The XCZU7CG-2FFVC1156E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC CG family. This advanced FPGA device combines powerful ARM processors with programmable logic, making it ideal for industrial automation, aerospace, telecommunications, and embedded computing applications. Whether you’re designing next-generation edge computing systems or complex signal processing solutions, this component delivers exceptional performance and flexibility.
Looking for premium Xilinx FPGA components? The XCZU7CG-2FFVC1156E offers an excellent balance of processing power and programmable resources.
XCZU7CG-2FFVC1156E Key Features and Benefits
The XCZU7CG-2FFVC1156E stands out in the Zynq UltraScale+ MPSoC lineup due to its robust architecture. This CG-variant device integrates a sophisticated processing system with high-density programmable logic, all within a compact 1156-ball FCBGA package.
Processing System Specifications
The processing subsystem of this MPSoC includes:
- Application Processing Unit (APU): Dual-core ARM Cortex-A53 MPCore running at up to 1.3GHz
- Real-Time Processing Unit (RPU): Dual-core ARM Cortex-R5 MPCore operating at up to 533MHz
- On-Chip Memory: 256KB OCM with ECC protection
- L2 Cache: 1MB shared cache with ECC
Programmable Logic Resources
The FPGA fabric provides substantial resources for custom hardware acceleration:
| Resource Type |
Quantity |
| System Logic Cells |
504K+ |
| CLB Flip-Flops |
460,800 |
| Block RAM |
11Mb |
| DSP Slices |
1,728 |
| Maximum User I/O |
360 |
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XCZU7CG-2FFVC1156E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC CG |
| Package Type |
1156-FCBGA (35mm x 35mm) |
| Ball Pitch |
1.0mm |
| Speed Grade |
-2 (Standard Performance) |
| Temperature Range |
Extended (E) |
| Process Technology |
16nm FinFET+ |
| Core Voltage |
0.85V |
| APU Frequency |
Up to 1.3GHz |
| RPU Frequency |
Up to 533MHz |
XCZU7CG-2FFVC1156E Connectivity Options
High-Speed Interfaces
This Zynq UltraScale+ device supports multiple high-speed connectivity protocols essential for modern embedded systems:
- PCIe: Gen2 x4 lanes for high-bandwidth peripheral connectivity
- USB 3.0: Dual USB 3.0 ports with SuperSpeed capability
- SATA 3.1: Serial ATA interface for storage applications
- DisplayPort: Version 1.2a for video output applications
- Gigabit Ethernet: 4x tri-mode Gigabit Ethernet controllers
General Purpose Connectivity
Additional interfaces include:
- 2x USB 2.0 ports
- 2x SD/SDIO controllers
- 2x UART serial interfaces
- 2x CAN 2.0B controllers
- 2x I2C interfaces
- 2x SPI ports
- 4x 32-bit GPIO banks
Memory Interface Support
The XCZU7CG-2FFVC1156E provides comprehensive memory controller support for various memory technologies:
Dynamic Memory
| Memory Type |
Bus Width |
ECC Support |
| DDR4 |
x32/x64 |
Yes |
| LPDDR4 |
x32/x64 |
Yes |
| DDR3/DDR3L |
x32/x64 |
Yes |
| LPDDR3 |
x32/x64 |
Yes |
Static Memory Interfaces
- Quad-SPI NOR Flash (2x controllers)
- NAND Flash controller
- SD/eMMC interfaces
Security and Power Management Features
Integrated Security Functions
The device incorporates hardware-based security features:
- RSA Authentication: Secure boot verification
- AES-256 Decryption: Configuration bitstream protection
- SHA-3 Hashing: Data integrity verification
- TrustZone Technology: Arm TrustZone for secure processing domains
Advanced Power Management
Power efficiency is achieved through:
- Multiple power domains (Full, Low, PL, Battery)
- Independent PS and PL power planes
- System Management Unit for voltage/temperature monitoring
- 10-bit, 1MSPS integrated ADC
Package Information and Pinout
1156-FCBGA Package Details
| Specification |
Value |
| Package Code |
FFVC1156 |
| Body Size |
