Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7EV-2FBVB900I: AMD Xilinx Zynq UltraScale+ MPSoC FPGA with Video Codec

Product Details

The XCZU7EV-2FBVB900I is a high-performance multiprocessor system-on-chip (MPSoC) from the AMD Xilinx Zynq UltraScale+ EV family. This advanced embedded processor combines a powerful 64-bit quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, Mali-400 MP2 GPU, and 504K+ programmable logic cells in a single 900-pin FCBGA package. Designed for demanding embedded vision and multimedia applications, this industrial-grade SoC delivers exceptional processing power with an integrated H.264/H.265 video codec capable of 4K@60fps encoding and decoding.

Whether you’re developing advanced driver assistance systems (ADAS), video surveillance solutions, AI acceleration platforms, or 5G wireless infrastructure, the XCZU7EV-2FBVB900I provides the ideal combination of heterogeneous processing, high-speed connectivity, and programmable flexibility. For more options from this leading semiconductor manufacturer, explore our complete Xilinx FPGA product catalog.


XCZU7EV-2FBVB900I Key Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC EV
Part Number XCZU7EV-2FBVB900I
Architecture MCU + FPGA Hybrid SoC
Process Technology 16nm/20nm FinFET+
Core Voltage (VCCINT) 0.85V – 0.95V
Package Type 900-FCBGA (31mm x 31mm)
Speed Grade -2 (High Performance)
Temperature Grade Industrial (-40°C to +100°C)
RoHS Compliance Yes

Zynq UltraScale+ MPSoC Processing System Specifications

The processing system (PS) of the XCZU7EV-2FBVB900I integrates multiple processor cores optimized for different workloads, enabling true heterogeneous computing.

Application Processing Unit (APU)

Feature Specification
Processor Core Quad-core ARM Cortex-A53 MPCore with CoreSight
Maximum Clock Speed Up to 1.5 GHz
Architecture 64-bit ARMv8-A
L1 Cache (per core) 32KB Instruction + 32KB Data
L2 Cache (shared) 1MB
Features NEON SIMD, Single/Double Precision Floating Point

Real-Time Processing Unit (RPU)

Feature Specification
Processor Core Dual-core ARM Cortex-R5F with CoreSight
Maximum Clock Speed 533 MHz – 600 MHz
Architecture 32-bit ARMv7-R
L1 Cache (per core) 32KB Instruction + 32KB Data
Tightly Coupled Memory 256KB
Features Lockstep Mode, Split Mode, ECC Protection

Graphics Processing Unit (GPU)

Feature Specification
GPU Core ARM Mali-400 MP2
Clock Speed Up to 677 MHz
L2 Cache 64KB
API Support OpenGL ES 1.1/2.0, OpenVG 1.1

XCZU7EV-2FBVB900I Programmable Logic Resources

The programmable logic (PL) section of the XCZU7EV delivers exceptional flexibility and computational density for custom hardware acceleration.

FPGA Logic Resources Table

Resource Quantity
System Logic Cells 504,000+
Configurable Logic Blocks (CLBs) 28,800
Look-Up Tables (LUTs) 230,400
Flip-Flops 460,800
DSP Slices (DSP48E2) 1,728
Block RAM (36Kb each) 312 blocks / 11 Mb total
UltraRAM (288Kb each) 96 blocks / 27 Mb total
Maximum Distributed RAM 6.2 Mb

High-Speed Transceiver Specifications

Parameter Specification
GTH Transceivers 16 channels
Maximum Data Rate (GTH) 16.3 Gb/s per channel
PS-GTR Transceivers 4 channels
Maximum Data Rate (PS-GTR) 6.0 Gb/s per channel
Supported Protocols PCIe Gen3, 10G Ethernet, SATA 3.1, USB 3.0, DisplayPort

H.264/H.265 Video Codec Unit (VCU) Features

The XCZU7EV-2FBVB900I belongs to the “EV” variant of the Zynq UltraScale+ family, featuring an integrated hardware video codec unit (VCU) for real-time video processing.

Video Encoder/Decoder Capabilities

Feature Specification
Supported Standards H.264 (AVC), H.265 (HEVC)
Maximum Resolution 4K x 2K (4096 x 2160)
Maximum Frame Rate at 4K 60 fps
Simultaneous Operation Encode + Decode concurrently
H.265 Profile Main Profile, Level 5.1, High Tier
H.264 Profile Baseline/Main/High Profile, Level 5.2
8K Support Yes (at reduced frame rate: 8K@15fps)
Color Depth 8-bit, 10-bit
Chroma Subsampling 4:2:0, 4:2:2

XCZU7EV-2FBVB900I I/O and Connectivity Interfaces

Programmable Logic I/O

I/O Type Quantity Voltage Range
High-Performance (HP) I/O Up to 156 1.0V – 1.8V
High-Density (HD) I/O Up to 48 1.2V – 3.3V
Total User I/O 204

