The XCZU7CG-2FBVB900E is a high-performance System-on-Chip (SoC) from AMD/Xilinx’s Zynq UltraScale+ MPSoC family. This advanced embedded processor combines powerful ARM Cortex processing cores with programmable logic in a single integrated device, delivering exceptional performance for industrial, communications, and embedded computing applications.
Built on cutting-edge 20nm technology, the XCZU7CG-2FBVB900E offers 504,000 logic cells, making it an ideal choice for engineers developing complex signal processing, motor control, and industrial automation systems.
XCZU7CG-2FBVB900E Key Features and Benefits
The XCZU7CG-2FBVB900E stands out in the Xilinx FPGA portfolio with its unique combination of processing power and programmable flexibility. This Zynq UltraScale+ CG device integrates dual-core ARM Cortex-A53 application processors with dual-core ARM Cortex-R5F real-time processors, enabling both high-level software execution and deterministic real-time control within a single chip.
The device features UltraScale architecture programmable logic with extensive DSP capabilities, high-bandwidth memory interfaces, and comprehensive peripheral connectivity. Engineers benefit from reduced system complexity, lower power consumption, and faster time-to-market compared to discrete FPGA plus processor solutions.
XCZU7CG-2FBVB900E Technical Specifications
Processing System Specifications
| Parameter |
Specification |
| Manufacturer |
AMD / Xilinx |
| Part Number |
XCZU7CG-2FBVB900E |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Type |
CG (Cost-optimized without GPU) |
| Application Processor |
Dual-core ARM Cortex-A53 MPCore (up to 1.2 GHz) |
| Real-Time Processor |
Dual-core ARM Cortex-R5F (up to 600 MHz) |
| On-Chip Memory |
256 KB with ECC |
| L2 Cache |
1 MB |
Programmable Logic Resources
| Resource |
Value |
| System Logic Cells |
504,000 |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Distributed RAM |
8.8 Mb |
| Block RAM |
28.0 Mb (912 blocks) |
| UltraRAM |
11.0 Mb |
| DSP Slices |
1,728 |
Electrical and Package Specifications
| Parameter |
Value |
| Process Technology |
20nm |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-2 |
| Operating Temperature |
0°C to +100°C (Extended Commercial) |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Pin Count |
900-Pin |
| Package Designation |
FBVB900 |
| Ball Pitch |
1.0mm |
| RoHS Compliance |
Yes |
XCZU7CG-2FBVB900E I/O and Connectivity Features
Input/Output Capabilities
| I/O Type |
Maximum Available |
| High-Performance (HP) I/O |
208 |
| High-Density (HD) I/O |
120 |
| PS Multiplexed I/O (MIO) |
78 |
| HP I/O Voltage Range |
1.0V to 1.8V |
| HD I/O Voltage Range |
1.2V to 3.3V |
High-Speed Serial Transceivers
| Transceiver Type |
Specification |
| PS-GTR Transceivers |
4 |
| GTH Transceivers |
4 |
| Maximum Data Rate (GTH) |
Up to 16.3 Gb/s |
| Maximum Data Rate (PS-GTR) |
Up to 6.0 Gb/s |
Integrated Connectivity Interfaces
| Interface |
Description |
| PCIe |
Gen1/Gen2 support |
| USB |
USB 2.0 and USB 3.0 |
| SATA |
Serial ATA 3.1 |
| DisplayPort |
DisplayPort 1.2a |
| Ethernet |
4x Triple Speed Gigabit Ethernet MAC |
| CAN |
CAN 2.0B (ISO11898-1) |
| UART |
Multiple UART controllers |
| I2C |
Multiple I2C controllers |
| SPI |
Multiple SPI controllers |
| GPIO |
128-bit GPIO |
XCZU7CG-2FBVB900E Memory Interface Support
External Memory Controller Support
| Memory Type |
Support |
| DDR4 |
Yes |
| DDR3/DDR3L |
Yes |
| LPDDR4 |
Yes |
| LPDDR3 |
Yes |
| Quad SPI Flash |
Yes |
| NAND Flash |
Yes |
| eMMC |
Yes |
The XCZU7CG-2FBVB900E includes dedicated memory PHY blocks that support high-performance DDR4 interfaces, ensuring optimal signal integrity for demanding memory bandwidth requirements.
