Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EG-1FFVC1156I: High-Performance Zynq UltraScale+ MPSoC FPGA for Industrial Applications

Product Details

The XCZU7EG-1FFVC1156I is a cutting-edge programmable system-on-chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This industrial-grade FPGA combines quad-core ARM Cortex-A53 processing power with programmable logic, making it an ideal solution for embedded vision, industrial automation, automotive, and aerospace applications.

Key Features and Specifications

Processing System Architecture

The XCZU7EG-1FFVC1156I integrates a robust heterogeneous processing system featuring:

  • Quad-core ARM Cortex-A53 APU running at up to 1.5 GHz
  • Dual-core ARM Cortex-R5F RPU for real-time processing
  • Mali-400 MP2 GPU for advanced graphics capabilities
  • Advanced power management and security features

Programmable Logic Resources

Specification Value
Logic Cells 504,000 (equivalent)
CLB Flip-Flops 269,120
CLB LUTs 134,560
Block RAM 14.4 Mb
UltraRAM 8.6 Mb
DSP Slices 1,728

Memory and Connectivity Interfaces

The XCZU7EG FPGA provides extensive connectivity options:

  • PCIe Gen2/Gen3 interface
  • USB 3.0 controller
  • SATA 3.1 interface
  • DisplayPort output
  • Gigabit Ethernet support
  • High-speed GTH transceivers up to 16.3 Gb/s

Package and Temperature Grade Details

FFVC1156 Package Specifications

  • Package Type: Fine Pitch Ball Grid Array (FFVC)
  • Pin Count: 1,156 pins
  • Package Size: 35mm x 35mm
  • Ball Pitch: 1.0mm

Industrial Temperature Range (-I Grade)

The -I industrial temperature grade ensures reliable operation in harsh environments:

  • Operating Temperature: -40°C to +100°C junction temperature
  • Suitable for automotive, industrial control, and outdoor applications
  • Enhanced reliability for mission-critical systems

Application Areas for XCZU7EG-1FFVC1156I

Industrial Automation and Control

This Xilinx FPGA excels in:

  • Machine vision systems
  • Industrial robotics control
  • Programmable logic controllers (PLCs)
  • Real-time data acquisition systems

Embedded Vision Systems

  • Advanced driver assistance systems (ADAS)
  • Medical imaging equipment
  • Surveillance and security cameras
  • Drone and UAV vision processing

Aerospace and Defense

  • Radar signal processing
  • Software-defined radio (SDR)
  • Secure communications systems
  • Flight control systems

Test and Measurement Equipment

  • High-speed oscilloscopes
  • Protocol analyzers
  • Spectrum analyzers
  • Data acquisition systems

Performance Benefits and Advantages

Power Efficiency

The UltraScale+ architecture delivers:

  • Up to 2-3x better power efficiency vs previous generation
  • Dynamic power management capabilities
  • Multiple power domains for optimized consumption

Processing Versatility

  • Seamless integration of software and hardware acceleration
  • Real-time processing with deterministic latency
  • Parallel processing capabilities for compute-intensive tasks

Development Ecosystem

The XCZU7EG is supported by comprehensive development tools:

  • Vivado Design Suite for FPGA development
  • Vitis Unified Software Platform for embedded software
  • PetaLinux for embedded Linux development
  • Extensive IP library and reference designs

Technical Specifications Table

Parameter Specification
Part Number XCZU7EG-1FFVC1156I
Manufacturer AMD (Xilinx)
Product Family Zynq UltraScale+ MPSoC
Series EG (EV Grade)
Speed Grade -1
Package Type FFVC (Fine Pitch BGA)
Pin Count 1,156
Temperature Grade Industrial (-40°C to +100°C Tj)
Logic Cells 504K
DSP Slices 1,728
Block RAM 14.4 Mb
Transceivers GTH up to 16.3 Gb/s
ARM Cores Cortex-A53 (4x) + Cortex-R5F (2x)

Design Considerations and Integration

PCB Layout Guidelines

When designing with the XCZU7EG-1FFVC1156I:

  • Follow AMD’s PCB design guidelines for signal integrity
  • Implement proper power supply sequencing
  • Use adequate thermal management (heatsinks/cooling)
  • Consider high-speed signal routing best practices

