Product Overview
The XCS30-3VQ100C represents AMD’s commitment to providing reliable, cost-effective programmable logic solutions. As part of the Spartan family, this FPGA offers designers the flexibility to implement custom digital logic while maintaining excellent power efficiency and performance characteristics.
Key Specifications at a Glance
| Specification |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCS30-3VQ100C |
| Series |
Spartan® |
| Total Logic Gates |
30,000 |
| Number of I/O Pins |
77 |
| Package Type |
100-VQFP (14x14mm) |
| Mounting Style |
Surface Mount |
| Operating Temperature |
0°C to 85°C (TJ) |
| Supply Voltage |
4.75V to 5.25V |
Technical Architecture and Features
Logic Resources
The XCS30-3VQ100C delivers robust logic capabilities through its well-designed architecture:
| Resource Type |
Quantity |
Description |
| Configurable Logic Blocks (CLBs) |
576 |
Core logic building blocks |
| Logic Elements/Cells |
1,368 |
Individual logic units |
| Total RAM Bits |
18,432 |
On-chip memory resources |
| Maximum System Gates |
30,000 |
Equivalent gate capacity |
Input/Output Configuration
With 77 user-configurable I/O pins, the XCS30-3VQ100C provides ample connectivity for interfacing with external devices, sensors, and other system components. These I/O pins support various voltage standards and drive strengths, ensuring compatibility with diverse system architectures.
Applications and Use Cases
The XCS30-3VQ100C excels in applications requiring:
- Digital Signal Processing (DSP) – Implement custom filters and processing algorithms
- Communication Systems – Protocol converters and data formatting
- Industrial Control – Custom control logic and state machines
- Test Equipment – Pattern generators and signal analyzers
- Embedded Systems – Glue logic and system integration
- Prototyping – Rapid development and testing of digital designs
Package and Mounting Information
Physical Characteristics
| Parameter |
Specification |
| Package Style |
100-TQFP (Thin Quad Flat Pack) |
| Package Dimensions |
14mm x 14mm |
| Pin Count |
100 pins |
| Lead Pitch |
Fine pitch for high-density PCB layouts |
| Mounting Type |
Surface Mount Technology (SMT) |
The compact VQFP package enables efficient board space utilization while providing reliable electrical connectivity and thermal performance for most commercial applications.
Electrical Specifications
Power Requirements
The XCS30-3VQ100C operates with a standard 5V power supply (4.75V to 5.25V), making it compatible with TTL logic levels and traditional 5V systems. This voltage range provides adequate noise margin while maintaining low power consumption.
Temperature Range
Designed for commercial temperature applications, this FPGA operates reliably from 0°C to 85°C junction temperature, making it suitable for indoor equipment, instrumentation, and general-purpose electronic systems.
Design Resources and Development Tools
When working with the Xilinx FPGA family, designers have access to comprehensive development tools and resources:
- Xilinx ISE Design Suite – Complete design environment for synthesis and implementation
- Hardware Description Languages – Support for VHDL and Verilog
- Simulation Tools – Pre-synthesis and post-synthesis verification
- IP Cores – Pre-designed functional blocks for rapid development
- Technical Documentation – Detailed datasheets and application notes
Memory and Storage Capabilities
On-Chip RAM Distribution
| Memory Type |
Capacity |
Usage |
| Total RAM Bits |
18,432 bits |
Distributed and block RAM |
| Configuration Memory |
N/A |
SRAM-based configuration |
| User Data Storage |
Configurable |
Based on design requirements |
The integrated RAM resources enable designers to implement FIFOs, buffers, lookup tables, and other memory-intensive functions without requiring external memory devices.
