Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU9CG-2FFVB1156I: High-Performance Zynq UltraScale+ MPSoC for Industrial Applications

Product Details

The AMD XCZU9CG-2FFVB1156I is an advanced System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This powerful embedded processor combines a quad-core ARM Cortex-A53 application processor with dual-core ARM Cortex-R5 real-time processor and programmable FPGA logic. Designed for industrial-grade applications, the XCZU9CG-2FFVB1156I delivers exceptional performance, reliability, and flexibility for demanding embedded systems.


Key Features of the AMD XCZU9CG-2FFVB1156I

The XCZU9CG-2FFVB1156I belongs to the CG (Cost-optimized Grade) series within the Zynq UltraScale+ MPSoC lineup. This device offers a perfect balance between processing power and cost efficiency, making it ideal for a wide range of applications.

Processing System Architecture

The AMD XCZU9CG-2FFVB1156I integrates a powerful heterogeneous processing system:

Component Specification
Application Processing Unit (APU) Quad-core ARM Cortex-A53
APU Clock Speed Up to 1.5 GHz
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5
RPU Clock Speed Up to 600 MHz
Architecture ARMv8-A (64-bit/32-bit)
L1 Cache (per core) 32KB Instruction + 32KB Data
L2 Cache (Shared) 1MB with ECC

Programmable Logic (PL) Resources

The XCZU9CG-2FFVB1156I features extensive programmable logic resources based on 16nm FinFET+ technology:

Resource Quantity
System Logic Cells ~599,550
CLB Flip-Flops 548,160
CLB LUTs 274,080
Block RAM 32.1 Mb
UltraRAM Available
DSP Slices 2,520

Technical Specifications of XCZU9CG-2FFVB1156I

Package and Physical Characteristics

Parameter Value
Part Number XCZU9CG-2FFVB1156I
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Size FFVB1156
Pin Count 1156 Pins
Ball Pitch 1.0 mm
Speed Grade -2 (Standard Performance)
Temperature Grade Industrial (-40°C to +100°C)
Process Technology 16nm FinFET+

Power and Voltage Specifications

Parameter Value
Core Voltage (VCCINT) 0.85V
Auxiliary Voltage (VCCAUX) 1.8V
I/O Voltage Range 1.0V to 3.3V
Power Management Advanced power gating

Memory and Interface Capabilities

On-Chip Memory

The AMD XCZU9CG-2FFVB1156I provides comprehensive on-chip memory solutions:

  • 256KB On-Chip RAM (OCM) with ECC protection
  • 128KB Tightly Coupled Memory (TCM) per R5 core with ECC
  • Block RAM up to 32.1 Mb with ECC
  • Distributed RAM for high-speed local storage

External Memory Controller

Memory Type Support
DDR4 Up to 2400 MT/s
DDR3/DDR3L Supported
LPDDR3 Supported
LPDDR4 32-bit Interface
Interface Width 32-bit or 64-bit
ECC Support Yes
Max Address Space Up to 32GB

Connectivity and Peripheral Interfaces

High-Speed Serial Transceivers

The XCZU9CG-2FFVB1156I includes four PS-GTR transceivers supporting:

Interface Specification
PCIe Gen2 (x1, x2, x4)
USB 3.0 SuperSpeed 5 Gb/s
SATA 1.5/3.0/6.0 Gb/s
SGMII Tri-speed Ethernet
DisplayPort Up to 5.4 Gb/s

Standard Peripheral Interfaces

Peripheral Quantity/Specification
Gigabit Ethernet MAC 4x (IEEE 802.3, IEEE 1588)
USB 3.0/2.0 2x (Host, Device, OTG)
CAN 2.0B 2x (Full CAN support)
SD/SDIO/eMMC 2x Controllers
SPI 2x Full-duplex
I2C 2x Master/Slave
UART 2x High-speed (up to 1 Mb/s)
GPIO (MIO) Up to 78 pins
GPIO (EMIO) Up to 96 pins

Advanced Security Features

The AMD XCZU9CG-2FFVB1156I includes robust security features:

  • TrustZone Technology for ARM Cortex-A53
  • Secure Boot support with RSA-4096 authentication
  • AES-256 Encryption for bitstream and data protection
  • XMPU (Xilinx Memory Protection Unit) for memory isolation
  • SMMU (System Memory Management Unit) for virtualization

Applications of AMD XCZU9CG-2FFVB1156I

The versatile XCZU9CG-2FFVB1156I is designed for demanding industrial and embedded applications:

Industrial Automation

  • Motor control and robotics
  • PLC and industrial controllers
  • Machine vision systems

Communications Infrastructure

  • 5G wireless infrastructure
  • Network processing
  • Software-defined radio (SDR)

Aerospace and Defense

  • Radar and signal processing
  • Secure communications
  • Avionics systems

Medical Equipment

  • Medical imaging systems
  • Diagnostic equipment
  • Patient monitoring devices

Automotive

  • ADAS (Advanced Driver Assistance Systems)
  • In-vehicle infotainment
  • Autonomous driving platforms

Development Tools and Software Support

AMD provides comprehensive development support for the XCZU9CG-2FFVB1156I:

Tool Description
Vivado Design Suite FPGA synthesis and implementation
Vitis Software Platform Embedded software development
PetaLinux Tools Linux-based OS development
Vitis AI AI/ML acceleration

Why Choose AMD XCZU9CG-2FFVB1156I?

The AMD XCZU9CG-2FFVB1156I stands out as a premier choice for industrial embedded systems:

  1. Heterogeneous Processing — Combines ARM processors with programmable logic for maximum flexibility
  2. Industrial Temperature Range — Reliable operation from -40°C to +100°C
  3. High Integration — Reduces BOM cost and PCB complexity
  4. Rich Connectivity — Supports multiple high-speed interfaces in a single chip
  5. Future-Proof Architecture — 16nm FinFET+ technology with long-term availability
  6. Comprehensive ECC — Error correction across all memory types for mission-critical reliability

Ordering Information

Parameter Detail
Manufacturer Part Number XCZU9CG-2FFVB1156I
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC
Series CG (Cost-optimized Grade)
Status Active
RoHS Compliance Compliant
Packaging Tray

Related Products and Resources

Looking for more Xilinx FPGA solutions? Explore our complete range of Zynq UltraScale+ MPSoC devices, evaluation boards, and development kits.

Related Part Numbers

Part Number Description
XCZU9EG-2FFVB1156I EG variant with GPU support
XCZU9CG-1FFVB1156I Lower speed grade (-1)
XCZU9CG-2FFVC900I Smaller package option
XCZU7CG-2FFVB1156I Lower resource variant
XCZU15EG-2FFVB1156I Higher resource EG variant

Summary

The AMD XCZU9CG-2FFVB1156I represents the cutting edge of embedded SoC technology. Combining a powerful quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, and extensive programmable logic resources in a single 1156-pin FCBGA package, this industrial-grade device delivers unmatched performance and flexibility. Whether you’re developing industrial automation systems, communications infrastructure, medical equipment, or aerospace applications, the XCZU9CG-2FFVB1156I provides the processing power, connectivity, and reliability your project demands.

With comprehensive security features, wide temperature range operation, and full development tool support from AMD, the XCZU9CG-2FFVB1156I is the ideal choice for next-generation embedded system designs requiring heterogeneous computing capabilities.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.