Processing System Connectivity

Interface Specification
PCI Express Gen2 x4 (PS), Gen3 x8 (PL)
USB 3.0 2 ports (SuperSpeed 5Gbps)
USB 2.0 2 ports (High Speed 480Mbps)
SATA 3.1 (6 Gbps)
DisplayPort 1.2a (4K@60Hz support)
Gigabit Ethernet 4x Tri-mode (10/100/1000 Mbps)
SD/SDIO 2 ports (SD 3.0/SDIO 3.0)
UART 2 ports
CAN 2.0B, 2 ports
I2C 2 ports
SPI 2 ports
GPIO 4x 32-bit banks

Memory Interface Support

External Memory Controllers

Memory Type Configuration
DDR4 SDRAM 64-bit with ECC, up to 2400 Mbps
DDR3/DDR3L 64-bit with ECC
LPDDR4 32-bit, up to 4266 Mbps
LPDDR3 32-bit
QSPI Flash Quad SPI, up to 200 MHz
NAND Flash 8-bit ONFI 3.1

Zynq UltraScale+ EV Target Applications

The XCZU7EV-2FBVB900I is optimized for applications requiring heterogeneous processing, high-bandwidth video, and real-time control.

Primary Application Areas

  • Automotive ADAS – Surround view, lane departure warning, object detection
  • Video Surveillance – 4K multi-channel encoding, intelligent video analytics
  • Medical Imaging – Ultrasound, endoscopy, surgical visualization systems
  • Broadcast & Pro AV – Live encoding, streaming servers, video production
  • Industrial Vision – Machine vision, defect detection, robotics guidance
  • 5G Wireless Infrastructure – Baseband processing, fronthaul/backhaul
  • Aerospace & Defense – Radar processing, electronic warfare, secure communications
  • AI/ML Edge Inference – Neural network acceleration, computer vision

XCZU7EV-2FBVB900I Part Number Decoder

Understanding the part number helps identify the exact device configuration:

Code Segment Value Meaning
XC XC Xilinx Commercial
ZU7 ZU7 Zynq UltraScale+ Size (7 = mid-range)
EV EV Embedded Vision (with Video Codec)
-2 -2 Speed Grade 2 (High Performance)
F F Lead-free Package
BVB BVB Package Footprint Code
900 900 Ball Count (900 pins)
I I Industrial Temperature (-40°C to +100°C)

Related Part Numbers

Part Number Speed Grade Temperature Package
XCZU7EV-1FBVB900I -1 Industrial 900-FCBGA
XCZU7EV-2FBVB900E -2 Extended 900-FCBGA
XCZU7EV-2FFVC1156I -2 Industrial 1156-FCBGA
XCZU7EV-L2FFVC1156E -2L (Low Power) Extended 1156-FCBGA

Power Management Features

The XCZU7EV-2FBVB900I includes advanced power management capabilities for efficient system design.

Power Domains and Features

Feature Description
Multiple Power Domains Independent PS/PL power control
Power Gating Unused blocks can be powered down
Voltage Scaling VCCINT: 0.72V, 0.85V, or 0.95V options
Low Power Modes Sleep, Deep Sleep, Power Off
Power Monitoring Integrated System Monitor (SYSMON)
Thermal Management On-chip temperature sensors

Development Tools and Software Support

Xilinx/AMD Design Tools

Tool Purpose
Vivado Design Suite RTL synthesis, implementation, timing analysis
Vitis Unified Platform Embedded software and AI development
PetaLinux Embedded Linux distribution
Vitis AI Deep learning inference optimization
SDSoC/SDAccel Hardware/software co-design

Evaluation Platforms

  • ZCU106 Evaluation Kit – Full-featured development platform with XCZU7EV
  • UltraZed-EV Starter Kit – Cost-effective prototyping solution
  • Third-party SoMs – ALINX ACU7EV, PUZHI PZ-ZU7EV-SOM

XCZU7EV-2FBVB900I Ordering Information

Parameter Details
Manufacturer Part Number XCZU7EV-2FBVB900I
Manufacturer AMD (Xilinx)
Product Status Active
Packaging Tray
Lead Time Contact distributor
Minimum Order Quantity 1 unit
Export Classification (ECCN) 5A002.A.4

Why Choose the XCZU7EV-2FBVB900I for Your Design?

The XCZU7EV-2FBVB900I stands out as a premier choice for embedded vision and heterogeneous computing applications. Its combination of quad-core ARM Cortex-A53 application processing, dual-core Cortex-R5 real-time control, Mali GPU graphics, and 504K+ logic cells provides unmatched flexibility. The integrated H.264/H.265 video codec delivers 4K@60fps performance without consuming precious FPGA resources, while 16 GTH transceivers at 16.3 Gb/s enable high-bandwidth system connectivity.

For industrial applications requiring extended temperature operation (-40°C to +100°C), the “-I” grade ensures reliable performance. The -2 speed grade offers optimal balance between performance and power consumption, making it suitable for both portable and rack-mounted systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.