The XCZU9EG-2FFVB1156E is a high-performance System-on-Chip (SoC) from AMD-Xilinx’s Zynq UltraScale+ MPSoC family. This advanced Xilinx FPGA combines powerful multi-core ARM processors with flexible programmable logic in a single device, delivering exceptional performance for demanding embedded applications.
Manufactured using 20nm FinFET technology, the XCZU9EG-2FFVB1156E offers an optimal balance of performance, power efficiency, and integration. This EG-variant device features a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and ARM Mali-400 MP2 graphics processing unit.
XCZU9EG-2FFVB1156E Key Specifications
| Parameter |
Specification |
| Manufacturer |
AMD / Xilinx |
| Part Number |
XCZU9EG-2FFVB1156E |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Type |
EG (Quad APU + GPU) |
| Logic Cells |
599,550 (599K+) |
| Process Technology |
20nm FinFET |
| Speed Grade |
-2 (Industrial) |
| Temperature Range |
Extended (E): -40°C to +100°C |
| Package Type |
1156-FCBGA (35mm x 35mm) |
| Core Voltage |
0.85V – 0.95V |
XCZU9EG-2FFVB1156E Processing System Architecture
Quad-Core ARM Cortex-A53 Application Processing Unit (APU)
The XCZU9EG-2FFVB1156E features a powerful 64-bit quad-core ARM Cortex-A53 MPCore processor with CoreSight debug technology. Operating at speeds up to 1.3GHz, this application processing unit delivers exceptional computational performance for complex software workloads, Linux-based operating systems, and high-level application processing.
Dual-Core ARM Cortex-R5 Real-Time Processing Unit (RPU)
For deterministic real-time control applications, the device integrates a dual-core ARM Cortex-R5 processor running at up to 533MHz. This RPU is ideal for safety-critical functions, motor control, sensor fusion, and time-sensitive industrial automation tasks requiring low-latency response times.
ARM Mali-400 MP2 Graphics Processing Unit (GPU)
The integrated ARM Mali-400 MP2 GPU operating at 600MHz provides hardware-accelerated graphics rendering capabilities. This enables smooth 2D/3D graphics for human-machine interfaces (HMI), display applications, and visual computing workloads without external graphics hardware.
Processing Unit Specifications Table
| Processing Unit |
Core Architecture |
Max Frequency |
| APU |
Quad ARM Cortex-A53 |
1.3 GHz |
| RPU |
Dual ARM Cortex-R5 |
533 MHz |
| GPU |
ARM Mali-400 MP2 |
600 MHz |
XCZU9EG-2FFVB1156E Programmable Logic Resources
The XCZU9EG-2FFVB1156E provides extensive programmable logic fabric for custom hardware acceleration and peripheral expansion. With 599,550 logic cells, designers can implement complex algorithms, custom interfaces, and hardware accelerators tailored to specific application requirements.
On-Chip Memory and Storage Options
The device features distributed on-chip memory including LUTRAM, Block RAM, and UltraRAM. This hierarchical memory architecture minimizes access latency and enables accelerators to achieve maximum performance. The localized memory structure also supports function isolation for safety-critical applications.
XCZU9EG-2FFVB1156E Target Applications
The XCZU9EG-2FFVB1156E Zynq UltraScale+ MPSoC is engineered for high-performance embedded applications across multiple industries:
Industrial Automation and IIoT
Advanced motor control systems, predictive maintenance platforms, industrial robotics, machine vision inspection systems, and Industrial Internet-of-Things (IIoT) edge computing nodes.
Automotive and ADAS Systems
Next-generation Advanced Driver Assistance Systems (ADAS), sensor fusion platforms, LiDAR processing, camera-based perception systems, and in-vehicle infotainment with real-time graphics.
Telecommunications and 5G Infrastructure
5G wireless base stations, software-defined radio (SDR), network packet processing, signal processing acceleration, and high-speed data communication systems.
Data Center and Cloud Computing
Hardware acceleration for AI/ML inference, video transcoding, data compression, network function virtualization (NFV), and smart storage controllers.
XCZU9EG-2FFVB1156E Development Tools and Software
AMD-Xilinx provides comprehensive development tools for the XCZU9EG-2FFVB1156E. The Vivado Design Suite offers synthesis, implementation, and debug capabilities for programmable logic development. The Vitis Unified Software Platform enables embedded software development and hardware acceleration workflows. PetaLinux provides a complete Linux distribution optimized for Zynq UltraScale+ devices.
XCZU9EG-2FFVB1156E Package and Ordering Information
| Attribute |
Value |
| Package Code |
FFVB1156 |
| Package Type |
Flip Chip Ball Grid Array (FCBGA) |
| Pin Count |
1156 Balls |
| Package Dimensions |
35mm x 35mm |
| Ball Pitch |
1.0mm |
| RoHS Status |
RoHS Compliant |
| Moisture Sensitivity |
MSL 3 |
XCZU9EG-2FFVB1156E Part Number Decoder
| Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| ZU |
Zynq UltraScale+ Family |
| 9 |
Device Size (9 = Mid-range capacity) |
| EG |
EG Variant (Quad APU + GPU) |
| -2 |
Speed Grade -2 (Medium Performance) |
| FFVB |
Flip Chip Fine-Pitch BGA Package |
| 1156 |
1156 Ball Count |
| E |
Extended Temperature Range (-40°C to +100°C) |
Related Zynq UltraScale+ MPSoC Products
For alternative configurations, consider these related Zynq UltraScale+ MPSoC devices:
| Part Number |
Key Difference |
| XCZU9EG-2FFVB1156I |
Industrial temp range (-40°C to +100°C) |
| XCZU7EV-2FFVC1156E |
EV variant with video codec |
| XCZU11EG-2FFVC1156E |
Higher logic capacity variant |
| XCZU6EG-2SBVB1156E |
Lower power, smaller logic capacity |
The XCZU9EG-2FFVB1156E represents AMD-Xilinx’s commitment to delivering high-performance, integrated solutions for next-generation embedded systems. With its powerful heterogeneous processing architecture and extensive programmable logic resources, this device enables engineers to create innovative solutions across industrial, automotive, telecommunications, and data center applications.
