
DSP Slices 1,728

Memory Interface Support

Interface Type Specification
DDR4 Up to 2,400 MT/s
DDR3/DDR3L Supported
LPDDR4 Supported
LPDDR3 Supported
Quad-SPI Flash Supported
NAND Flash Supported
eMMC Supported

High-Speed Serial Transceivers

Transceiver Type Details
PS-GTR Transceivers Up to 6.0 Gb/s
GTH Transceivers Up to 16.3 Gb/s
PCIe Support Gen1/Gen2
USB 3.0 Supported via PS-GTR
SATA Supported via PS-GTR
DisplayPort Supported via PS-GTR

Connectivity and Peripheral Interfaces

Interface Quantity/Details
Gigabit Ethernet MAC 4× Triple-speed (10/100/1000 Mbps)
USB 2.0 Controllers 2× (Host/Device/OTG)
I2C Controllers Multiple
SPI Controllers Multiple
UART Multiple
CAN 2.0B ISO 11898-1 Compliant
GPIO (MIO) Up to 78 pins
GPIO (EMIO) Up to 96 pins (via PL)

I/O Specifications

I/O Type Details
High-Performance (HP) I/O 1.0V to 1.8V Support
High-Density (HD) I/O 1.2V to 3.3V Support
Maximum User I/O 347
SelectIO Technology Multi-standard support

XCZU7CG-1FFVF1517I Part Number Breakdown

Understanding the AMD Xilinx part numbering system helps identify exact device specifications:

Code Segment Meaning
XC Xilinx Commercial Product
ZU Zynq UltraScale+ Family
7 Device Size (Logic Density)
CG Cost-optimized, GPU-less variant
-1 Speed Grade (Standard)
FF Flip-Chip Package
V Lead-Free Package
F1517 1517-Ball FCBGA Package
I Industrial Temperature Range

XCZU7CG-1FFVF1517I Target Applications

The XCZU7CG-1FFVF1517I excels in demanding industrial and commercial applications:

Industrial Automation and Control

  • Programmable Logic Controllers (PLCs)
  • Motor drive systems with real-time control
  • Industrial IoT gateways and edge computing nodes
  • Factory automation and robotics

Embedded Vision and Imaging

  • Machine vision systems
  • Video surveillance and analytics
  • Medical imaging equipment
  • Autonomous inspection systems

Communications Infrastructure

  • Software-defined networking (SDN)
  • Network function virtualization (NFV)
  • Wireless base station equipment
  • Protocol bridging and conversion

Test and Measurement

  • High-speed data acquisition systems
  • Signal processing platforms
  • Automated test equipment (ATE)
  • Protocol analyzers

XCZU7CG-1FFVF1517I Speed Grade Options

The Zynq UltraScale+ XCZU7CG is available in multiple speed grades to match application requirements:

Speed Grade Performance Level Typical Use Case
-1 (XCZU7CG-1FFVF1517I) Standard Cost-sensitive industrial applications
-2 Higher Performance Performance-critical systems
-3E Highest Performance Maximum throughput requirements
-1LI/-2LE Low Power Battery-powered or thermally constrained

XCZU7CG-1FFVF1517I Package Options

The XCZU7CG device family supports multiple package configurations:

Package Ball Count Dimensions Max User I/O
FBVB900 900 31mm × 31mm 252
FFVC1156 1156 35mm × 35mm 300
FFVF1517 1517 40mm × 40mm 347

XCZU7CG-1FFVF1517I Development Tools and Software

AMD Xilinx provides comprehensive development tools for the XCZU7CG-1FFVF1517I:

Vivado Design Suite

  • Integrated development environment for FPGA/SoC design
  • High-level synthesis (HLS) for C/C++ to RTL conversion
  • Advanced timing analysis and optimization
  • Comprehensive IP library integration

Vitis Unified Software Platform

  • Embedded software development
  • AI/ML acceleration frameworks
  • Hardware-software co-design capabilities
  • Pre-built domain-specific platforms

PetaLinux Tools

  • Embedded Linux BSP generation
  • Kernel and bootloader customization
  • Root filesystem configuration
  • Yocto Project compatibility

XCZU7CG-1FFVF1517I vs. Similar Devices Comparison

Feature XCZU7CG XCZU7EG XCZU7EV
APU Cores Dual Cortex-A53 Dual Cortex-A53 Quad Cortex-A53
Mali GPU No Yes (Mali-400 MP2) Yes (Mali-400 MP2)
Video Codec Unit No No Yes (H.264/H.265)
Logic Cells 504K+ 504K+ 504K+
Target Application Cost-optimized Graphics-enabled Video processing

XCZU7CG-1FFVF1517I Ordering Information

When ordering the XCZU7CG-1FFVF1517I, verify the following specifications match your requirements:

  • Full Part Number: XCZU7CG-1FFVF1517I
  • Manufacturer: AMD (formerly Xilinx)
  • Package: 1517-FCBGA, 40mm × 40mm, 1.0mm pitch
  • Temperature: Industrial grade (-40°C to +100°C)
  • Lead-Free: RoHS compliant

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.