Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-2FFVC1156I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA | Complete Technical Guide

Product Details

The XCZU7CG-2FFVC1156I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade FPGA integrates powerful ARM processing cores with programmable logic, making it ideal for embedded systems, industrial automation, and edge computing applications.

Why Choose the XCZU7CG-2FFVC1156I for Your Next Project?

The XCZU7CG-2FFVC1156I combines the flexibility of an FPGA with the processing power of ARM Cortex processors. Engineers and designers choose this device for applications requiring real-time control, high-bandwidth connectivity, and custom hardware acceleration. With 504,000+ system logic cells and dual-core ARM processors, this SoC delivers exceptional performance for demanding embedded applications.


XCZU7CG-2FFVC1156I Technical Specifications

Core Processing Architecture

Specification Details
Part Number XCZU7CG-2FFVC1156I
Manufacturer AMD (formerly Xilinx)
Family Zynq UltraScale+ MPSoC
Device Series CG (Cost-Optimized)
Process Technology 20nm FinFET
Speed Grade -2 (Standard Performance)

ARM Processor Specifications

Processor Unit Details
Application Processor (APU) Dual-core ARM Cortex-A53 MPCore
APU Clock Speed Up to 1.3 GHz
Real-Time Processor (RPU) Dual-core ARM Cortex-R5 MPCore
RPU Clock Speed Up to 533 MHz
L1 Cache 32KB Instruction / 32KB Data per core
L2 Cache 1MB Shared
On-Chip Memory 256KB with ECC

Programmable Logic (PL) Resources

Resource Quantity
System Logic Cells 504,000+
CLB Flip-Flops 460,800
CLB LUTs 230,400
Distributed RAM 7.0 Mb
Block RAM Blocks 312
Block RAM 11 Mb
UltraRAM Blocks 48
UltraRAM 13.5 Mb
DSP Slices 1,728

Package and I/O Configuration

Parameter Specification
Package Type FCBGA (Fine-pitch Ball Grid Array)
Package Code FFVC1156
Ball Count 1156 Balls
Package Dimensions 35mm x 35mm
Ball Pitch 1.0mm
Maximum I/O 360
HP I/O Banks Available
HD I/O Banks Available

XCZU7CG-2FFVC1156I Operating Conditions

Temperature and Environmental Ratings

Parameter Rating
Temperature Grade Industrial (I)
Operating Temperature -40°C to +100°C
Storage Temperature -65°C to +150°C
VCCINT Voltage 0.85V (Standard)
Moisture Sensitivity Level MSL-3
RoHS Compliance RoHS3 Compliant
Lead-Free Status Lead-Free / RoHS Compliant

Memory Interface Support

The XCZU7CG-2FFVC1156I supports multiple high-speed memory interfaces for flexible system design.

Dynamic Memory Controllers

Memory Type Support
DDR4 x32/x64 with ECC
DDR3/DDR3L x32/x64 with ECC
LPDDR4 x32/x64 with ECC
LPDDR3 x32/x64 with ECC

Static Memory Interfaces

Interface Details
NAND Flash Supported
Quad-SPI 2x Controllers

High-Speed Connectivity Features

Integrated Interfaces

Interface Specification
PCIe Gen2 x4
USB 3.0 2x Controllers
USB 2.0 2x Controllers
SATA 3.1
DisplayPort 1.2
Gigabit Ethernet 4x Tri-mode MACs
GTH Transceivers Up to 16.3 Gb/s

General Purpose Connectivity

Interface Quantity
UART 2x
CAN 2.0B 2x
I2C 2x
SPI 2x
GPIO 4x 32-bit (128 total)
SD/SDIO 2x Controllers

Security and Power Management

Integrated Security Features

The XCZU7CG-2FFVC1156I includes hardware-based security features for protecting intellectual property and secure boot applications.

