Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EG-3FFVC1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA Processor

Product Details

The XCZU7EG-3FFVC1156E is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced FPGA processor combines a powerful quad-core ARM Cortex-A53 application processor with programmable logic fabric, delivering exceptional performance for embedded computing, industrial automation, and communication infrastructure applications. As a leading Xilinx FPGA solution, the XCZU7EG-3FFVC1156E offers unmatched flexibility and processing power in a single chip.


XCZU7EG-3FFVC1156E Key Features and Benefits

The XCZU7EG-3FFVC1156E stands out as a premium choice for engineers seeking a versatile heterogeneous computing platform. This device integrates software-programmable processors with hardware-programmable logic, enabling customized acceleration of demanding workloads.

Powerful Processing System (PS)

The processing system of the XCZU7EG-3FFVC1156E delivers enterprise-grade computing capabilities:

  • Quad-core ARM Cortex-A53 MPCore running at up to 1.5GHz with NEON and floating-point support
  • Dual-core ARM Cortex-R5F real-time processor with CoreSight debugging
  • Mali-400 MP2 GPU for graphics acceleration up to 667MHz
  • 32KB/32KB L1 Cache and 1MB L2 Cache for optimized data access
  • 256KB On-Chip Memory (OCM) for low-latency processing

Advanced Programmable Logic (PL)

The programmable logic fabric of the XCZU7EG-3FFVC1156E provides extensive resources for custom hardware implementations:

Specification Value
Logic Cells 504,000+
CLBs (Configurable Logic Blocks) 28,800
Flip-Flops 230,400
Block RAM (36Kb) 1,728 Kb
DSP Slices 312
UltraRAM Blocks 96

XCZU7EG-3FFVC1156E Technical Specifications

Package and Electrical Characteristics

Parameter Specification
Part Number XCZU7EG-3FFVC1156E
Manufacturer AMD (Xilinx)
Family Zynq UltraScale+ MPSoC
Device Type EG (Quad-core with GPU)
Package Type FCBGA (Flip-Chip Ball Grid Array)
Pin Count 1156
Ball Pitch 1.0mm
Speed Grade -3 (Highest Performance)
Temperature Grade Extended (E): 0°C to 100°C
Process Technology 20nm FinFET
Core Voltage (VCCINT) 0.90V

High-Speed Connectivity

Interface Specification
GTH Transceivers 24 channels
GTH Data Rate Up to 16.3 Gb/s
PS-GTR Transceivers 4 channels
High-Performance I/O (HP) 416 pins (1.0V–1.8V)
High-Density I/O (HD) 48 pins (1.2V–3.3V)
PCIe Support Gen3/Gen4 capable

XCZU7EG-3FFVC1156E Integrated Peripherals

Processing System I/O Interfaces

The XCZU7EG-3FFVC1156E integrates a comprehensive set of peripheral interfaces for seamless system integration:

Peripheral Quantity/Features
PS I/O Pins 214 (MIO)
UART 2 channels
CAN Bus 2 channels
USB 2.0 2 ports
USB 3.0 2 ports
Gigabit Ethernet 4 RGMII ports
I2C 2 channels
SPI 2 channels
GPIO 32-bit
SD/SDIO/eMMC 2 controllers
NAND Flash 1 controller
QSPI Flash 1 controller

System Management Features

Feature Description
Real-Time Clock On-chip RTC
Watchdog Timers Multiple WDT
Triple Timer Counters 2× TTC blocks
System Monitor Voltage and temperature sensing
JTAG Full debug support

XCZU7EG-3FFVC1156E Applications

The XCZU7EG-3FFVC1156E excels in demanding applications requiring both high-performance processing and custom hardware acceleration:

Industrial and Automation

  • Motor control systems
  • Industrial IoT gateways
  • Machine vision and inspection
  • Sensor fusion platforms
  • Robotics controllers

Communications Infrastructure

  • 5G wireless base stations
  • Software-defined radio (SDR)
  • Network packet processing
  • Wired/wireless infrastructure
  • Protocol conversion gateways

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Secure communications
  • Avionics systems
  • Satellite communications

Data Center and Computing

  • Hardware acceleration
  • AI/ML inference engines
  • Video transcoding
  • Network interface cards
  • Storage controllers

XCZU7EG-3FFVC1156E Memory Interface Support

DDR4 Memory Controller Specifications

Parameter PS DDR4 PL DDR4
Data Width Up to 64-bit + ECC Up to 72-bit
Maximum Speed 2400 MT/s 2400 MT/s
Supported Types DDR4, LPDDR4 DDR4, DDR3
ECC Support Yes Yes

XCZU7EG-3FFVC1156E Development Tools

Software and Design Suite

The XCZU7EG-3FFVC1156E is fully supported by AMD’s comprehensive development ecosystem:

  • Vivado Design Suite – Complete FPGA design environment for synthesis, implementation, and debugging
  • Vitis Unified Software Platform – Integrated development for embedded and acceleration applications
  • PetaLinux Tools – Linux distribution and build system for embedded applications
  • Vitis AI – Machine learning inference optimization toolkit

XCZU7EG-3FFVC1156E Ordering Information

Attribute Value
Full Part Number XCZU7EG-3FFVC1156E
Device XCZU7EG
Speed Grade -3 (Fastest)
Package FFVC1156
Temperature E (Extended: 0°C to 100°C)
Packaging Tray

Related Part Numbers

Part Number Speed Grade Temperature
XCZU7EG-2FFVC1156I -2 Industrial
XCZU7EG-2FFVC1156E -2 Extended
XCZU7EG-1FFVC1156I -1 Industrial
XCZU7EG-1FFVC1156E -1 Extended

Why Choose XCZU7EG-3FFVC1156E?

The XCZU7EG-3FFVC1156E offers several compelling advantages for your next design:

  1. Highest Speed Grade (-3) – Maximum performance for timing-critical applications
  2. Extended Temperature Range – Reliable operation from 0°C to 100°C junction temperature
  3. Heterogeneous Computing – Combine software flexibility with hardware acceleration
  4. Rich Peripheral Set – Reduce external component count and BOM cost
  5. 24 GTH Transceivers – High-speed serial connectivity up to 16.3 Gb/s
  6. Proven 20nm FinFET Technology – Optimal balance of performance, power, and density
  7. Long-Term Availability – AMD commitment to extended product lifecycle

XCZU7EG-3FFVC1156E Datasheet and Documentation

For complete technical specifications, refer to the official AMD documentation:

  • DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
  • DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
  • UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual

Frequently Asked Questions

What is the difference between XCZU7EG and XCZU7EV?

The XCZU7EG features a Mali-400 MP2 GPU, while the XCZU7EV includes an integrated H.264/H.265 video codec unit (VCU) for hardware-accelerated video encoding and decoding.

What speed grades are available for XCZU7EG?

The XCZU7EG is available in -1, -2, and -3 speed grades, with -3E offering the highest performance at VCCINT = 0.90V.

What development boards support XCZU7EG?

Several evaluation platforms support XCZU7EG devices, including custom carrier boards from ALINX, Sundance, and other third-party vendors.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.