Power Supply Requirements

The device requires multiple power rails:

  • VCC core voltage supply
  • VCCAUX auxiliary supply
  • VCCINT internal logic supply
  • I/O bank power supplies (1.2V to 3.3V)

Configuration and Boot Options

Multiple configuration modes supported:

  • JTAG for development and debugging
  • Quad-SPI flash boot
  • SD card boot
  • PCIe boot mode

Software Development Support

Operating System Support

  • Linux: Full support via PetaLinux
  • FreeRTOS: For real-time applications
  • Bare-metal: Direct hardware access
  • Custom RTOS: Flexible integration

Acceleration Libraries

Pre-optimized libraries available for:

  • OpenCV for computer vision
  • FFT and signal processing
  • Neural network inference
  • Video codec acceleration

Comparison with Other Zynq UltraScale+ Devices

XCZU7EG vs XCZU5EG

Feature XCZU7EG XCZU5EG
Logic Cells 504K 256K
DSP Slices 1,728 1,248
Block RAM 14.4 Mb 9.9 Mb
Best For High-performance apps Cost-sensitive designs

XCZU7EG vs XCZU9EG

The XCZU9EG offers more resources (600K logic cells, 2,520 DSPs) but at higher cost and power consumption, making the XCZU7EG optimal for balanced performance/cost applications.

Quality and Reliability

Manufacturing Standards

  • ISO 9001 certified manufacturing
  • RoHS compliant
  • Conflict-free materials
  • Automotive-grade options available (XCZU7EG-1FFVC1156E)

Longevity and Lifecycle

  • Long product lifecycle support from AMD
  • Migration path to future device families
  • Extensive validation and characterization

Ordering Information and Availability

Part Number Breakdown

XCZU7EG-1FFVC1156I:

  • XC: Xilinx commercial
  • ZU7: Zynq UltraScale+ 7-series
  • EG: EV Grade (with GPU)
  • -1: Speed grade
  • FFVC1156: Package and pin count
  • I: Industrial temperature range

Related Part Numbers

  • XCZU7EG-1FFVC1156E: Extended temperature range (-40°C to +125°C)
  • XCZU7EG-2FFVC1156I: Speed grade -2 (higher performance)
  • XCZU7EG-1FBVB900I: Alternative package (900-pin)

Getting Started with XCZU7EG-1FFVC1156I

Evaluation Platforms

AMD offers development boards:

  • ZCU104 Evaluation Kit: Mid-range development platform
  • ZCU106 Evaluation Kit: High-performance evaluation
  • Third-party carrier boards from Avnet, Trenz Electronic

Documentation Resources

Essential documentation includes:

  • UltraScale+ Product Selection Guide
  • Data Sheet DS891
  • Technical Reference Manual UG1085
  • PCB Design Guide

Training and Support

  • Online training through AMD University Program
  • Technical support via AMD Forums
  • Local field application engineering support
  • Third-party consulting services available

Conclusion

The XCZU7EG-1FFVC1156I represents a powerful, versatile solution for demanding embedded applications requiring both processing power and programmable logic flexibility. Its industrial temperature rating, comprehensive feature set, and robust development ecosystem make it an excellent choice for engineers developing next-generation intelligent systems.

Whether you’re building advanced vision systems, industrial controllers, or aerospace applications, this Xilinx FPGA provides the performance, flexibility, and reliability needed for success.


Ready to start your design? The XCZU7EG-1FFVC1156I is available from authorized distributors worldwide. Contact your local AMD representative or authorized distributor for pricing, samples, and technical support.

Frequently Asked Questions

What is the difference between XCZU7EG and XCZU7CG?

The XCZU7EG includes a Mali-400 MP2 GPU, while the XCZU7CG does not have integrated graphics processing capabilities.

Can I use commercial temperature grade tools with industrial grade FPGA?

Yes, the device can be programmed and configured using standard Vivado tools regardless of temperature grade.

What is the typical power consumption?

Power consumption varies by application, typically ranging from 5-15W depending on logic utilization, I/O activity, and clock frequencies.

Is hardware encryption supported?

Yes, the Zynq UltraScale+ MPSoC includes AES-256 encryption and secure boot capabilities for IP protection.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.