Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-2FFVC900E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA – Complete Specifications & Features

Product Details

The XCZU9EG-2FFVC900E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family. This advanced FPGA integrates a powerful quad-core ARM Cortex-A53 processor with programmable logic, delivering exceptional computational performance for demanding embedded applications. Whether you’re developing 5G wireless systems, AI acceleration platforms, or industrial IoT solutions, the XCZU9EG-2FFVC900E provides the processing power and flexibility you need.


XCZU9EG-2FFVC900E Key Features and Benefits

The XCZU9EG-2FFVC900E combines the best of both worlds: a robust processing system (PS) with highly configurable programmable logic (PL). This heterogeneous architecture enables engineers to optimize performance across hardware and software domains simultaneously.

Integrated Multi-Core Processing System

The processing subsystem features a quad-core ARM Cortex-A53 MPCore running at up to 1.3GHz, providing substantial computational horsepower for complex software applications. Additionally, the dual-core ARM Cortex-R5 real-time processor operates at 600MHz, ensuring deterministic response times for safety-critical functions.

Advanced GPU Capabilities

Unlike CG-series devices, the EG variant includes an integrated ARM Mali-400 MP2 GPU. This graphics processing unit accelerates display rendering, image processing, and visualization tasks without consuming precious FPGA fabric resources.


XCZU9EG-2FFVC900E Technical Specifications

Parameter Specification
Part Number XCZU9EG-2FFVC900E
Manufacturer AMD (formerly Xilinx)
Family Zynq UltraScale+ MPSoC
Device Type EG (with GPU)
Package 900-FCBGA (31×31mm)
Ball Pitch 1.0mm
Speed Grade -2
Temperature Range Extended (0°C to +100°C)
Core Voltage (VCCINT) 0.85V
Process Technology 16nm FinFET+

Processing System (PS) Specifications

The XCZU9EG-2FFVC900E processing system delivers enterprise-grade computing capabilities in an embedded form factor.

Component Specification
Application Processor Quad-core ARM Cortex-A53 MPCore with CoreSight™
APU Clock Speed Up to 1.3GHz
Real-Time Processor Dual-core ARM Cortex-R5F with CoreSight™
RPU Clock Speed Up to 600MHz
Graphics Processor ARM Mali-400 MP2 @ 533MHz
L1 Cache (APU) 32KB Instruction / 32KB Data per core
L2 Cache 1MB Shared
Floating Point Single & Double Precision (NEON)

Programmable Logic (PL) Resources

The FPGA fabric of the XCZU9EG-2FFVC900E offers extensive programmable logic resources for implementing custom hardware accelerators, interfaces, and signal processing algorithms.

Resource Quantity
System Logic Cells 599,550
CLB Flip-Flops 548,160
Look-Up Tables (LUTs) 274,080
DSP Slices (DSP48E2) 2,520
Block RAM (36Kb each) 912 blocks
Total Block RAM 32.1Mb
Distributed RAM 8.8Mb
Global Clock Buffers 4

High-Speed Connectivity and I/O

The XCZU9EG-2FFVC900E provides extensive connectivity options for interfacing with external devices, memories, and high-speed serial links.

Transceiver Specifications

Transceiver Type Quantity Maximum Data Rate
PS-GTR 4 6.0 Gb/s
GTH (PL) 24 16.3 Gb/s

User I/O Banks

I/O Type Maximum Pins Voltage Range
High-Performance (HP) 208 1.0V – 1.8V
High-Density (HD) 120 1.2V – 3.3V
PS MIO 214 Multi-voltage

Integrated Peripheral Interfaces

The processing system includes numerous hardened peripherals, reducing FPGA resource consumption and simplifying system design.

Interface Details
DDR Memory Controller DDR4/LPDDR4 up to 2400 MT/s
PCIe Gen2 x4 or Gen1 x8
USB USB 2.0 (Host/Device/OTG)
Ethernet Gigabit Ethernet (RGMII/SGMII)
Display DisplayPort 1.2a
Storage SATA 3.1, SD/eMMC
Communication UART, SPI, I2C, CAN 2.0B
GPIO 32-bit General Purpose I/O
Timers Triple Timer Counters, Watchdog

XCZU9EG-2FFVC900E Applications

The versatile architecture of the XCZU9EG-2FFVC900E makes it ideal for numerous high-performance applications:

Wireless Communications

  • 5G Base Stations – High-throughput signal processing and beamforming
  • Software Defined Radio (SDR) – Flexible waveform implementation
  • Massive MIMO Systems – Parallel processing for antenna arrays

Automotive Systems

  • Advanced Driver Assistance Systems (ADAS) – Sensor fusion and object detection
  • In-Vehicle Infotainment (IVI) – Graphics rendering and multimedia
  • Autonomous Driving – Real-time decision making

Artificial Intelligence & Machine Learning

  • Edge AI Inference – Low-latency neural network acceleration
  • Computer Vision – Real-time image and video analytics
  • Deep Learning – CNN/DNN hardware implementation

Industrial and Medical

  • Industrial IoT Gateways – Protocol conversion and edge computing
  • Medical Imaging – Ultrasound, CT, and MRI processing
  • Test and Measurement – High-speed data acquisition

Package Information and Ordering

Attribute Value
Full Part Number XCZU9EG-2FFVC900E
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Dimensions 31mm × 31mm
Ball Count 900
Moisture Sensitivity Level MSL-3
RoHS Compliance Yes (Lead-Free)

Why Choose the XCZU9EG-2FFVC900E?

The XCZU9EG-2FFVC900E stands out in the Zynq UltraScale+ portfolio for several compelling reasons:

  1. Balanced Architecture – Optimal combination of processing power and FPGA resources for mid-range applications
  2. Integrated GPU – Hardware graphics acceleration without external components
  3. Extended Temperature – Reliable operation across industrial temperature ranges
  4. Footprint Compatibility – Migration path to other FFVC900 package devices
  5. Comprehensive Ecosystem – Full support in Vivado Design Suite and Vitis platforms

Development Tools and Support

AMD provides comprehensive development resources for the XCZU9EG-2FFVC900E:

  • Vivado Design Suite – Industry-leading FPGA design environment
  • Vitis Unified Software Platform – Embedded software and AI development
  • PetaLinux Tools – Linux OS customization and deployment
  • Reference Designs – Pre-verified designs for common applications

Related Products and Alternatives

Engineers evaluating the XCZU9EG-2FFVC900E may also consider these related devices within the Zynq UltraScale+ family:

Part Number Logic Cells DSP Slices Notes
XCZU9EG-1FFVC900E 599K 2,520 Lower speed grade (-1)
XCZU9EG-2FFVB1156E 599K 2,520 Larger package, more I/O
XCZU6EG-2FFVC900E 341K 1,973 Lower capacity alternative
XCZU15EG-2FFVC900E 747K 3,528 Higher capacity upgrade

Buy XCZU9EG-2FFVC900E and Xilinx FPGA Products

Looking for reliable Xilinx FPGA components? Our extensive inventory includes the XCZU9EG-2FFVC900E and other Zynq UltraScale+ MPSoC devices. We provide genuine AMD components with full traceability, competitive pricing, and technical support to help you succeed in your next embedded design project.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.