Feature Description
AES Encryption 256-bit AES-GCM Decryption
RSA Authentication RSA-4096 Support
SHA Hashing Secure Hash Algorithm
Secure Boot Authenticated Boot Sequence
Key Storage eFUSE and BBRAM

Power Management Domains

Domain Description
Full Power Complete System Operation
Low Power Reduced Power Consumption
PL Power Programmable Logic Domain
Battery Power Minimal Power for RTC

System Monitor and Analog Features

Feature Specification
ADC Resolution 10-bit
Sample Rate 1 MSPS
Temperature Monitoring On-die Temperature Sensor
Voltage Monitoring Supply Voltage Rails
External Channels Up to 17 Analog Inputs

Development Tools and Software Support

Vivado Design Suite Compatibility

The XCZU7CG-2FFVC1156I is fully supported by AMD Vivado Design Suite, providing comprehensive tools for FPGA development.

Tool Purpose
Vivado HLS High-Level Synthesis
Vivado IP Integrator System Design
Vivado SDK Software Development
PetaLinux Embedded Linux Development
Vitis Unified Software Platform

XCZU7CG-2FFVC1156I Part Number Breakdown

Understanding the part number helps identify device specifications:

Segment Value Meaning
XC XC Xilinx Commercial
ZU7 ZU7 Zynq UltraScale+ Size 7
CG CG Cost-Optimized Device
-2 -2 Speed Grade 2
FF FF Flat Fine-pitch BGA
V V Low-Halogen Package
C C Pb-free Ball Composition
1156 1156 Ball Count
I I Industrial Temperature

Typical Applications for XCZU7CG-2FFVC1156I

This AMD Xilinx Zynq UltraScale+ MPSoC is designed for demanding embedded applications across multiple industries.

Industrial Automation

  • Programmable Logic Controllers (PLCs)
  • Industrial IoT Edge Gateways
  • Motion Control Systems
  • Machine Vision Processing

Communications Infrastructure

  • 5G Base Station Equipment
  • Network Interface Cards
  • Protocol Converters
  • Software-Defined Networking

Medical and Scientific

  • Medical Imaging Systems
  • Laboratory Instrumentation
  • Data Acquisition Systems
  • Real-Time Signal Processing

Aerospace and Defense

  • Radar Signal Processing
  • Secure Communications
  • Avionics Systems
  • Electronic Warfare

Ordering Information

Attribute Value
DigiKey Part Number 122-XCZU7CG-2FFVC1156I-ND
Manufacturer Part Number XCZU7CG-2FFVC1156I
Manufacturer AMD
Product Status Active
Packaging Tray
Quantity Available Contact Distributor

Related Zynq UltraScale+ Devices

For design flexibility, consider these related devices in the Zynq UltraScale+ family:

Part Number Key Difference
XCZU7CG-1FFVC1156I Speed Grade -1 (Lower Performance)
XCZU7CG-2FFVC1156E Commercial Temperature (0°C to +85°C)
XCZU7EG-2FFVC1156I EG Series with Mali GPU
XCZU7EV-2FFVC1156I EV Series with Video Codec
XCZU9CG-2FFVC1156I Higher Logic Capacity

Where to Buy XCZU7CG-2FFVC1156I

Looking for the XCZU7CG-2FFVC1156I or other Zynq UltraScale+ MPSoC devices? Visit trusted distributors for competitive pricing and availability. For a comprehensive selection of AMD Xilinx programmable devices, explore our Xilinx FPGA catalog for the latest products and technical resources.


Conclusion

The XCZU7CG-2FFVC1156I from AMD Xilinx represents a powerful solution for engineers requiring the combination of ARM processing and FPGA flexibility. With its industrial temperature rating, extensive connectivity options, and robust security features, this Zynq UltraScale+ MPSoC is well-suited for demanding embedded applications. The 504,000+ logic cells, dual-core ARM Cortex-A53, and dual-core ARM Cortex-R5 processors provide the processing power needed for modern industrial automation, communications, and edge computing designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.