The XCZU7CG-2FFVC1156E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC CG family. This advanced integrated circuit combines powerful ARM processing units with programmable logic, making it ideal for demanding embedded applications requiring both hardware acceleration and software flexibility.
XCZU7CG-2FFVC1156E Overview and Key Features
The XCZU7CG-2FFVC1156E represents AMD’s commitment to delivering cost-effective, high-performance multiprocessor SoC solutions. Built on advanced 16nm FinFET+ process technology, this device offers exceptional power efficiency while delivering impressive computational capabilities.
Dual ARM Cortex Processor Architecture
This Xilinx FPGA integrates a sophisticated heterogeneous processing system featuring:
- Dual-Core ARM Cortex-A53 MPCore with CoreSight technology (Application Processing Unit)
- Dual-Core ARM Cortex-R5 with CoreSight technology (Real-time Processing Unit)
- Maximum APU clock speed of 1.3 GHz
- Maximum RPU clock speed of 533 MHz
Programmable Logic Resources
The XCZU7CG-2FFVC1156E delivers substantial FPGA resources for implementing custom hardware accelerators and digital logic designs.
XCZU7CG-2FFVC1156E Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU7CG-2FFVC1156E |
| Product Family |
Zynq UltraScale+ MPSoC CG |
| Logic Cells |
504,000+ |
| Process Technology |
16nm FinFET+ |
| Speed Grade |
-2 |
| Temperature Grade |
E (Extended: 0°C to +100°C) |
Package Specifications
| Package Parameter |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FFVC1156 |
| Pin Count |
1156 Pins |
| Package Dimensions |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| Mounting Type |
Surface Mount |
| RoHS Status |
Compliant |
Processor Specifications
| Processor Unit |
Details |
| Application Processor |
Dual-Core ARM Cortex-A53 |
| Real-Time Processor |
Dual-Core ARM Cortex-R5 |
| APU Max Frequency |
1.3 GHz |
| RPU Max Frequency |
533 MHz |
| Debug Technology |
ARM CoreSight |
| Cache Architecture |
L1 and L2 Cache Support |
XCZU7CG-2FFVC1156E Applications
The versatile architecture of the XCZU7CG-2FFVC1156E makes it suitable for numerous industrial and commercial applications.
Industrial Automation
- Programmable Logic Controller (PLC) systems
- Motor drive control systems
- Industrial IoT gateway devices
- Machine vision systems
Communications Infrastructure
- Software-defined radio (SDR) platforms
- Wireless base station equipment
- Network packet processing
- Protocol bridging solutions
Embedded Computing
- Edge computing platforms
- Real-time control systems
- Data acquisition systems
- Automotive ADAS applications
Aerospace and Defense
- Radar signal processing
- Electronic warfare systems
- Secure communications
- Avionics computing platforms
Why Choose XCZU7CG-2FFVC1156E for Your Design?
Cost-Optimized CG Variant
The CG designation indicates this is a cost-optimized variant within the Zynq UltraScale+ family. Unlike EG (with GPU) or EV (with Video Codec Unit) variants, the XCZU7CG-2FFVC1156E focuses on essential processing and FPGA resources, making it ideal for applications that don’t require integrated graphics or video encoding capabilities.
Superior Performance-Per-Watt
The 16nm FinFET+ process technology enables the XCZU7CG-2FFVC1156E to deliver exceptional computational performance while maintaining low power consumption. This makes it perfect for thermally constrained or battery-powered applications.
Flexible Speed Grade Options
With a -2 speed grade designation, the XCZU7CG-2FFVC1156E offers balanced performance characteristics. AMD offers speed grades from -1 to -3, with -3 being the highest performance option. The -2 speed grade provides an excellent balance between performance and power consumption.
XCZU7CG-2FFVC1156E Part Number Breakdown
Understanding the part number helps engineers select the right variant for their application:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Grade |
| ZU7 |
Zynq UltraScale+ Size Designation (7) |
| CG |
Cost-optimized variant (no GPU/VCU) |
| -2 |
Speed Grade (-1, -2, or -3) |
| FF |
Flip-Chip Package |
| VC |
Package Type Variant |
| 1156 |
1156 Ball Count |
| E |
Extended Temperature Range |
Design Considerations for XCZU7CG-2FFVC1156E
Power Supply Requirements
The XCZU7CG-2FFVC1156E requires multiple voltage rails for optimal operation:
- VCCINT: Core voltage (typically 0.85V)
- VCCAUX: Auxiliary voltage (1.8V)
- VCCIO: I/O bank voltage (1.2V to 3.3V, bank-dependent)
PCB Design Guidelines
When designing with the 1156-FCBGA package, engineers should consider:
- Minimum 12-layer PCB stackup recommended
- Proper power plane distribution
- High-speed signal integrity considerations
- Thermal management strategies including heatsinks or thermal vias
Development Tools
AMD provides comprehensive design tools for the XCZU7CG-2FFVC1156E:
- Vivado Design Suite for FPGA development
- Vitis Unified Software Platform for embedded software
- PetaLinux for Linux-based deployments
XCZU7CG-2FFVC1156E vs. Related Parts
| Part Number |
Difference |
| XCZU7CG-1FFVC1156E |
Lower speed grade (-1) |
| XCZU7CG-2FFVC1156I |
Industrial temperature (-40°C to +100°C) |
| XCZU7EG-2FFVC1156E |
Includes Mali-400 MP2 GPU |
| XCZU7EV-2FFVC1156E |
Includes H.264/H.265 Video Codec Unit |
Ordering Information
The XCZU7CG-2FFVC1156E is available from authorized AMD distributors worldwide. When ordering, ensure you specify:
- Complete part number: XCZU7CG-2FFVC1156E
- Required quantity
- Packaging preference (Tray)
Conclusion
The XCZU7CG-2FFVC1156E delivers a powerful combination of ARM processing and FPGA programmable logic in a cost-optimized package. With 504K+ logic cells, dual ARM Cortex-A53 and Cortex-R5 processors, and extensive I/O capabilities, this Zynq UltraScale+ MPSoC is an excellent choice for embedded systems requiring high performance, real-time processing, and hardware acceleration.
Whether you’re developing industrial automation systems, communications infrastructure, or edge computing platforms, the XCZU7CG-2FFVC1156E provides the flexibility and performance needed to bring your designs to market efficiently
