The AMD XCZU9CG-2FFVC900E is a premium System on Chip (SoC) integrated circuit from the Zynq UltraScale+ MPSoC CG family. This powerful device combines dual ARM Cortex-A53 processors with high-performance programmable logic, making it an excellent choice for demanding embedded computing applications. As part of the renowned Xilinx FPGA portfolio now under AMD, this component delivers exceptional performance, flexibility, and reliability.
Product Overview: AMD XCZU9CG-2FFVC900E Specifications
The XCZU9CG-2FFVC900E integrates advanced processing capabilities with programmable logic in a single device. Built on 20nm FinFET technology, this SoC FPGA provides outstanding power efficiency and computing performance for next-generation embedded systems.
Key Features of XCZU9CG-2FFVC900E
- Processing System (PS): Dual ARM Cortex-A53 MPCore with CoreSight™
- Real-Time Processing Unit (RPU): Dual ARM Cortex-R5F with CoreSight™
- Programmable Logic: 599K+ Logic Cells
- Speed Grade: -2 (High Performance)
- Temperature Range: Extended (0°C to +100°C)
- Package Type: 900-FCBGA (31mm x 31mm)
- Core Voltage: 0.85V
Detailed Technical Specifications
Processor and Logic Resources
| Parameter |
Specification |
| Device Family |
Zynq UltraScale+ MPSoC CG |
| Application Processor |
Dual ARM Cortex-A53 MPCore |
| Real-Time Processor |
Dual ARM Cortex-R5F |
| Logic Cells |
599,550+ |
| APU Frequency |
Up to 1.3GHz |
| RPU Frequency |
Up to 533MHz |
| Technology Node |
20nm FinFET |
Memory and Storage Capabilities
| Feature |
Details |
| On-Chip Memory |
256KB with ECC |
| L1 Cache (APU) |
32KB/32KB per core |
| L2 Cache (APU) |
1MB Shared |
| External Memory Support |
DDR4, DDR3, DDR3L, LPDDR4, LPDDR3 |
| Configuration Storage |
Quad-SPI, NAND, eMMC |
Package and Electrical Specifications
| Specification |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
900 pins |
| Ball Pitch |
1.0mm |
| Package Size |
31mm × 31mm |
| Operating Voltage (VCCINT) |
0.85V |
| Speed Grade |
-2 |
| Temperature Grade |
Extended (E): 0°C to +100°C |
Connectivity and Interface Options
The AMD XCZU9CG-2FFVC900E offers comprehensive connectivity options for modern embedded systems:
High-Speed Serial Interfaces
| Interface |
Capability |
| GTH Transceivers |
Up to 16.3Gb/s data rate |
| PS-GTR Transceivers |
Up to 6.0Gb/s data rate |
| USB |
USB 2.0 (Host/Device/OTG) |
| PCIe |
Gen2 x4 support |
| SATA |
AHCI v1.3 compliant |
Standard Peripheral Interfaces
- Ethernet: Quad Gigabit Ethernet MAC
- CAN: CAN 2.0B (ISO11898-1 compliant)
- I²C: Multi-master I2C controller
- SPI: Serial Peripheral Interface
- UART/USART: Universal Asynchronous Receiver/Transmitter
- GPIO: 128-bit GPIO (78 MIO + 96 EMIO)
- SD/SDIO/MMC: SD 3.0/SDIO 3.0/eMMC 4.51 support
Programmable Logic Features
FPGA Resources
| Resource |
Quantity |
| System Logic Cells |
599,550+ |
| CLB Flip-Flops |
Available |
| LUTs |
6-input Look-Up Tables |
| Block RAM |
36Kb blocks with FIFO and ECC |
| UltraRAM |
High-density 4Kx72 blocks |
| DSP Slices |
27×18 multipliers |
I/O Capabilities
| I/O Type |
Description |
| HP I/O |
High-Performance (1.0V to 1.8V) |
| HD I/O |
High-Density (1.2V to 3.3V) |
| MIO Pins |
78 Multiplexed I/O |
| SelectIO |
High-performance parallel interface |
Security and Configuration Features
The XCZU9CG-2FFVC900E incorporates advanced security features essential for industrial and military applications:
Security Capabilities
- AES-GCM Decryption: 256-bit encryption for secure boot
- SHA-384: Secure hash algorithm support
- eFUSE Technology: One-time programmable key storage
- Battery-Backed RAM: Alternative secure key storage
- Tamper Detection: Hardware-based security monitoring
Configuration Options
- Software-First Boot: PS always boots first for ASSP-like operation
- Partial Reconfiguration: Dynamic FPGA reconfiguration support
- SEU Detection/Correction: Single Event Upset protection