XCZU7CG-2FBVB900E Applications and Use Cases
Industrial and Automation
The XCZU7CG-2FBVB900E excels in industrial applications requiring real-time control combined with advanced signal processing. Common applications include programmable logic controllers (PLCs), industrial motor drives, machine vision systems, and factory automation equipment.
Communications Infrastructure
This Zynq UltraScale+ MPSoC is well-suited for wireless infrastructure, software-defined radio (SDR), and network packet processing applications. The combination of high-speed transceivers and programmable logic enables flexible protocol implementation.
Medical and Scientific Equipment
The device’s processing capabilities and extensive I/O make it ideal for medical imaging systems, diagnostic equipment, and scientific instrumentation requiring precise timing and high-bandwidth data acquisition.
Aerospace and Defense
With its extended temperature range and robust architecture, the XCZU7CG-2FBVB900E is suitable for avionics, radar systems, and electronic warfare applications where reliability and performance are critical.
XCZU7CG-2FBVB900E Part Number Decoder
Understanding the AMD/Xilinx part number convention helps identify the exact device configuration:
| Code Segment |
Value |
Meaning |
| XC |
XC |
Commercial grade device |
| ZU7 |
ZU7 |
Zynq UltraScale+ device size |
| CG |
CG |
CG variant (no GPU, cost-optimized) |
| -2 |
-2 |
Speed grade -2 |
| F |
F |
Flip-chip package |
| BVB |
BVB |
Ball pitch and package family |
| 900 |
900 |
Pin count |
| E |
E |
Extended commercial temperature (0°C to +100°C) |
Related Part Numbers
| Part Number |
Difference |
| XCZU7CG-2FBVB900I |
Industrial temperature (-40°C to +100°C) |
| XCZU7CG-1FBVB900E |
Speed grade -1 (lower performance) |
| XCZU7EG-2FBVB900E |
EG variant (includes Mali GPU) |
| XCZU7CG-2FFVC1156E |
Larger 1156-pin package |
XCZU7CG-2FBVB900E Development Resources
Software Development Tools
The XCZU7CG-2FBVB900E is fully supported by AMD’s comprehensive development ecosystem:
| Tool |
Description |
| Vivado Design Suite |
FPGA synthesis, implementation, and debug |
| Vitis Unified Platform |
Software development and AI acceleration |
| PetaLinux Tools |
Embedded Linux development |
| Vivado HLS |
High-Level Synthesis for C/C++ |
Documentation and Support
| Resource |
Description |
| DS891 |
Zynq UltraScale+ MPSoC Data Sheet: Overview |
| UG1085 |
Zynq UltraScale+ MPSoC Technical Reference Manual |
| UG574 |
UltraScale Architecture CLB User Guide |
| UG571 |
UltraScale Architecture SelectIO Resources |
Why Choose XCZU7CG-2FBVB900E for Your Design
Performance Advantages
The XCZU7CG-2FBVB900E delivers exceptional computational density with its 504K logic cells and 1,728 DSP slices, enabling complex algorithms and parallel processing architectures that outperform traditional CPU-based solutions.
Power Efficiency
The 20nm process technology and advanced power management features enable operation at lower power levels compared to previous generation devices. The separate PS and PL power domains allow dynamic power optimization based on application requirements.
Design Flexibility
The combination of hard processor cores and programmable logic provides unmatched flexibility for product differentiation and field upgrades. Engineers can implement custom hardware accelerators optimized for specific workloads while maintaining software compatibility.
Long-Term Availability
As part of AMD’s Zynq UltraScale+ family, the XCZU7CG-2FBVB900E benefits from long-term production commitments and extensive ecosystem support, ensuring design longevity for industrial and commercial applications.
XCZU7CG-2FBVB900E Ordering Information
| Order Code |
Description |
| XCZU7CG-2FBVB900E |
Extended Commercial, Speed Grade -2, 900-Pin FCBGA, Tray |
For volume pricing, technical support, and custom configuration options, contact your authorized AMD/Xilinx distributor or visit our product page for the latest availability information.