35mm x 35mm |
| Ball Count |
1156 |
| Ball Pitch |
1.0mm |
| Ball Arrangement |
Grid Array |
| Mount Type |
Surface Mount |
I/O Bank Distribution
The XCZU7CG-2FFVC1156E offers:
- High-Performance I/O (HP): 1.0V to 1.8V voltage support
- High-Density I/O (HD): 1.2V to 3.3V voltage support
- PS-GTR Transceivers: For high-speed serial connectivity
- Maximum User I/O Pins: 360
Ideal Applications for XCZU7CG-2FFVC1156E
This Zynq UltraScale+ MPSoC excels in numerous demanding applications:
Industrial and Automation
- Motor control systems
- Industrial IoT gateways
- Machine vision systems
- Robotics controllers
Communications and Networking
- 5G infrastructure equipment
- Network packet processing
- Software-defined radio (SDR)
- Base station controllers
Aerospace and Defense
- Radar signal processing
- Secure communications
- Avionics systems
- Surveillance equipment
Medical and Scientific
- Medical imaging systems
- Laboratory instrumentation
- Data acquisition systems
- Test and measurement equipment
Development Tools and Software Support
Vivado Design Suite
AMD provides comprehensive development support through:
- Vivado Design Suite for FPGA development
- Vitis Unified Software Platform
- PetaLinux embedded Linux tools
- Software Development Kit (SDK)
Evaluation and Development Kits
Compatible development platforms include:
- ZCU102 Evaluation Kit
- ZCU104 Evaluation Kit
- Third-party System-on-Module (SoM) options
Ordering Information and Part Number Breakdown
Understanding the XCZU7CG-2FFVC1156E part number:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU7 |
Zynq UltraScale+ Device 7 |
| CG |
CG Variant (Dual-core A53, no GPU/Video Codec) |
| -2 |
Speed Grade (-2 Standard) |
| FF |
Flip-chip package with 1.0mm pitch |
| VC |
Lead-free RoHS compliant |
| 1156 |
1156 Ball count |
| E |
Extended temperature range |
Why Choose the XCZU7CG-2FFVC1156E?
The XCZU7CG-2FFVC1156E offers several compelling advantages:
- Cost-Effective Performance: The CG variant provides dual-core ARM processing at a competitive price point
- Scalable Architecture: Easy migration path within the Zynq UltraScale+ family
- Integrated Solution: Combines processor, FPGA, and I/O in a single package
- Extended Temperature Support: Suitable for industrial and harsh environments
- Long-Term Availability: AMD’s commitment to product longevity
Frequently Asked Questions
What is the difference between CG, EG, and EV variants?
The CG variant features dual-core ARM Cortex-A53 processors without integrated GPU or video codec. EG variants add quad-core A53 and Mali-400 GPU, while EV variants include H.264/H.265 video codec capabilities.
Is the XCZU7CG-2FFVC1156E RoHS compliant?
Yes, this device is fully RoHS compliant with lead-free packaging, as indicated by the “VC” designation in the part number.
What temperature range does the “E” suffix indicate?
The “E” suffix denotes Extended temperature range operation, typically -40°C to +100°C junction temperature.
Can this device replace other Zynq UltraScale+ variants?
The XCZU7CG-2FFVC1156E is footprint compatible with other devices using the FFVC1156 package, allowing for easy board-level migration between device variants.
Summary
The XCZU7CG-2FFVC1156E represents an excellent choice for engineers requiring a powerful, integrated processing and FPGA solution. With its dual ARM Cortex-A53 and Cortex-R5 processors, 504K+ logic cells, comprehensive connectivity options, and robust security features, this Zynq UltraScale+ MPSoC delivers exceptional value for industrial, communications, and embedded computing applications.
For more information on this and other high-performance FPGA components, explore our complete selection of semiconductor products and technical resources.