Performance Characteristics
Speed Grade
The “-3” speed grade designation indicates the device’s performance tier within the Spartan family. This speed grade offers a balanced combination of:
- Moderate propagation delays
- Competitive clock frequencies
- Cost-effective pricing
- Suitable for most commercial applications
Configuration Options
As an SRAM-based FPGA, the XCS30-3VQ100C requires external configuration memory or an active configuration source upon power-up. This architecture enables:
- Unlimited reprogrammability – Update designs as requirements evolve
- Multiple configuration modes – Master/slave serial, SelectMAP, and JTAG
- Instant design changes – No erasing or specialized programming equipment needed
Quality and Reliability
AMD (Xilinx) FPGAs undergo rigorous testing and qualification processes to ensure consistent performance across production lots. The XCS30-3VQ100C meets industry standards for:
- Electromagnetic compatibility (EMC)
- Electrostatic discharge (ESD) protection
- Moisture sensitivity level (MSL)
- Long-term reliability testing
PCB Design Considerations
Layout Guidelines
When designing circuit boards with the XCS30-3VQ100C, consider these key factors:
| Design Aspect |
Recommendation |
| Power Distribution |
Multiple decoupling capacitors near power pins |
| Ground Planes |
Solid ground plane for signal integrity |
| Trace Routing |
Controlled impedance for high-speed signals |
| Thermal Management |
Adequate copper area for heat dissipation |
| Configuration Interface |
Dedicated routing for configuration pins |
Decoupling Strategy
Implement a comprehensive decoupling scheme with:
- 0.1µF ceramic capacitors at each power pin
- 10µF bulk capacitors per voltage rail
- Low-ESR capacitors for high-frequency noise suppression
Comparison with Related Products
Spartan Family Positioning
| Device |
Gates |
CLBs |
I/O Pins |
RAM Bits |
| XCS20 |
20,000 |
400 |
61 |
12,288 |
| XCS30 |
30,000 |
576 |
77 |
18,432 |
| XCS40 |
40,000 |
784 |
93 |
24,576 |
The XCS30 offers excellent value for applications requiring moderate logic density with robust I/O capabilities.
Product Status and Availability
Important Notice: The XCS30-3VQ100C is currently designated as obsolete by the manufacturer. While existing inventory may still be available through distributors, designers developing new products should consider:
- Alternative Spartan family devices
- Migration to newer FPGA architectures
- Long-term supply chain planning
- Consulting with AMD for recommended replacements
Ordering Information
Part Number Breakdown
XCS30-3VQ100C decodes as follows:
- XC – Xilinx/AMD FPGA product family
- S – Spartan series
- 30 – 30,000 gate equivalent
- -3 – Speed grade (moderate performance)
- VQ100 – 100-pin VQFP package
- C – Commercial temperature range (0°C to 85°C)
Available Packaging
The device is supplied in tray packaging suitable for automated pick-and-place assembly equipment in high-volume manufacturing environments.
Environmental Compliance
The XCS30-3VQ100C conforms to environmental regulations including:
- RoHS compliance (Restriction of Hazardous Substances)
- REACH registration requirements
- Halogen-free options may be available
Getting Started with XCS30-3VQ100C
Development Workflow
- Design Entry – Create HDL code or schematic capture
- Synthesis – Convert design to gate-level netlist
- Implementation – Map, place, and route design to FPGA resources
- Simulation – Verify functional and timing behavior
- Configuration – Program device via JTAG or configuration mode
- Testing – Validate hardware operation in target system
Required Tools
To begin development with this FPGA:
- Xilinx ISE Design Suite (appropriate version for Spartan devices)
- JTAG programming cable (Platform Cable USB or compatible)
- HDL simulator (ModelSim, ISim, or equivalent)
- PCB design software supporting VQFP packages
Technical Support Resources
Designers working with AMD FPGAs have access to extensive support materials:
- Product Documentation – Datasheets, user guides, and application notes
- Design Examples – Reference designs and code templates
- Community Forums – Peer support and knowledge sharing
- Technical Support – Direct assistance from AMD technical experts
- Training Resources – Online courses and webinars
Conclusion
The XCS30-3VQ100C represents a proven FPGA solution offering 30,000 gates of programmable logic in a compact, surface-mount package. With 77 I/O pins, 18,432 RAM bits, and comprehensive development tool support, this device enables designers to implement custom digital logic for diverse embedded applications.
While the product’s obsolete status requires consideration for new designs, its established architecture and extensive documentation make it a well-understood platform for maintenance, upgrades, and legacy system support. For new projects, consult AMD’s current FPGA portfolio to identify modern alternatives offering enhanced performance, lower power consumption, and guaranteed long-term availability.