- Multi-Boot Support: Fallback configuration capability
Target Applications for XCZU9CG-2FFVC900E
This versatile Zynq UltraScale+ MPSoC excels in various demanding applications:
Industrial Applications
- Industrial automation and control systems
- Machine vision and image processing
- Motor control and drives
- Industrial IoT gateways
- Factory automation equipment
Communications Applications
- 5G wireless infrastructure
- Software-defined radio (SDR)
- Network packet processing
- Base station equipment
- Waveform processing systems
Automotive Applications
- Advanced Driver Assistance Systems (ADAS)
- Infotainment systems
- Vehicle networking
- Sensor fusion platforms
Aerospace and Defense
- Radar signal processing
- Electronic warfare systems
- Avionics computing
- Secure communications
Operating System Support
The processing system supports a wide range of operating systems:
- Linux: Full support with Xilinx PetaLinux
- FreeRTOS: Real-time operating system for RPU
- VxWorks: Wind River real-time OS
- Bare Metal: Direct hardware access applications
Part Number Breakdown: XCZU9CG-2FFVC900E
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU9 |
Zynq UltraScale+ Device 9 |
| CG |
CG Series (Dual ARM Cortex-A53) |
| -2 |
Speed Grade 2 (High Performance) |
| FF |
Flip-Chip Fine-pitch BGA |
| V |
Lead-Free Package |
| C900 |
900-ball package footprint |
| E |
Extended Temperature Range |
Ordering Information
| Attribute |
Details |
| Manufacturer Part Number |
XCZU9CG-2FFVC900E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Status |
Active |
| Packaging |
Tray |
| RoHS Status |
Compliant |
| Lead-Free |
Yes |
| Moisture Sensitivity Level |
MSL-3 |
Related Products and Alternatives
Consider these related AMD Zynq UltraScale+ devices:
- XCZU9CG-2FFVC900I: Industrial temperature variant
- XCZU9EG-2FFVC900E: EG series with GPU
- XCZU6CG-2FFVC900E: Lower capacity alternative
- XCZU15EG-2FFVC900E: Higher capacity option
Development Tools and Resources
Hardware Development
- Vivado Design Suite: Primary FPGA development environment
- Vitis Unified Software Platform: Software development tools
- PetaLinux Tools: Linux BSP development
- ZCU102 Evaluation Kit: Reference development board
Documentation Resources
- DS891: Zynq UltraScale+ MPSoC Overview
- DS925: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ Device Technical Reference Manual
- UG1075: Packaging and Pinouts Product Specification
Compliance and Certifications
| Standard |
Status |
| RoHS |
Compliant |
| REACH |
Compliant |
| ECCN |
5A002.A.4 |
| HTSUS |
8542.39.00.01 |
| ISO 9001:2015 |
Certified |
Why Choose AMD XCZU9CG-2FFVC900E?
The XCZU9CG-2FFVC900E stands out as an exceptional choice for engineers seeking a balance of processing power, programmable logic, and power efficiency. Key advantages include:
- Heterogeneous Computing: Combines ARM processors with FPGA fabric
- Power Efficiency: 20nm FinFET technology reduces power consumption
- Scalable Platform: Footprint-compatible with other Zynq UltraScale+ devices
- Comprehensive Connectivity: Rich peripheral and high-speed serial interfaces
- Security Features: Hardware encryption and secure boot capabilities
- Long-Term Availability: AMD commitment to product longevity
Conclusion
The AMD XCZU9CG-2FFVC900E Zynq UltraScale+ MPSoC represents the cutting edge of programmable SoC technology. With its powerful dual ARM Cortex-A53 processors, extensive programmable logic resources, and comprehensive connectivity options, this device enables engineers to create sophisticated embedded systems that meet the demands of industrial, automotive, communications, and aerospace applications. The extended temperature range and robust security features make it particularly suitable for mission-critical deployments.
For detailed technical specifications, datasheets, and current pricing, contact your authorized AMD distributor or visit the manufacturer’s website.
