The AMD XCZU9CG-2FFVB1156E is a powerful System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family, combining dual-core ARM processors with advanced programmable logic in a single integrated device. This FPGA SoC delivers exceptional performance for demanding embedded applications requiring both processing power and hardware acceleration capabilities.
Key Features of the XCZU9CG-2FFVB1156E Zynq UltraScale+ MPSoC
The XCZU9CG-2FFVB1156E integrates a feature-rich processing system with flexible programmable logic based on AMD’s UltraScale architecture. This combination enables engineers to develop highly customized solutions for industrial automation, telecommunications, medical imaging, and advanced driver assistance systems (ADAS).
Dual ARM Cortex-A53 Application Processing Unit
The Application Processing Unit (APU) features dual 64-bit ARM Cortex-A53 processors with CoreSight technology, operating at speeds up to 1.3 GHz. These processors support NEON SIMD extensions and single/double precision floating-point operations, making them ideal for running Linux and other high-level operating systems.
Dual ARM Cortex-R5F Real-Time Processing Unit
The Real-Time Processing Unit (RPU) incorporates dual ARM Cortex-R5F processors running at up to 533 MHz. These deterministic processors are perfect for safety-critical applications and real-time control tasks where predictable response times are essential.
XCZU9CG-2FFVB1156E Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU9CG-2FFVB1156E |
| Family |
Zynq UltraScale+ MPSoC CG |
| Device Type |
System-on-Chip (SoC) |
| Process Technology |
16nm FinFET+ |
| Speed Grade |
-2 |
| Temperature Grade |
Extended (E): 0°C to +100°C |
| Core Voltage (VCCINT) |
0.85V |
Programmable Logic Resources
| Resource |
Value |
| System Logic Cells |
599K+ |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Block RAM |
912 Blocks (32.1 Mb) |
| UltraRAM |
0 |
| DSP Slices |
2,520 |
I/O and Connectivity Features
| Feature |
Specification |
| Package Type |
1156-FCBGA (Flip-Chip BGA) |
| Package Size |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| Max HP I/O |
208 |
| Max HD I/O |
120 |
| GTH Transceivers |
4 (up to 16.3 Gb/s) |
| PS MIO Pins |
78 |
Processing System Architecture and Peripherals
The XCZU9CG-2FFVB1156E processing system includes a comprehensive set of integrated peripherals that reduce external component count and simplify PCB design.
Integrated Memory Interfaces
- DDR4/DDR3/DDR3L/LPDDR3/LPDDR4 memory controller (64-bit with ECC)
- Quad-SPI flash controller
- NAND flash controller (8-bit with ECC)
- SD/SDIO controller (2x)
High-Speed Connectivity
- USB 3.0 (2x with integrated PHY)
- Gigabit Ethernet with IEEE 1588 support (4x)
- PCIe Gen2 x4 or Gen2 x1/x2 root complex/endpoint
- SATA 3.1 host controller
- DisplayPort 1.2a (Dual-lane)
Standard Peripherals
- UART (2x)
- SPI (2x)
- I2C (2x)
- CAN 2.0B (2x)
- GPIO (up to 78 MIO + EMIO)
- Timers and Watchdog
Applications for XCZU9CG-2FFVB1156E FPGA SoC
The AMD XCZU9CG-2FFVB1156E Zynq UltraScale+ MPSoC excels in applications requiring heterogeneous computing with real-time determinism.
Industrial Automation and Control
The combination of real-time ARM Cortex-R5F processors with programmable logic enables precise motor control, sensor fusion, and industrial communication protocol implementation. The device supports industrial Ethernet protocols including EtherCAT, PROFINET, and EtherNet/IP through its flexible PL resources.
Telecommunications and Networking
With 599K+ logic cells and 2,520 DSP slices, the XCZU9CG-2FFVB1156E provides substantial resources for packet processing, waveform generation, and baseband signal processing in 4G/5G wireless infrastructure equipment.
Medical Imaging Systems
The high-bandwidth memory interfaces and extensive DSP resources make this device suitable for ultrasound imaging, CT reconstruction, and medical diagnostic equipment requiring real-time image processing capabilities.
Test and Measurement Equipment
Engineers developing high-speed data acquisition systems benefit from the device’s GTH transceivers supporting data rates up to 16.3 Gb/s, combined with extensive on-chip memory and processing resources.
Development Tools and Software Support
AMD provides comprehensive development support for the XCZU9CG-2FFVB1156E through the Vivado Design Suite and Vitis unified software platform. These tools enable efficient hardware/software co-design and optimization.
Vivado Design Suite Features
- High-level synthesis (HLS) for C/C++ to RTL conversion
- Advanced place-and-route algorithms optimized for UltraScale architecture
- Comprehensive timing analysis and closure tools
- IP Integrator for rapid system assembly
Vitis Software Platform
- Embedded software development for ARM processors
- Hardware acceleration development flow
- Extensive library of optimized functions
- Linux kernel and driver support
Ordering Information and Part Number Breakdown
Understanding the XCZU9CG-2FFVB1156E part number structure helps ensure correct component selection:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU9 |
Zynq UltraScale+ MPSoC Size 9 |
| CG |
CG Device (Dual A53 + R5F, No GPU) |
| -2 |
Speed Grade 2 |
| FF |
Flip-Chip, Fine-pitch BGA |
| VB |
Ball Type |
| 1156 |
1156 Ball Count |
| E |
Extended Temperature Range |
Why Choose the AMD XCZU9CG-2FFVB1156E for Your Next Design
The XCZU9CG-2FFVB1156E offers an optimal balance of processing performance, programmable logic resources, and power efficiency. Key advantages include:
- Heterogeneous Computing: Combine software flexibility with hardware acceleration
- Reduced BOM Cost: Integrated peripherals minimize external components
- Scalable Platform: Pin-compatible with other Zynq UltraScale+ devices
- Long-Term Availability: AMD’s commitment to extended product lifecycle
- Proven Architecture: Based on industry-standard ARM cores and proven FPGA fabric
For engineers seeking a cost-effective solution without the integrated Mali GPU found in EG-series devices, the CG variant provides all essential processing and programmable logic capabilities at an optimized price point.
Related Resources and Documentation
Designers working with the XCZU9CG-2FFVB1156E should reference the following AMD documentation:
- DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
- DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
- UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts
